MT9J003
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52
Figure 53. HiSPi Eye Diagram for Both Clock and Data Signals
DATA MASK
80%
90%
t
RISE
V
diff
TxPostTxPre
t
FALL
UI/2UI/2
V
diff
CLOCK MASK
Trigger/Reference
CLKJITTER
Max V
diff
Table 32. HiSPi RISE AND FALL TIMES AT 480 MHz
(Measurement Conditions: PHY Supply 1.8 V, HiSPi Power Supply 0.8 V, Data Rate 480 MHz, DLL set to 0)
Parameter
Name Value Unit
Max Setup Time from Transmitter TxPRE 0.44 UI
Max Hold Time from Transmitter TxPost 0.44 UI
Rise Time t
t
RISE
350 ps
Fall Time t
t
FALL
350 ps
Output Impedance 66 Ω
Table 33. HiSPi RISE AND FALL TIMES AT 360 MHz
(Measurement Conditions: PHY Supply 1.8 V, HiSPi Power Supply 0.8 V, Data Rate 480 MHz, DLL set to 0)
Parameter
Name Value Unit
Max Setup Time from Transmitter TxPRE 0.48 UI
Max Hold Time from Transmitter TxPost 0.42 UI
Rise Time t
t
RISE
350 ps
Fall Time t
t
FALL
350 ps
Output Impedance 66 Ω
MT9J003
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53
Figure 54. HiSPi Skew Between Data Signals Within the PHY
tCHSKEW1PHY
Table 34. CHANNEL, PHY AND INTRA-PHY SKEW
(Measurement Conditions: PHY Supply 1.8 V, HiSPi Power Supply 0.8 V, Data Rate 480 MHz, DLL set to 0)
Data Lane Skew in Reference to Clock
tCHSKEW1PHY 150 ps
Table 35. CLOCK DLL STEPS
(Measurement Conditions: PHY Supply 1.8 V, HiSPi Power Supply 0.8 V, Data DLL set to 0)
Clock DLL Step
1 2 3 4 5 Step
Delay @ 480MHz 0.25 0.375 0.5 0.625 0.75 UI
Eye_opening@ 480 MHz 0.85 0.78 0.71 0.71 0.69 UI
Eye_opening@ 360 MHz 0.89 0.83 0.81 0.60 046 UI
1. The Clock DLL Steps 6 and 7 are not recommended by ON Semiconductor for the MT9J003 Rev. 2.
Table 36. DATA DLL STEPS
(Measurement Conditions: PHY Supply 1.8 V, HiSPi Power Supply 0.8 V, Clock DLL set to 0)
Data DLL Step
1 2 4 6 Step
Delay @ 480MHz 0.25 0.375 0.625 0.875 UI
Eye_opening@ 480 MHz 0.79 0.84 0.71 0.61 UI
Eye_opening@ 360 MHz 0.85 0.83 0.82 0.77 UI
1. The Data DLL Steps 3, 5, and 7 are not recommended by ON Semiconductor for the MT9J003 Rev. 2.
MT9J003
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(0, 2)
(1, 25)
1.4±0.5
0.725±0.075
10±0.075
5.082±0.075
5.014±0.075
10±0.075
47X 0.8±0.05
48X 0.4±0.05
0.525±0.05
7.5±0.10
CTR
Optical Center
8
Optical Area
7
First Clear Pixel
(4.589 CTR)
(6.413 CTR)
(0.125)
Encapsulant
2
Substrate
3
Lid
4
Image sensor die
6
3.85
0.7 Typ.
7.7
7.7
3.85
4.5
9
0.7 Typ.
4.2
4.5
8±0.10
CTR
Section A A
Seating plane
A
0.1
A
0.1
A
C
A0.15 CB
A0.15 CB
A0.15 CB
Figure 55. Package Mechanical Drawing (CASE 847AK)
1. Dimensions in mm. Dimensions in () are for reference only.
2. Encapsulant: Epoxy
3. Substrate material: Plastic laminate 0.5 thickness
4. List material: Borosilicate glass 0.4 thickness. Refractive index at 20
°C = 1.5255 @ 546 nm and 1.5231 @ 588 nm.
5. Lead finish: Gold plating, 0.5 microns minimum thickness.
6. Image sensor die 0.2 thickness.
7. Maximum rotation of optical area relative to seating plane A: 25 microns.
Maximum tilt of optical area relative to top of cover glass: 20 microns.
Maximum tilt of optical area relative to top of cover glass: 50 microns.
8. Die center = package center; optical center offset from package center: X = 0.01356, Y = 0.081705
Notes:

MT9J003I12STMUH-GEVB

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Optical Sensor Development Tools 10 MP NAVITAR
Lifecycle:
New from this manufacturer.
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