LTC3774
36
3774fc
For more information www.linear.com/LTC3774
PACKAGE DESCRIPTION
UHE Package
36-Lead Plastic QFN (5mm × 6mm)
(Reference LTC DWG # 05-08-1876 Rev Ø)
5.00 ±0.10
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
PIN 1
TOP MARK
(SEE NOTE 6)
1
10
20
28
1119
3629
BOTTOM VIEW—EXPOSED PAD
4.50 REF
6.00 ±0.10
R = 0.125
TYP
0.25 ±0.05
4.60 ±0.10
3.60
±0.10
(UHE36) QFN 0410 REV Ø
0.50 BSC
4.60 ±0.05
3.60 ±0.05
0.75 ±0.05
0.00 – 0.05
0.200 REF
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
3.50 REF
0.40 ±0.10
0.70 ±0.05
0.50 BSC
4.50 REF
3.50 REF
4.10 ±0.05
5.50 ±0.05
5.10 ±0.05
6.50 ±0.05
0.25 ±0.05
PACKAGE
OUTLINE
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 NOTCH
R = 0.30 TYP
OR 0.35 × 45°
CHAMFER
R = 0.10
TYP
Please refer to http://www.linear.com/product/LTC3774#packaging for the most recent package drawings.