46
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72V51233/72V51243/72V51253 3.3V, MULTI-QUEUE FLOW-CONTROL DEVICES
(4 QUEUES) 18 BIT WIDE CONFIGURATION 589,824, 1,179,648 and 2,359,296 bits
Test-Logic
Reset
Run-Test/
Idle
1
0
0
Select-
DR-Scan
Select-
IR-Scan
1
1
1
Capture-IR
0
Capture-DR
0
0
EXit1-DR
1
Pause-DR
0
Exit2-DR
1
Update-DR
1
Exit1-IR
1
Exit2-IR
1
Update-IR
1
1
0
1
1
1
5941 drw30
0
Shift-DR
0
0
0
Shift-IR
0
0
Pause-IR
0
1
Input = TMS
0
01
Figure 28. TAP Controller State Diagram
Refer to the IEEE Standard Test Access Port Specification (IEEE Std.
1149.1) for the full state diagram.
All state transitions within the TAP controller occur at the rising edge of the
TCLK pulse. The TMS signal level (0 or 1) determines the state progression
that occurs on each TCLK rising edge. The TAP controller takes precedence
over the Queue and must be reset after power up of the device. See TRST
description for more details on TAP controller reset.
Test-Logic-Reset All test logic is disabled in this controller state enabling
the normal operation of the IC. The TAP controller state machine is designed
in such a way that, no matter what the initial state of the controller is, the Test-
Logic-Reset state can be entered by holding TMS at high and pulsing TCK five
times. This is the reason why the Test Reset (TRST) pin is optional.
Run-Test-Idle In this controller state, the test logic in the IC is active only if
certain instructions are present. For example, if an instruction activates the self
test, then it will be executed when the controller enters this state. The test logic
in the IC is idles otherwise.
Select-DR-Scan This is a controller state where the decision to enter the
Data Path or the Select-IR-Scan state is made.
Select-IR-Scan This is a controller state where the decision to enter the
Instruction Path is made. The Controller can return to the Test-Logic-Reset state
other wise.
Capture-IR In this controller state, the shift register bank in the Instruction
Register parallel loads a pattern of fixed values on the rising edge of TCK. The
last two significant bits are always required to be “01”.
Shift-IR In this controller state, the instruction register gets connected
between TDI and TDO, and the captured pattern gets shifted on each rising edge
of TCK. The instruction available on the TDI pin is also shifted in to the instruction
register.
Exit1-IR This is a controller state where a decision to enter either the Pause-
IR state or Update-IR state is made.
Pause-IR This state is provided in order to allow the shifting of instruction
register to be temporarily halted.
Exit2-DR This is a controller state where a decision to enter either the Shift-
IR state or Update-IR state is made.
Update-IR In this controller state, the instruction in the instruction register is
latched in to the latch bank of the Instruction Register on every falling edge of
TCK. This instruction also becomes the current instruction once it is latched.
Capture-DR In this controller state, the data is parallel loaded in to the data
registers selected by the current instruction on the rising edge of TCK.
Shift-DR, Exit1-DR, Pause-DR, Exit2-DR and Update-DR These
controller states are similar to the Shift-IR, Exit1-IR, Pause-IR, Exit2-IR and
Update-IR states in the Instruction path.
NOTES:
1. Five consecutive TCK cycles with TMS = 1 will reset the TAP.
2. TAP controller does not automatically reset upon power-up. The user must provide a reset to the TAP controller (either by TRST or TMS).
3. TAP controller must be reset before normal Queue operations can begin.
47
IDT72V51233/72V51243/72V51253 3.3V, MULTI-QUEUE FLOW-CONTROL DEVICES
(4 QUEUES) 18 BIT WIDE CONFIGURATION 589,824, 1,179,648 and 2,359,296 bits
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
THE INSTRUCTION REGISTER
The Instruction register allows an instruction to be shifted in serially into the
processor at the rising edge of TCLK.
The Instruction is used to select the test to be performed, or the test data
register to be accessed, or both. The instruction shifted into the register is latched
at the completion of the shifting process when the TAP controller is at Update-
IR state.
The instruction register must contain 4 bit instruction register-based cells
which can hold instruction data. These mandatory cells are located nearest the
serial outputs they are the least significant bits.
TEST DATA REGISTER
The Test Data register contains three test data registers: the Bypass, the
Boundary Scan register and Device ID register.
These registers are connected in parallel between a common serial input
and a common serial data output.
The following sections provide a brief description of each element. For a
complete description, refer to the IEEE Standard Test Access Port Specification
(IEEE Std. 1149.1-1990).
TEST BYPASS REGISTER
The register is used to allow test data to flow through the device from TDI
to TDO. It contains a single stage shift register for a minimum length in serial path.
When the bypass register is selected by an instruction, the shift register stage
is set to a logic zero on the rising edge of TCLK when the TAP controller is in
the Capture-DR state.
The operation of the bypass register should not have any effect on the
operation of the device in response to the BYPASS instruction.
THE BOUNDARY-SCAN REGISTER
The Boundary Scan Register allows serial data TDI be loaded in to or read
out of the processor input/output ports. The Boundary Scan Register is a part
of the IEEE 1149.1-1990 Standard JTAG Implementation.
THE DEVICE IDENTIFICATION REGISTER
The Device Identification Register is a Read Only 32-bit register used to
specify the manufacturer, part number and version of the processor to be
determined through the TAP in response to the IDCODE instruction.
IDT JEDEC ID number is 0xB3. This translates to 0x33 when the parity
is dropped in the 11-bit Manufacturer ID field.
For the IDT72V51233/72V51243/72V51253, the Part Number field con-
tains the following values:
Device Part# Field (HEX)
IDT72V51233 0x411
IDT72V51243 0x412
IDT72V51253 0x413
JTAG INSTRUCTION REGISTER
The Instruction register allows instruction to be serially input into the device
when the TAP controller is in the Shift-IR state. The instruction is decoded to
perform the following:
Select test data registers that may operate while the instruction is
current. The other test data registers should not interfere with chip
operation and the selected data register.
Define the serial test data register path that is used to shift data between
TDI and TDO during data register scanning.
The Instruction Register is a 4 bit field (i.e. IR3, IR2, IR1, IR0) to decode
16 different possible instructions. Instructions are decoded as follows.
JTAG INSTRUCTION REGISTER DECODING
Hex Instruction Function
Value
00 EXTEST Select Boundary Scan Register
01 SAMPLE/PRELOAD Select Boundary Scan Register
02 IDCODE Select Chip Identification data register
04 HIGH-IMPEDANCE JTAG
0F BYPASS Select Bypass Register
The following sections provide a brief description of each instruction. For
a complete description refer to the IEEE Standard Test Access Port Specification
(IEEE Std. 1149.1-1990).
EXTEST
The required EXTEST instruction places the IC into an external boundary-
test mode and selects the boundary-scan register to be connected between TDI
and TDO. During this instruction, the boundary-scan register is accessed to
drive test data off-chip via the boundary outputs and receive test data off-chip
via the boundary inputs. As such, the EXTEST instruction is the workhorse of
IEEE. Std 1149.1, providing for probe-less testing of solder-joint opens/shorts
and of logic cluster function.
IDCODE
The optional IDCODE instruction allows the IC to remain in its functional mode
and selects the optional device identification register to be connected between
TDI and TDO. The device identification register is a 32-bit shift register
containing information regarding the IC manufacturer, device type, and version
code. Accessing the device identification register does not interfere with the
operation of the IC. Also, access to the device identification register should be
immediately available, via a TAP data-scan operation, after power-up of the
IC or after the TAP has been reset using the optional TRST pin or by otherwise
moving to the Test-Logic-Reset state.
SAMPLE/PRELOAD
The required SAMPLE/PRELOAD instruction allows the IC to remain in a
normal functional mode and selects the boundary-scan register to be connected
between TDI and TDO. During this instruction, the boundary-scan register can
be accessed via a date scan operation, to take a sample of the functional data
entering and leaving the IC. This instruction is also used to preload test data
into the boundary-scan register before loading an EXTEST instruction.
JTAG DEVICE IDENTIFICATION REGISTER
31(MSB) 28 27 12 11 1 0(LSB)
Version (4 bits) Part Number (16-bit) Manufacturer ID (11-bit)
0X0 0X33 1
48
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72V51233/72V51243/72V51253 3.3V, MULTI-QUEUE FLOW-CONTROL DEVICES
(4 QUEUES) 18 BIT WIDE CONFIGURATION 589,824, 1,179,648 and 2,359,296 bits
HIGH-IMPEDANCE
The optional High-Impedance instruction sets all outputs (including two-state
as well as three-state types) of an IC to a disabled (high-impedance) state and
selects the one-bit bypass register to be connected between TDI and TDO.
During this instruction, data can be shifted through the bypass register from TDI
to TDO without affecting the condition of the IC outputs.
BYPASS
The required BYPASS instruction allows the IC to remain in a normal
functional mode and selects the one-bit bypass register to be connected
between TDI and TDO. The BYPASS instruction allows serial data to be
transferred through the IC from TDI to TDO without affecting the operation of
the IC.

72V51253L6BB8

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IDT
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FIFO X18 4Q 2M MULTI-QUE
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