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PCA9535PW,118

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P34
PCA9535_PCA9535C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved.
Product data sheet Rev. 6 — 7 November 2017 25 of 34
NXP Semiconductors
PCA9535; PCA9535C
16-bit I
2
C-bus and SMBus, low power I/O port with interrupt
Fig 26. Package outline SOT355-1 (TSSOP24)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
7.9
7.7
4.5
4.3
0.65
6.6
6.2
0.4
0.3
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT355-1 MO-153
99-12-27
03-02-19
0.25
0.5
0.2
w M
b
p
Z
e
112
24
13
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
D
y
0 2.5 5 mm
scale
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
A
max.
1.1
PCA9535_PCA9535C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved.
Product data sheet Rev. 6 — 7 November 2017 26 of 34
NXP Semiconductors
PCA9535; PCA9535C
16-bit I
2
C-bus and SMBus, low power I/O port with interrupt
Fig 27. Package outline SOT616-1 (HVQFN24)
0.51 0.2
A
1
E
h
b
UNIT
ye
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
4.1
3.9
D
h
2.25
1.95
y
1
4.1
3.9
2.25
1.95
e
1
2.5
e
2
2.5
0.30
0.18
c
0.05
0.00
0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT616-1 MO-220 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT616-1
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
712
24
19
18
13
6
1
X
D
E
C
B
A
e
2
01-08-08
02-10-22
terminal 1
index area
terminal 1
index area
AC
C
B
v
M
w
M
1/2 e
1/2 e
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)
PCA9535_PCA9535C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved.
Product data sheet Rev. 6 — 7 November 2017 27 of 34
NXP Semiconductors
PCA9535; PCA9535C
16-bit I
2
C-bus and SMBus, low power I/O port with interrupt
Fig 28. Package outline SOT994-1 (HWQFN24)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT994-1 - - -
MO-220
- - -
SOT994-1
07-02-07
07-03-03
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
UNIT
A
(1)
max
mm 0.8
0.05
0.00
0.30
0.18
4.1
3.9
2.25
1.95
4.1
3.9
2.25
1.95
2.5 2.5 0.1
A
1
DIMENSIONS (mm are the original dimensions)
HWQFN24: plastic thermal enhanced very very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.75 mm
0 2.5 5 mm
scale
b c
0.2
D
(1)
D
h
E
(1)
E
h
e
0.5
e
1
e
2
L
0.5
0.3
v w
0.05
y
0.05
y
1
0.1
B A
terminal 1
index area
E
D
detail X
A
A
1
c
b
e
2
e
1
e
e
1/2 e
1/2 e
AC
B
∅ v
M
C∅ w
M
terminal 1
index area
6
13
127
18
24 19
1
L
E
h
D
h
C
y
C
y
1
X
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P34

PCA9535PW,118

Mfr. #:
Buy PCA9535PW,118
Manufacturer:
NXP Semiconductors
Description:
Interface - I/O Expanders 16-BIT I2C FM TP GPIO INT
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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