MAX1217
1.8V, Dual, 12-Bit, 125Msps ADC for
Broadband Applications
16 ______________________________________________________________________________________
by output switching currents, which can couple into the
analog supply network. Isolate analog and output sup-
plies (AV
CC
and OV
CC
) where they enter the PC board
with separate networks of ferrite beads and capacitors to
their corresponding grounds (AGND, OGND).
To achieve optimum performance, provide each supply
with a separate network of 47µF tantalum capacitor and
parallel combination of 10µF and 1µF ceramic capaci-
tors. Additionally, the ADC requires each supply input
to be bypassed with a separate 0.1µF ceramic capaci-
tor (Figure 10). Locate these capacitors directly at the
ADC supply inputs or as close as possible to the
MAX1217. Choose surface-mount capacitors, whose
preferred location is on the same side as the converter
to save space and minimize inductance. If close place-
ment on the same side is not possible, route these
bypassing capacitors through vias to the bottom side of
the PC board.
Multilayer boards with separate ground and power
planes produce the highest level of signal integrity. Use
a split ground plane arranged to match the physical
location of the analog and output grounds on the ADC’s
package. Join the two ground planes at a single point
so the noisy output ground currents do not interfere
with the analog ground plane. Dynamic currents travel-
ing long distances before reaching ground cause large
and undesirable ground loops. Ground loops can
degrade the input noise by coupling back to the analog
front-end of the converter, resulting in increased spurious
activity, leading to decreased noise performance.
All AGND connections could share the same ground
plane, if the ground plane is sufficiently isolated from
any noisy, output systems ground. To minimize the cou-
pling of the output signals from the analog input, segre-
gate the output bus carefully from the analog input
circuitry. To further minimize the effects of output noise
coupling, position ground return vias throughout the lay-
out to divert output switching currents away from the
sensitive analog sections of the ADC. This approach
does not require split ground planes, but can be accom-
MAX1217
REFERENCE
BUFFER
ADC FULL SCALE = REFTA/B - REFBA/B
1V
AV
CC
AV
CC
/ 2 AV
CC
AV
CC
/ 2
G
CONTROL LINE
TO DISABLE
REFERENCE BUFFER
REFERENCE-
SCALING
AMPLIFIER
REFA/B
REFADJA/B
REFA/B
REFADJA/B
13k
Ω
TO
1M
Ω
0.1
μ
F
REFTA/B
REFBA/B
MAX1217
REFERENCE
BUFFER
ADC FULL SCALE = REFTA/B - REFBA/B
1V
G
CONTROL LINE
TO DISABLE
REFERENCE BUFFER
REFERENCE-
SCALING
AMPLIFIER
0.1
μ
F
13k
Ω
TO
1M
Ω
REFTA/B
REFBA/B
Figure 6a. Circuit Suggestions to Adjust the ADC’s Full-Scale Range
1.14
1.18
1.16
1.22
1.20
1.26
1.24
1.28
1.32
1.30
1.34
0 200 300100 400 500 600 800700 900 1000
FS VOLTAGE vs. ADJUST RESISTOR
FS ADJUST RESISTOR (k
Ω
)
V
FS
(V)
RESISTOR VALUE APPLIED BETWEEN
REFADJA/REFADJB AND REFA/REFB
INCREASES V
FS
RESISTOR VALUE APPLIED BETWEEN
REFADJA/REFADJB AND AGND
DECREASES V
FS
Figure 6b. FS Adjustment Range vs. FS Adjustment Resistor
MAX1217
1.8V, Dual, 12-Bit, 125Msps ADC for
Broadband Applications
______________________________________________________________________________________ 17
plished by placing substantial ground connections
between the analog front-end and the digital outputs.
The MAX1217 is packaged in a 100-pin TQFP-EP pack-
age (package code: C100E-6), providing greater
design flexibility, increased thermal dissipation, and
optimized AC performance of the ADC. The exposed
paddle (EP) must be soldered to AGND.
The data converter die is attached to an EP lead frame
with the back of this frame exposed to the package
bottom surface, facing the PC board side of the pack-
age. This allows a solid attachment of the package to
the board with standard infrared (IR) flow soldering
techniques.
0.1
μ
F
0.1
μ
F
0.1
μ
F
0.1
μ
F
SINGLE-ENDED
INPUT TERMINAL
50
Ω
50
Ω
CLKN CLKP
8
181
19
12 1014
16
15
9
510
Ω
50
Ω
510
Ω
V
CLK
0.1
μ
F
MAX9388
INAP/INBP
INAN/INBN
AGND
AV
CC
OV
CC
MAX1217
DB0P/N–DB11P/N, ORBP/N
12
DA0P/N–DA11P/N, ORAP/N
12
OGND
50
Ω
Figure 7. Differential, AC-Coupled, LVPECL-Compatible Clock Input Configuration
24.9
Ω
24.9
Ω
0.1
μ
F
ADT1-1WT
ADT1-1WT
10
Ω
10
Ω
SINGLE-ENDED
INPUT TERMINAL
0.1
μ
F0.1
μ
F
INAP/INBP
INAN/INBN
AGND
AV
CC
OV
CC
MAX1217
DB0P/N–DB11P/N,
ORBP/N
12
DA0P/N–DA11P/N,
ORAP/N
12
OGND
Figure 8. Analog Input Configuration with Back-to-Back Transformers and Secondary-Side Termination
MAX1217
1.8V, Dual, 12-Bit, 125Msps ADC for
Broadband Applications
18 ______________________________________________________________________________________
Thermal efficiency is one of the factors for selecting a
package with an exposed paddle for the MAX1217.
The exposed paddle improves thermal efficiency and
ensures a solid ground connection between the ADC
and the PC board’s analog ground layer.
Route the digital output traces for a high-speed, high-
resolution data converter with care. Keep trace lengths
at a minimum and place minimal capacitive loading,
less than 5pF, on any digital trace to prevent coupling
to sensitive analog sections of the ADC. Run the LVDS
output traces as differential lines with 100Ω characteris-
tic impedance from the ADC to the LVDS load device.
Static Parameter Definitions
Integral Nonlinearity (INL)
Integral nonlinearity is the deviation of the values on an
actual transfer function from a straight line. This straight
line can be either a best-straight-line fit or a line drawn
between the end points of the transfer function, once
offset and gain errors have been nullified. However,
the static linearity parameters for the MAX1217 are
measured using the histogram method with a 10MHz
input frequency.
Differential Nonlinearity (DNL)
Differential nonlinearity is the difference between an
actual step width and the ideal value of 1 LSB. A DNL
AGND
NOTE: EACH POWER-SUPPLY PIN
(ANALOG, OUTPUT) SHOULD BE
DECOUPLED WITH AN INDIVIDUAL 0.1
μ
F
CAPACITOR CLOSE TO THE ADC.
BYPASSING—ADC LEVEL
BYPASSING—BOARD LEVEL
ANALOG POWER-
SUPPLY SOURCE
1
μ
F
10
μ
F47
μ
F
AV
CC
OV
CC
MAX1217
AV
CC
DB0P/N–DB11P/N, ORBP/N
12
DA0P/N–DA11P/N, ORAP/N
12
OGND
0.1
μ
F
0.1
μ
F
OUTPUT-DRIVER
POWER-SUPPLY
SOURCE
1
μ
F
10
μ
F47
μ
F
OV
CC
Figure 10. Grounding, Bypassing, and Decoupling Recommendations for the MAX1217
INAP/INBP
49.9
Ω
24.9
Ω
INAN/INBN
0.1
μ
F
SINGLE-ENDED
INPUT TERMINAL
0.1
μ
F
AGND
AV
CC
OV
CC
MAX1217
DB0P/N–DB11P/N, ORBP/N
12
DA0P/N–DA11P/N, ORAP/N
12
OGND
Figure 9. Single-Ended AC-Coupled Analog Input Configuration

MAX1217ECQ+D

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Analog to Digital Converters - ADC
Lifecycle:
New from this manufacturer.
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