4
IDT72V3611 3.3V, CMOS SyncFIFO
TM
64 x 36 COMMERCIAL TEMPERATURE RANGE
PIN DESCRIPTION (CONTINUED)
Symbol Name I/O Description
PEFB Port-B Parity Error O When any byte applied to terminals B0-B35 fails parity, PEFB is LOW. Bytes are organized as
Flag (Port B) B0-B8, B9-B17, B18-B26, B27-B35, with the most significant bit of each byte serving as the parity
bit. The type of parity checked is determined by the state of the ODD/EVEN input. The parity
trees used to check the B0-B35 inputs are shared by the mail1 register to generate parity if parity
generation is selected by PGB. Therefore, if a mail1 read with parity generation is setup by
having CSB LOW, ENB HIGH, W/RB LOW, MBB HIGH, and PGB HIGH, the PEFB flag is forced
HIGH regardless of the state of the B0-B35 inputs
PGA Port-A Parity I Parity is generated for mail2 register reads from port A when PGA is HIGH. The type of parity
Generation generated is selected by the state of the ODD/EVEN input. Bytes are organized as A0-A8,
A9-A17, A18-A26, and A27-A35. The generated parity bits are output in the most significant bit
of each byte.
PGB Port-B Parity I Parity is generated for data reads from port B when PGB is HIGH. The type of parity generated
Generation is selected by the state of the ODD/EVEN input. Bytes are organized as B0-B8, B9-B17,
B18-B26, and B27-B35. The generated parity bits are output in the most significant bit of
each byte.
RST Reset I To reset the device, four LOW-to-HIGH transitions of CLKA and four LOW-to-HIGH transitions of
CLKB must occur while RST is LOW. This sets the AF, MBF1, and MBF2 flags HIGH and the
EF, AE, and FF flags LOW. The LOW-to-HIGH transition of RST latches the status of the FS1
and FS0 inputs to select Almost-Full and Almost-Empty flag offset.
W/RA Port-A Write/Read I A HIGH selects a write operation and a LOW selects a read operation on port A for a
Select LOW-to-HIGH transition of CLKA. The A0-A35 outputs are in the high-impedance state
when W/RA is HIGH.
W/RB Port-B Write/Read I A HIGH selects a write operation and a LOW selects a read operation on port B for a
Select LOW-to-HIGH transition of CLKB. The B0-B35 outputs are in the high-impedance state
when W/RB is HIGH.
5
IDT72V3611 3.3V, CMOS SyncFIFO
TM
64 x 36 COMMERCIAL TEMPERATURE RANGE
ABSOLUTE MAXIMUM RATINGS OVER OPERATING FREE-AIR
TEMPERATURE RANGE (Unless otherwise noted)
(1)
Symbol Rating Commercial Unit
VCC Supply Voltage Range –0.5 to +4.6 V
VI
(2)
Input Voltage Range –0.5 to VCC+0.5 V
VO
(2)
Output Voltage Range –0.5 to VCC+0.5 V
IIK Input Clamp Current, (VI < 0 or VI > VCC) ±20 mA
IOK Output Clamp Current, (VO = < 0 or VO > VCC) ±50 mA
IOUT Continuous Output Current, (VO = 0 to VCC) ±50 mA
ICC Continuous Current Through VCC or GND ±500 mA
TSTG Storage Temperature Range –65 to 150 °C
NOTES:
1. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at
these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended
periods may affect device reliability.
2. The input and output voltage ratings may be exceeded provided the input and output current ratings are observed.
NOTES:
1. All typical values are at VCC = 3.3V, TA = 25°C.
2. For additional ICC information, see Figure 1, Typical Characteristics: Supply Current (ICC) vs. Clock Frequency (fS).
IDT72V3611
Commercial
tCLK = 15 ns
Symbol Parameter Test Conditions Min.
Typ.
(1)
Max. Unit
VOH Output Logic "1" Voltage VCC = 3.0V, IOH = –4 mA 2.4 V
VOL Output Logic "0" Voltage VCC = 3.0V, IOL = 8 mA 0.5 V
ILI Input Leakage Current (Any Input) VCC = 3.6V, VI = VCC or 0 ±5 μA
ILO Output Leakage Current VCC = 3.6V, VO = VCC or 0 ±5 μA
ICC
(2)
Standby Current VCC = 3.6V, VI = VCC - 0.2V or 0 500 μA
CIN Input Capacitance VI = 0, f = 1 MHz 4 pF
COUT Output Capacitance VO = 0, f = 1 MHZ 8 pF
ELECTRICAL CHARACTERISTICS OVER RECOMMENDED OPERATING
FREE-AIR TEMPERATURE RANGE (Unless otherwise noted)
RECOMMENDED OPERATING
CONDITIONS
Symbol Parameter Min. Typ. Max. Unit
VCC Supply Voltage 3.0 3.3 3.6 V
V
IH High-Level Input Voltage 2 VCC+0.5 V
V
IL Low-Level Input Voltage 0.8 V
IOH High-Level Output Current 4 mA
I
OL Low-Level Output Current 8 mA
T
A Operating Free-Air 0 70 °C
Temperature
6
IDT72V3611 3.3V, CMOS SyncFIFO
TM
64 x 36 COMMERCIAL TEMPERATURE RANGE
DETERMINING ACTIVE CURRENT CONSUMPTION AND POWER DISSIPATION
The ICC(f) data for the graph was taken while simultaneously reading and writing the FIFO on the IDT72V3611 with CLKA and CLKB operating at frequency
fS. All data inputs and data outputs change state during each clock cycle to consume the highest supply current. Data outputs were disconnected to normalize
the graph to a zero-capacitance load. Once the capacitance load per data-output channel is known, the power dissipation can be calculated with the equation
below.
CALCULATING POWER DISSIPATION
With I
CC(f) taken from Figure 1, the maximum power dissipation (PT) of the IDT72V3611 may be calculated by:
P
T = VCC x ICC(f) + Σ(CL x (VOH - VOL)
2
x fO)
N
where:
N = number of outputs = 36
CL = output capacitance load
fO = switching frequency of an output
V
OH = output high-level voltage
V
OL = output low-level voltage
When no read or writes are occurring on this device, the power dissipated by a single clock (CLKA or CLKB) input running at frequency fS is
calculated by:
PT = VCC x fS x 0.025 mA/MHz
Figure 1. Typical Characteristics: Supply Current (ICC) vs. Clock Frequency (fS)
0 10 20 30 40 50 60 70
0
25
50
75
100
125
150
VCC = 3.3V
fS Clock Frequency MHz
ICC(f) Supply Current mA
fdata = 1/2 fS
T
A = 25°C
C
L = 0 pF
V
CC = 3.0V
4657 drw 04
VCC = 3.6V

72V3611L20PF

Mfr. #:
Manufacturer:
IDT
Description:
FIFO 64 x 36 SyncFIFO, 3.3V
Lifecycle:
New from this manufacturer.
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