AX5031
www.onsemi.com
5
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Symbol Description Condition Min Max Units
VDD_IO Supply voltage −0.5 5.5 V
IDD Supply current 100 mA
P
tot
Total power consumption 800 mW
I
I1
DC current into any pin except ANTP, ANTN −10 10 mA
I
I2
DC current into pins ANTP, ANTN −100 100 mA
I
O
Output Current 40 mA
V
ia
Input voltage ANTP, ANTN pins −0.5 5.5 V
Input voltage digital pins −0.5 5.5 V
V
es
Electrostatic handling HBM −2000 2000 V
T
amb
Operating temperature −40 85 °C
T
stg
Storage temperature −65 150 °C
T
j
Junction Temperature 150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
DC Characteristics
Table 3. SUPPLIES
Symbol Description Condition Min Typ Max Units
T
AMB
Operational ambient temperature −40 27 85 °C
VDD_IO I/O and voltage regulator supply voltage 2.2 3.0 3.6 V
VREG Internally regulated supply voltage
Power−down mode PWRMODE = 0x00 1.7
V
All other power modes 2.1 2.5 2.8
I
PDOWN
Power−down current PWRMODE = 0x00 0.25
mA
I
TX
Current consumption TX for maximum
power with default matching network at
3.3 V VDD_IO. (Note 1)
868 MHz, 15 dBm 44
mA
433 MHz, 15 dBm 45
TX
VARVDD
Variation of output power over voltage VDD_IO > 2.5 V, (Note 1) ± 0.5 dB
TX
VARTEMP
Variation of output power over
temperature
VDD_IO > 2.5 V, (Note 1) ± 0.5 dB
1. The PA voltage is regulated to 2.5 V. For VDD_IO levels in the range of 2.2 V to 2.5 V the output power drops by typically 1 dBm.
