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ZL30110LDG1

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P22
ZL30110 Data Sheet
13
Zarlink Semiconductor Inc.
6.2.2 Crystal Oscillator
Alternatively, a Crystal Oscillator may be used. The accuracy of a crystal oscillator depends on the crystal tolerance
as well as the load capacitance tolerance. Typically, for a 25 MHz crystal specified with a 32 pF load capacitance,
each 1 pF change in load capacitance contributes approximately 9 ppm to the frequency deviation. Consequently,
capacitor tolerances and stray capacitances have a major effect on the accuracy of the oscillator frequency.
The crystal should be a fundamental mode type - not an overtone. The fundamental mode crystal permits a simpler
oscillator circuit with no additional filter components and is less likely to generate spurious responses. A typical
crystal oscillator specification is shown in Table 2.
.
1 Frequency 25 MHz
2 Tolerance as required (better than +/-50ppm)
3 Oscillation mode fundamental
4 Resonance mode parallel
5 Load capacitance as required
6 Maximum series resistance 50 Ω
Table 2 - Crystal Oscillator Specification
ZL30110 Data Sheet
14
Zarlink Semiconductor Inc.
6.3 Power Up Sequence
The ZL30110 requires that the 3.3 V supply is not powered up after the 1.8 V supply. This is to prevent the risk of
latch-up due to the presence of protection diodes in the IO pads.
Two options are given:
1. Power-up the 3.3 V supply fully first, then power up the 1.8 V supply
2. Power up the 3.3 V supply and the 1.8 V supply simultaneously, ensuring that the 3.3 V supply is never lower
than a few hundred millivolts below the 1.8 V supply (e.g., by using a schottky diode or controlled slew rate)
6.4 Reset Circuit
A simple power up reset circuit with about a 60 μs reset low time is shown in Figure 6. Resistor R
P
is for protection
only and limits current into the RST
pin during power down conditions. The reset low time is not critical but should
be greater than 300 ns.
Figure 6 - Power-Up Reset Circuit
ZL30110 Data Sheet
15
Zarlink Semiconductor Inc.
7.0 Characteristics
7.1 AC and DC Electrical Characteristics
* Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied.
* Voltages are with respect to ground (GND) unless otherwise stated.
* Voltages are with respect to ground (GND) unless otherwise stated.
Absolute Maximum Ratings*
Parameter Symbol Min. Max. Units
1 Supply voltage V
DD_R
-0.5 4.6 V
2 Core supply voltage V
CORE_R
-0.5 2.5 V
3 Voltage on any digital pin V
PIN
-0.5 6 V
4 Voltage on OSCi and OSCo pin V
OSC
-0.3 V
DD
+ 0.3 V
5 Current on any pin I
PIN
30 mA
6 Storage temperature T
ST
-55 125 °C
7ESD rating V
ESD
2k V
Recommended Operating Conditions*
Characteristics Sym. Min. Typ. Max. Units
1 Supply voltage V
DD
3.1 3.3 3.5 V
2 Core supply voltage V
CORE
1.7 1.8 1.9
V
3 Operating temperature T
A
-40 25 85 °C
4 Input Voltage V
I
03.33.5 V
DC Electrical Characteristics*
Characteristics Sym. Min. Max. Units Notes
1
Supply current
I
DD
115 mA All Outputs loaded
with 30 pf
2 Core supply current I
CORE
20 mA All Outputs loaded
with 30 pf
3 Schmitt trigger Low to High threshold
point
V
CIH
1.43 1.85 V
4 Schmitt trigger High to Low threshold
point
V
CIL
0.8 1.1 V
5 Input leakage current I
IL
-105 105 µA V
I
=V
DD
or 0 V
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P22

ZL30110LDG1

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