25
LTC3776
3776fa
TYPICAL APPLICATIO S
U
Figure 16. 2-Phase, Synchronizable, DDR Memory Supplies
SGND
PLLLPF
IPRG2
IPRG1
V
FB1
I
TH1
SW1
R
VIN
10Ω
R
ITH2
15k
C
ITH2
220pF
C
IN
22μF
C
VIN
1μF
V
IN
3.3V
V
IN
R
ITH1
15k
C
ITH1
220pF
C
FF1
100pF
C
LP
10nF
R
LP
15k
R
FB1B
187k
R
FB1A
59k
PGOOD
V
FB2
V
REF
I
TH2
TG2
LTC3776EGN
PGND
TG1
SYNC/SSEN
BG1
PGND
1
24
23
22
21
20
19
18
17
16
15
14
13
C
OUT1
, C
OUT2
: SANYO 4TPB150MC
D1, D2: OPTIONAL SCHOTTKY DIODES
L1, L2: VISHAY IHLP-2525CZ-01
2
3
4
5
6
7
5
12
11
10
9
SENSE1
+
MP1
SW1
SW2
CLK IN
MP2
L1
1.5μH
L2
1.5μH
MN1
Si7540DP
MN2
Si7540DP
RUN/SS
BG2
PGND
SW2
SENSE2
+
C
OUT2
150μF
C
OUT1
150μF
V
DDQ
2.5V
4A
V
TT
1.25V
±4A
3736 F16
+
+
D1
D2
26
LTC3776
3776fa
U
PACKAGE DESCRIPTIO
UF Package
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1697)
4.00 ± 0.10
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
2423
1
2
BOTTOM VIEW—EXPOSED PAD
2.45 ± 0.10
(4-SIDES)
0.75 ± 0.05
R = 0.115
TYP
0.25 ± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UF24) QFN 0105
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.70 ±0.05
0.25 ±0.05
0.50 BSC
2.45 ± 0.05
(4 SIDES)
3.10 ± 0.05
4.50 ± 0.05
PACKAGE OUTLINE
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 × 45° CHAMFER
27
LTC3776
3776fa
U
PACKAGE DESCRIPTIO
GN Package
24-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.337 – .344*
(8.560 – 8.738)
GN24 (SSOP) 0204
12
3
4
5
6
7
8 9 10 11 12
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
161718192021222324
15
14
13
.016 – .050
(0.406 – 1.270)
.015 ± .004
(0.38 ± 0.10)
× 45°
0° – 8° TYP
.0075 – .0098
(0.19 – 0.25)
.0532 – .0688
(1.35 – 1.75)
.008 – .012
(0.203 – 0.305)
TYP
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
.033
(0.838)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 BSC.0165
± .0015
.045 ±.005
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

LTC3776EUF#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 2x 2-Phase, No RSENSE Sync Cntr for DDR/
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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