19
LTC3776
3776fa
frequency, when there is a clock signal applied to SYNC/
SSEN, is shown in Figure 9 and specified in the Electrical
Characteristics table. Note that the LTC3776 can only be
synchronized to an external clock whose frequency is
within range of the LTC3776’s internal VCO, which is
nominally 200kHz to 1MHz. This is guaranteed, over
temperature and process variations, to be between 250kHz
and 850kHz. A simplified block diagram is shown in
Figure 10.
If the external clock frequency is greater than the internal
oscillator’s frequency, f
OSC
, then current is sourced con-
tinuously from the phase detector output, pulling up the
PLLLPF pin. When the external clock frequency is less
than f
OSC
, current is sunk continuously, pulling down the
PLLLPF pin. If the external and internal frequencies are the
same but exhibit a phase difference, the current sources
turn on for an amount of time corresponding to the phase
difference. The voltage on the PLLLPF pin is adjusted until
the phase and frequency of the internal and external
APPLICATIO S I FOR ATIO
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PLLLPF PIN VOLTAGE (V)
0
0
FREQUENCY (kHz)
0.5 1 1.5 2
3776 F09
2.4
200
400
600
800
1000
1200
1400
Figure 9. Relationship Between Oscillator Frequency and Voltage
at the PLLLPF Pin When Synchronizing to an External Clock
DIGITAL
PHASE/
FREQUENCY
DETECTOR
OSCILLATOR
2.4V
R
LP
C
LP
3776 F10
PLLLPF
EXTERNAL
OSCILLATOR
SYNC/
SSEN
Figure 10. Phase-Locked Loop Block Diagram
oscillators are identical. At the stable operating point, the
phase detector output is high impedance and the filter
capacitor C
LP
holds the voltage.
The loop filter components, C
LP
and R
LP
, smooth out the
current pulses from the phase detector and provide a
stable input to the voltage-controlled oscillator. The filter
components C
LP
and R
LP
determine how fast the loop
acquires lock. Typically R
LP
= 10k and C
LP
is 2200pF to
0.01μF.
Typically, the external clock (on SYNC/SSEN pin) input high
threshold is 1.6V, while the input low threshold is 1.2V.
Table 2 summarizes the different states in which the
PLLLPF pin can be used.
Table 2
PLLLPF PIN SYNC/SSEN PIN FREQUENCY
0V GND 300kHz
Floating GND 550kHz
V
IN
GND 750kHz
RC Loop Filter Clock Signal Phase-Locked to External Clock
Capacitor to V
IN
Spread Spectrum Operation
GND 450kHz to 550kHz
Low Supply Operation
Although the LTC3776 can function down to below 2.4V,
the maximum allowable output current is reduced as V
IN
decreases below 3V. Figure 11 shows the amount of
change as the supply is reduced down to 2.4V. Also shown
is the effect on V
REF
.
INPUT VOLTAGE (V)
75
NORMALIZED VOLTAGE OR CURRENT (%)
85
95
105
80
90
100
2.2 2.4 2.6 2.8
3776 F11
3.02.12.0 2.3 2.5 2.7 2.9
V
REF
MAXIMUM
SENSE VOLTAGE
Figure 11. Line Regulation of V
REF
and
Maximum Sense Voltage for Low Input Supply
20
LTC3776
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Minimum On-Time Considerations
Minimum on-time, t
ON(MIN)
,
is the smallest amount of time
in which the LTC3776 is capable of turning the top P-channel
MOSFET on and then off. It is determined by internal
timing delays and the gate charge required to turn on the
top MOSFET. Low duty cycle and high frequency applica-
tions may approach the minimum on-time limit and care
should be taken to ensure that:
t
V
fV
ON MIN
OUT
OSC IN
()
<
If the duty cycle falls below what can be accommodated
by the minimum on-time, the LTC3776 will regulate by
overvoltage protection. The minimum on-time for the
LTC3776 is typically about 200ns. However, as the peak
sense voltage (I
L(PEAK)
• R
DS(ON)
) decreases, the mini-
mum on-time gradually increases up to about 250ns.
Efficiency Considerations
The efficiency of a switching regulator is equal to the
output power divided by the input power times 100%. It is
often useful to analyze individual losses to determine what
is limiting efficiency and which change would produce the
most improvement. Efficiency can be expressed as:
Efficiency = 100% – (L1 + L2 + L3 + …)
where L1, L2, etc. are the individual losses as a percentage
of input power.
Although all dissipative elements in the circuit produce
losses, five main sources usually account for most of the
losses in LTC3776 circuits: 1) LTC3776 DC bias current,
2) MOSFET gate charge current, 3) I
2
R losses, and
4) transition losses.
1) The V
IN
(pin) current is the DC supply current, given in
the electrical characteristics, excluding MOSFET driver
currents. V
IN
current results in a small loss that in-
creases with V
IN
.
2) MOSFET gate charge current results from switching the
gate capacitance of the power MOSFETs. Each time a
MOSFET gate is switched from low to high to low again,
a packet of charge dQ moves from SENSE
+
to ground.
The resulting dQ/dt is a current out of SENSE
+
, which is
typically much larger than the DC supply current. In
continuous mode, I
GATECHG
= f • Q
P
.
3) I
2
R losses are calculated from the DC resistances of the
MOSFETs and inductor. In continuous mode, the aver-
age output current flows through L but is “chopped”
between the top P-channel MOSFET and the bottom
N-channel MOSFET. The MOSFET R
DS(ON)
s multiplied
by duty cycle can be summed with the resistance of L
to obtain I
2
R losses.
4) Transition losses apply to the top external P-channel
MOSFET and increase with higher operating frequen-
cies and input voltages. Transition losses can be esti-
mated from:
Transition Loss = 2 (V
IN
)
2
I
O(MAX)
C
RSS
(f)
Other losses, including C
IN
and C
OUT
ESR dissipative
losses and inductor core losses, generally account for less
than 2% total additional loss.
Checking Transient Response
The regulator loop response can be checked by looking at
the load transient response. Switching regulators take
several cycles to respond to a step in load current. When
a load step occurs, V
OUT
immediately shifts by an amount
equal to (ΔI
LOAD
)(ESR), where ESR is the effective series
resistance of
COUT
. ΔI
LOAD
also begins to charge or dis-
charge C
OUT
, which generates a feedback error signal. The
regulator loop then returns V
OUT
to its steady-state value.
During this recovery time, V
OUT
can be monitored for over-
shoot or ringing. OPTI-LOOP compensation allows the
transient response to be optimized over a wide range of
output capacitance and ESR values.
The I
TH
series R
C
-C
C
filter (see Functional Diagram) sets
the dominant pole-zero loop compensation. The I
TH
exter-
nal components shown in the Typical Application on the
front page of this data sheet will provide an adequate
starting point for most applications. The values can be
modified slightly (from 0.2 to 5 times their suggested
values) to optimize transient response once the final PC
layout is done and the particular output capacitor type and
value have been determined. The output capacitors need
to be decided upon because the various types and values
21
LTC3776
3776fa
APPLICATIO S I FOR ATIO
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determine the loop feedback factor gain and phase. An
output current pulse of 20% to 100% of full load current
having a rise time of 1μs to 10μs will produce output
voltage and I
TH
pin waveforms that will give a sense of the
overall loop stability. The gain of the loop will be increased
by increasing R
C
, and the bandwidth of the loop will be
increased by decreasing C
C
. The output voltage settling
behavior is related to the stability of the closed-loop
system and will demonstrate the actual overall supply
performance. For a detailed explanation of optimizing the
compensation components, including a review of control
loop theory, refer to Application Note 76.
A second, more severe transient is caused by switching in
loads with large (>1μF) supply bypass capacitors. The
discharged bypass capacitors are effectively put in parallel
with C
OUT
, causing a rapid drop in V
OUT
. No regulator can
deliver enough current to prevent this problem if the load
switch resistance is low and it is driven quickly. The only
solution is to limit the rise time of the switch drive so that
the load rise time is limited to approximately (25)(C
LOAD
).
Thus a 10μF capacitor would require a 250μs rise time,
limiting the charging current to about 200mA.
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of the
LTC3776. These items are illustrated in the layout diagram
of Figure 12. Figure 13 depicts the current waveforms
present in the various branches of the 2-phase dual
regulator.
1) The power loop (input capacitor, MOSFETs, inductor,
output capacitor) of each channel should be as small as
possible and isolated as much as possible from the power
loop of the other channel. Ideally, the drains of the P- and
N-channel FETs should be connected close to one another
with an input capacitor placed across the FET sources
(from the P-channel source to the N-channel source) right
at the FETs. It is better to have two separate, smaller valued
input capacitors (e.g., two 10μF—one for each channel)
than it is to have a single larger valued capacitor (e.g.,
22μF) that the channels share with a common connection.
2) The signal and power grounds should be kept separate.
The signal ground consists of the feedback resistor
dividers, I
TH
compensation networks and the SGND pin.
The power grounds consist of the (–) terminal of the input
and output capacitors and the source of the N-channel
MOSFET. Each channel should have its own power ground
for its power loop (as described in (1) above). The power
grounds for the two channels should connect together at
a common point. It is most important to keep the ground
paths with high switching currents away from each other.
The PGND pins on the LTC3776 IC should be shorted
together and connected to the common power ground
connection (away from the switching currents).
3) Put the feedback resistors close to the V
FB
pins. The
trace connecting the top feedback resistor (R
B
) to the
output capacitor should be a Kelvin trace. The I
TH
compen-
sation components should also be very close to the
LTC3776.
4) The current sense traces (SENSE
+
and SW) should be
Kelvin connections right at the P-channel MOSFET source
and drain.
5) Keep the switch nodes (SW1, SW2) and the gate driver
nodes (TG1, TG2, BG1, BG2) away from the small-signal
components, especially the opposite channels feedback
resistors, I
TH
compensation components and the current
sense pins (SENSE
+
and SW).
Figure 12. LTC3776 Layout Diagram

LTC3776EUF#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 2x 2-Phase, No RSENSE Sync Cntr for DDR/
Lifecycle:
New from this manufacturer.
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