© 2009 Microchip Technology Inc. Preliminary DS22131C-page 1
25LC080C 25LC320A
25LC080D 25LC640A
25LC160C 25LC128
25LC160D 25LC256
Features:
Max. Clock 5 MHz
Low-power CMOS Technology:
- Max. Write Current: 5 mA at 5.5V, 5 MHz
- Read Current: 5 mA at 5.5V, 5 MHz
- Standby Current: 10 μA at 5.5V
1024 x 8 through 32768 x 8-bit Organization
Byte and Page-level Write Operations
Self-timed Erase and Write Cycles (6 ms max.)
Block Write Protection:
- Protect none, 1/4, 1/2 or all of array
Built-in Write Protection:
- Power-on/off data protection circuitry
- Write enable latch
- Write-protect pin
Sequential Read
High Reliability:
- Endurance: >1M erase/write cycles
- Data retention: > 200 years
- ESD protection: > 4000V
Temperature Range Supported:
Package is Pb-free and RoHS Compliant
Pin Function Table
Description:
Microchip Technology Inc. 25LCXXX* devices are Mid-
density 8 through 256 Kbit Serial Electrically Erasable
PROMs (EEPROM). The devices are organized in
blocks of x8-bit memory and support the Serial Periph-
eral Interface (SPI) compatible serial bus architecture.
Byte-level and page-level functions are supported.
The bus signals required are a clock input (SCK) plus
separate data in (SI) and data out (SO) lines. Access to
the device is controlled through a Chip Select (CS
)
input.
Communication to the device can be paused via the
hold pin (HOLD
). While the device is paused, transi-
tions on its inputs will be ignored, with the exception of
Chip Select, allowing the host to service higher priority
interrupts.
The 25LCXXX is available in a standard 8-lead SOIC
package. The package is Pb-free.
Package Types (not to scale)
- Extended (H): -40°C to +150°C
Name Function
CS
Chip Select Input
SO Serial Data Output
WP
Write-Protect
V
SS Ground
SI Serial Data Input
SCK Serial Clock Input
HOLD
Hold Input
V
CC Supply Voltage
CS
SO
WP
V
SS
1
2
3
4
8
7
6
5
V
CC
HOLD
SCK
SI
SOIC
(SN)
8K-256K SPI Serial EEPROM High Temp Family Data Sheet
*25LCXXX is used in this document as a generic part number for the 25 series devices.
25LCXXX
DS22131C-page 2 Preliminary © 2009 Microchip Technology Inc.
Device Selection Table
Part Number
Density
(bits)
Organization V
CC Range
Max Speed
(MHz)
Page Size
(Bytes)
Temp.
Range
Package
25LC080C 8K 1,024 x 8 2.5V - 5.5V 5 16 H SN
25LC080D 8K 1,024 x 8 2.5V - 5.5V 5 32 H SN
25LC160C 16K 2,048 x 8 2.5V - 5.5V 5 16 H SN
25LC160D 16K 2,048 x 8 2.5V - 5.5V 5 32 H SN
25LC320A 32K 4,096 x 8 2.5V - 5.5V 5 32 H SN
25LC640A 64K 8,192 x 8 2.5V - 5.5V 5 32 H SN
25LC128 128K 16,384 x 8 2.5V - 5.5V 5 64 H SN
25LC256 256K 32,768 x 8 2.5V - 5.5V 5 64 H SN
© 2009 Microchip Technology Inc. Preliminary DS22131C-page 3
25LCXXX
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
(†)
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. V
SS ..........................................................................................................-0.6V to VCC +1.0V
Storage temperature .................................................................................................................................-65°C to 155°C
Ambient temperature under bias........................................................................................................... -40°C to 150°C
(1)
ESD protection on all pins..........................................................................................................................................4 kV
TABLE 1-1: DC CHARACTERISTICS
Note 1: AEC-Q100 reliability testing for devices intended to operate at 150°C is 1,000 hours. Any design in which
the total operating time between 125°C and 150°C will be greater than 1,000 hours is not warranted with-
out prior written approval from Microchip Technology Inc.
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an
extended period of time may affect device reliability.
DC CHARACTERISTICS
Extended (H): T
A = -40°C to +150°C VCC = 2.5V to 5.5V
Param.
No.
Sym. Characteristic Min. Max. Units Test Conditions
D001 V
IH1 High-level input
voltage
.7 VCC VCC+1 V
D002 V
IL1 Low-level input
voltage
-0.3 0.3VCC VVCC2.7V
D003 V
IL2 -0.3 0.2VCC VVCC < 2.7V
D004 VOL1 Low-level output
voltage
—0.4VIOL = 2.1 mA
D005 VOL2 —0.2VIOL = 1.0 mA
D006 V
OH High-level output
voltage
VCC -0.5 V IOH = -400 μA
D007 I
LI Input leakage current ±2 μACS = VCC, VIN = VSS OR VCC
D008 ILO Output leakage
current
—±2μACS = VCC, VOUT = VSS OR VCC
D009 CINT Internal Capacitance
(all inputs and
outputs)
—7pFTA = 25°C, CLK = 1.0 MHz,
V
CC = 5.0V (Note)
D010 I
CC Read
Operating Current
5
2.5
mA
mA
VCC = 5.5V; FCLK = 5.0 MHz;
SO = Open
V
CC = 2.5V; FCLK = 3.0 MHz;
SO = Open
D011 I
CC Write
5
3
mA
mA
VCC = 5.5V
V
CC = 2.5V
D012 I
CCS Standby Current 10 μACS = VCC = 5.5V, Inputs tied to VCC or
V
SS, 150°C
Note: This parameter is periodically sampled and not 100% tested.

25LC256T-H/SN

Mfr. #:
Manufacturer:
Microchip Technology
Description:
EEPROM 256K, 32K X 8, 2.5V SER EE 150C
Lifecycle:
New from this manufacturer.
Delivery:
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