STMPE801MTR Datasheet STMPE801MTR, STMPE801QTR | P19-P21

STMPE801 Package mechanical data

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9 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect . The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com

Package mechanical data STMPE801

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Figure 6. Package dimensions

Table 17. QFN16L mechanical data

Dim.

mm. inch

Min Typ Max Min Typ Max

A 0.45 0.55 0.60 0.020 0.022 0.024

A1 0.02 0.05 0.001 0.002

b 0.15 0.20 0.25 0.006 0.008 0.010

D 2.50 2.60 2.70 0.098 0.102 0.106

E 1.70 1.80 1.90 0.067 0.071 0.075

e 0.40 0.016

L 0.35 0.40 0.45 0.014 0.016 0.018

STMPE801 Package mechanical data

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Figure 7. Footprint recommendation

Figure 8. Marking

A: Device Marking (525)

B: Dot

Mfr. #:

Manufacturer:

STMicroelectronics

Description:

Interface - I/O Expanders 8B port expander Xpander logic

Lifecycle:

New from this manufacturer.

Delivery:

DHL FedEx Ups TNT EMS

Payment:

T/T Paypal Visa MoneyGram Western Union

STMPE801MTR