LTC3728L/LTC3728LX
16
3728lxff
Figure 1 on the first page is a basic LTC3728L/LTC3728LX
application circuit. External component selection is driven
by the load requirement, and begins with the selection of
R
SENSE
and the inductor value. Next, the power MOSFETs
and D1 are selected. Finally, C
IN
and C
OUT
are selected.
The circuit shown in Figure 1 can be configured for
operation up to an input voltage of 28V (limited by the
external MOSFETs).
R
SENSE
Selection for Output Current
R
SENSE
is chosen based on the required output current. The
current comparator has a maximum threshold of 75mV/
R
SENSE
and an input common mode range of SGND to
1.1(INTV
CC
). The current comparator threshold sets the
peak of the inductor current, yielding a maximum average
output current I
MAX
equal to the peak value less half the
peak-to-peak ripple current, ΔI
L
.
Allowing a margin for variations in the IC and external
component values yields:
R
SENSE
=
50mV
I
MAX
Because of possible PCB layout-induced noise in the
current sensing loop, the AC current sensing ripple of
ΔV
SENSE
= ΔI R
SENSE
also needs to be checked in the
design to get good signal-to-noise ratio. In general, for
a reasonably good PCB layout, a 15mV ΔV
SENSE
voltage
is recommended as a conservative design starting point.
When using the controller in very low dropout conditions,
the maximum output current level will be reduced due to the
internal compensation required to meet stability criterion
for buck regulators operating at greater than 50% duty
factor. A curve is provided to estimate this reduction in
peak output current level depending upon the operating
duty factor.
Operating Frequency
The IC uses a constant-frequency, phase-lockable ar-
chitecture with the frequency determined by an internal
capacitor. This capacitor is charged by a fixed current plus
an additional current which is proportional to the voltage
applied to the PLLFLTR pin. Refer to Phase-Locked Loop
applicaTions inForMaTion
Figure 5. PLLFLTR Pin Voltage vs Frequency
and Frequency Synchronization in the Applications Infor-
mation section for additional information.
A graph for the voltage applied to the PLLFLTR pin vs
frequency is given in Figure 5. As the operating frequency
is increased the gate charge losses will be higher, reducing
efficiency (see Efficiency Considerations). The maximum
switching frequency is approximately 550kHz.
Inductor Value Calculation
The operating frequency and inductor selection are inter-
related in that higher operating frequencies allow the use
of smaller inductor and capacitor values. So why would
anyone ever choose to operate at lower frequencies with
larger components? The answer is efficiency. A higher
frequency generally results in lower efficiency because
of MOSFET gate charge losses. In addition to this basic
trade-off, the effect of inductor value on ripple current and
low current operation must also be considered.
The inductor value has a direct effect on ripple current.
The inductor ripple current ΔI
L
decreases with higher
inductance or frequency and increases with higher V
IN
:
I
L
=
1
(f)(L)
V
OUT
1
V
OUT
V
IN
Accepting larger values of ΔI
L
allows the use of low in-
ductances, but results in higher output voltage ripple and
greater core losses. A reasonable starting point for setting
ripple current is ΔI = 30% of maximum output current or
higher for good load transient response and sufficient
ripple current signal in the current loop.
OPERATING FREQUENCY (kHz)
200 300 400 500 600
PLLFLTR PIN VOLTAGE (V)
3728 F05
2.5
2.0
1.5
1.0
0.5
0
LTC3728L/LTC3728LX
17
3728lxff
applicaTions inForMaTion
The inductor value also has secondary effects. The tran-
sition to Burst Mode operation begins when the average
inductor current required results in a peak current below
25% of the current limit determined by R
SENSE
. Lower
inductor values (higher ΔI
L
) will cause this to occur at
lower load currents, which can cause a dip in efficiency in
the upper range of low current operation. In Burst Mode
operation, lower inductance values will cause the burst
frequency to decrease.
Inductor Core Selection
Once the value for L is known, the type of inductor must
be selected. High efficiency converters generally cannot
afford the core loss found in low cost powdered iron cores,
forcing the use of more expensive ferrite, molypermalloy,
or Kool Mµ
®
cores. Actual core loss is independent of core
size for a fixed inductor value, but it is very dependent
on inductance selected. As inductance increases, core
losses go down. Unfortunately, increased inductance
requires more turns of wire and, therefore, copper losses
will increase.
Ferrite designs have very low core loss and are preferred
at high switching frequencies, so design goals can con-
centrate on copper loss and preventing saturation. Ferrite
core material saturates hard, which means that induc-
tance collapses abruptly when the peak design current is
exceeded. This results in an abrupt increase in inductor
ripple current and consequent output voltage ripple. Do
not allow the core to saturate!
Molypermalloy (from Magnetics, Inc.) is a very good, low
loss core material for toroids, but it is more expensive
than ferrite. A reasonable compromise from the same
manufacturer is Kool Mµ. Toroids are very space efficient,
especially when using several layers of wire. Because
they generally lack a bobbin, mounting is more difficult.
However, designs for surface mount are available that do
not increase the height significantly.
Power MOSFET and D1 Selection
Two external power MOSFETs must be selected for each
controller in the LTC3728L/LTC3728LX: One N-channel
MOSFET for the top (main) switch, and one N-channel
MOSFET for the bottom (synchronous) switch.
The peak-to-peak drive levels are set by the INTV
CC
voltage. This voltage is typically 5V during start-up
(see EXTV
CC
Pin Connection). Consequently, logic-level
threshold MOSFETs must be used in most applications.
The only exception is if low input voltage is expected (V
IN
< 5V); then, sublogic level threshold MOSFETs (V
GS(TH)
< 3V) should be used. Pay close attention to the BV
DSS
specification for the MOSFETs as well; most of the logic
level MOSFETs are limited to 30V or less.
Selection criteria for the power MOSFETs include the
on-resistance R
DS(ON)
, Miller capacitance C
MILLER
, input
voltage and maximum output current. Miller capacitance,
C
MILLER
, can be approximated from the gate charge curve
usually provided on the MOSFET manufacturers’ data
sheet. C
MILLER
is equal to the increase in gate charge
along the horizontal axis while the curve is approximately
flat divided by the specified change in V
DS
. This result is
then multiplied by the ratio of the application applied V
DS
to the gate charge curve specified V
DS
. When the IC is
operating in continuous mode the duty cycles for the top
and bottom MOSFETs are given by:
Main SwitchDuty Cycle =
V
OUT
V
IN
Synchronous Switch Duty Cycle =
V
IN
V
OUT
V
IN
The MOSFET power dissipations at maximum output
current are given by:
P
MAIN
=
OUT
V
IN
I
MAX
( )
2
1+ d
( )
R
DS(ON)
+
V
IN
( )
2
I
MAX
2
R
DR
( )
C
MILLER
( )
1
V
INTVCC
V
THMIN
+
1
V
THMIN
f
( )
P
SYNC
=
V
IN
V
OUT
V
IN
I
MAX
( )
2
1+ d
( )
R
DS(ON)
LTC3728L/LTC3728LX
18
3728lxff
applicaTions inForMaTion
where d is the temperature dependency of R
DS(ON)
and
R
DR
(approximately 4Ω) is the effective driver resistance
at the MOSFETs Miller threshold voltage. V
TH(MIN)
is the
typical MOSFET minimum threshold voltage.
Both MOSFETs have I
2
R losses while the topside N-channel
equation includes an additional term for transition losses,
which are highest at high input voltages. For V
IN
< 20V
the high current efficiency generally improves with larger
MOSFETs, while for V
IN
> 20V the transition losses rapidly
increase to the point that the use of a higher R
DS(ON)
device
with lower C
MILLER
actually provides higher efficiency. The
synchronous MOSFET losses are greatest at high input
voltage when the top switch duty factor is low or during
a short-circuit when the synchronous switch is on close
to 100% of the period.
The term (1 + d) is generally given for a MOSFET in the
form of a normalized R
DS(ON)
vs Temperature curve, but
d = 0.005/°C can be used as an approximation for low
voltage MOSFETs.
The Schottky diode, D1, shown in Figure 1 conducts during
the dead time between the conduction of the two power
MOSFETs. This prevents the body diode of the bottom
MOSFET from turning on, storing charge during the dead
time and requiring a reverse-recovery period that could
cost as much as 3% in efficiency at high V
IN
. A 1A to 3A
Schottky is generally a good compromise for both regions
of operation due to the relatively small average current.
Larger diodes result in additional transition losses due to
their larger junction capacitance.
C
IN
and C
OUT
Selection
The selection of C
IN
is simplified by the multiphase ar-
chitecture and its impact on the worst-case RMS current
drawn through the input network (battery/fuse/capacitor).
It can be shown that the worst-case RMS current occurs
when only one controller is operating. The controller
with the highest (V
OUT
)(I
OUT
) product needs to be used
in the subsequent formula to determine the maximum
RMS current requirement. Increasing the output current,
drawn from the other out-of-phase controller, will actually
decrease the input RMS ripple current from this maximum
value (see Figure 4). The out-of-phase technique typically
reduces the input capacitors RMS ripple current by a
factor of 30% to 70% when compared to a single phase
power supply solution.
The type of input capacitor, value and ESR rating have
efficiency effects that need to be considered in the selec-
tion process. The capacitance value chosen should be
sufficient to store adequate charge to keep high peak
battery currents down. 20µF to 40µF is usually sufficient
for a 25W output supply operating at 200kHz. The ESR of
the capacitor is important for capacitor power dissipation
as well as overall battery efficiency. All of the power (RMS
ripple current • ESR) not only heats up the capacitor but
wastes power from the battery.
Medium voltage (20V to 35V) ceramic, tantalum, OS-CON
and switcher-rated electrolytic capacitors can be used
as input capacitors, but each has drawbacks: ceramic
voltage coefficients are very high and may have audible
piezoelectric effects; tantalums need to be surge-rated;
OS-CONs suffer from higher inductance, larger case size
and limited surface-mount applicability; electrolytics’
higher ESR and dryout possibility require several to be
used. Multiphase systems allow the lowest amount of
capacitance overall. As little as one 22µF or two to three
10µF ceramic capacitors are an ideal choice in a 20W to
35W power supply due to their extremely low ESR. Even
though the capacitance at 20V is substantially below their
rating at zero-bias, very low ESR loss makes ceramics
an ideal candidate for highest efficiency battery operated
systems. Also consider parallel ceramic and high quality
electrolytic capacitors as an effective means of achieving
ESR and bulk capacitance goals.
In continuous mode, the source current of the top N-channel
MOSFET is a square wave of duty cycle V
OUT
/V
IN
. To prevent
large voltage transients, a low ESR input capacitor sized
for the maximum RMS current of one channel must be
used. The maximum RMS capacitor current is given by:
C
IN
RequiredI
RMS
I
MAX
V
OUT
V
IN
V
OUT
( )
1/2
V
IN
This formula has a maximum at V
IN
= 2V
OUT
, where I
RMS
= I
OUT
/2. This simple worst-case condition is commonly
used for design because even significant deviations do not
offer much relief. Note that capacitor manufacturers ripple

LTC3728LEGN#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 2x, 550kHz, 2-PhSync Regs
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union