16
IDT72V205/72V215/72V225/72V235/72V245 3.3V CMOS SyncFIFO
TM
256 x 18, 512 x 18, 1,024 x 18, 2,048 x 18 and 4,096 x 18
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
MARCH 2013
Figure 18. Write Expansion In Timing
Figure 19. Read Expansion In Timing
NOTE:
1. Read from Last Physical Location.
Figure 17. Read Expansion Out Timing
NOTE:
1. Write to Last Physical Location.
Figure 16. Write Expansion Out Timing
RXI
RCLK
t
XI
t
XIS
4294 drw 19
WXI
WCLK
tXI
tXIS
4294 drw 18
RCLK
REN
t
ENS
RXO
t
CLKH
t
XO
Note 1
t
XO
4294 drw 17
WCLK
WEN
t
ENS
WXO
t
CLKH
t
XO
Note 1
t
XO
4294 drw 16
17
IDT72V205/72V215/72V225/72V235/72V245 3.3V CMOS SyncFIFO
TM
256 x 18, 512 x 18, 1,024 x 18, 2,048 x 18 and 4,096 x 18
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
MARCH 2013
Figure 20. Write Timing with Synchronous Programmable Flags (FWFT Mode)
NOTES:
1. t
SKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge for OR to go LOW after two RCLK cycles plus tREF. If the time between the rising edge of WLCK and the rising edge of RCLK is less than tSKEW1,
then the OR deassertion may be delayed one extra RCLK cycle.
2. t
SKEW2 is the minimum time between a rising WCLK edge and a rising RCLK edge for PAE to go HIGH during the current clock cycle. If the time between the rising edge of WCLK and the rising edge of RCLK is less than tSKEW2,
then the PAE deassertion may be delayed one extra RCLK cycle.
3. LD = HIGH, OE = LOW
4. n = PAE offset, m = PAF offset, D = maximum FIFO depth = 257 words for the IDT72V205, 513 words for the IDT72V215, 1,025 words for the IDT72V225, 2,049 words for the IDT72V235 and 4,097 words for the IDT72V245.
5. Select this mode by setting (FL, RXI, WXI) = (1,0,1) during Reset.
W
1
W
2
W
4
W
[n +2]
W
[D-m-1]
W
[D-m-2]
W
[D-1]
W
D
W
[n+3]
W
[n+4]
W
[D-m]
W
[D-m+1]
WCLK
WEN
D
0
- D
17
RCLK
t
DH
t
DS
t
ENS
t
SKEW1
REN
Q
0
- Q
17
PAF
HF
PAE
IR
t
DS
t
DS
t
DS
t
SKEW2
t
A
t
REF
OR
t
PAES
t
HF
t
PAFS
t
WFF
W
[D-m+2]
W
1
t
ENH
4294 drw 20
DATA IN OUTPUT REGISTER
(2)
W
3
1
2
3
1
1
D-1
2
+1
][
W
D-1
+2
][
W
2
D-1
+3
][
W
2
18
IDT72V205/72V215/72V225/72V235/72V245 3.3V CMOS SyncFIFO
TM
256 x 18, 512 x 18, 1,024 x 18, 2,048 x 18 and 4,096 x 18
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
MARCH 2013
Figure 21. Read Timing with Synchronous Programmable Flags (FWFT Mode)
NOTES:
1. t
SKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that IR will go LOW after one WCLK plus tWFF. If the time between the rising edge of RLCK and the rising edge of WCLK is less than
t
SKEW1, then the IR assertion may be delayed an extra WCLK cycle.
2. t
SKEW2 is the minimum time between a rising RCLK edge and a rising WCLK edge for PAF to go HIGH during the current clock cycle. If the time between the rising edge of RCLK and the rising edge of WCLK is less than tSKEW2,
then the PAF deassertion time may be delayed an extra WCLK cycle.
3. LD = HIGH
4. n = PAE offset, m = PAF offset, D = maximum FIFO depth = 257 words for the IDT72V205, 513 words for the IDT72V215, 1,025 words for the IDT72V225, 2,049 words for IDT72V235 and 4,097 words for IDT72V245.
5. Select this mode by setting (FL, RXI, WXI) = (1,0,1) during Reset.
WCLK
12
WEN
D
0
- D
17
RCLK
t
ENS
REN
Q
0
- Q
17
PAF
HF
PAE
IR
OR
W
1
W
1
W
2
W
3
W
m+2
W
[m+3]
t
OHZ
t
SKEW1
t
ENH
t
DS
t
DH
t
OE
t
A
t
A
t
A
t
PAFS
t
WFF
t
WFF
t
ENS
OE
t
SKEW2
W
D
4294 drw 21
t
PAES
W
[D-n]
W
[D-n-1]
t
A
t
A
t
HF
t
REF
W
[D-1]
W
D
t
A
W
[D-n+1]
W
[m+4]
W
[D-n+2]
(1)
(2)
1
t
ENS
D-1
][
W
D-1
][
W

72V215L10TFG

Mfr. #:
Manufacturer:
IDT
Description:
FIFO 512x18 3.3V SYNC FIFO
Lifecycle:
New from this manufacturer.
Delivery:
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