ADV7283 Data Sheet
Rev. A | Page 8 of 21
ABSOLUTE MAXIMUM RATINGS
Table 6.
A
VDD
to GND 2.2 V
D
VDD
to GND 2.2 V
P
VDD
to GND 2.2 V
D
VDDIO
to GND 4 V
P
VDD
to D
VDD
−0.9 V to +0.9 V
A
VDD
to D
VDD
−0.9 V to +0.9 V
Digital Inputs (
RESET
, ALSB,
SDATA, SCLK,
PWRDWN
)
Voltage
GND − 0.3 V to D
VDDIO
+ 0.3 V
Digital Outputs (P7 to P0,
INTRQ
, LLC) Voltage
GND − 0.3 V to D
VDDIO
+ 0.3 V
Analog Inputs (X TA LN , A
IN
A
IN
6) to Ground
GND − 0.3 V to A
VDD
+ 0.3 V
Maximum Junction Temperature
(T
J
max)
140°C
Storage Temperature Range −65°C to +150°C
1
The absolute maximum ratings assume that the DGND pins and the exposed
pad of the ADV7283 are connected together to a common ground plane
(GND). This is part of the recommended layout scheme. See the PCB Layout
Recommendations section for more information. The absolute maximum
ratings are stated in relation to this common ground plane.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
The thermal resistance values in Table 7 are specified for the
device soldered onto a 4-layer printed circuit board (PCB) with
a common ground plane (GND) and with the exposed pad of
the device connected to DGND. The values in Table 7 are
maximum values.
Table 7. Thermal Resistance for the 32-Lead LFCSP
Thermal Characteristic Symbol Value Unit
Junction to Ambient Thermal
Resistance (Still Air)
θ
JA
32.5 °C/W
Junction to Case Thermal
Resistance
θ
JC
2.3 °C/W
ESD CAUTION