COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72805LB/72815LB/72825LB/72845LB CMOS Dual SyncFIFO
TM
256 x 18, 512 x 18, 1,024 x 18, and 4,096 x 18
4
Symbol Name I/O Description
DA
0–DA17 Data Inputs I Data inputs for an 18-bit bus.
DB
0-DB17
RSA Reset I When RS is set LOW, internal read and write pointers are set to the first location of the RAM array, FF and
RSB PAF go HIGH, and PAE and EF go LOW. A reset is required before an initial WRITE after power-up.
WCLKA Write Clock I When WEN is LOW, data is written into the FIFO on a LOW-to-HIGH transition of WCLK, if the FIFO is not full.
WCLKB
WENA Write Enable I When WEN is LOW, data is written into the FIFO on every LOW-to-HIGH transition of WCLK. When WEN is
WENB HIGH, the FIFO holds the previous data. Data will not be written into the FIFO if the FF is LOW.
RCLKA Read Clock I When REN is LOW, data is read from the FIFO on a LOW-to-HIGH transition of RCLK, if the FIFO is not empty.
RCLKB
RENA Read Enable I When REN is LOW, data is read from the FIFO on every LOW-to-HIGH transition of RCLK. When REN is HIGH,
RENB the output register holds the previous data. Data will not be read from the FIFO if the EF is LOW.
OEA Output Enable I When OE is LOW, the data output bus is active. If OE is HIGH, the output data bus will be in a high-impedance
OEB state.
LDA Load I When LD is LOW, data on the inputs D0–D11 is written to the offset and depth registers on the LOW-to-HIGH
LDB transition of the WCLK, when WEN is LOW. When LD is LOW, data on the outputs Q0–Q11 is read from the
offset and depth registers on the LOW-to-HIGH transition of the RCLK, when REN is LOW.
FLA First Load I In the single device or width expansion configuration, FL together with WXI and RXI determine if the mode is
FLB IDT Standard mode or First Word Fall Through (FWFT) mode, as well as whether the PAE/PAF flags are
synchronous or asynchronous. (See Table I.) In the Daisy Chain Depth Expansion configuration, FL is grounded
on the first device (first load device) and set to HIGH for all other devices in the Daisy Chain.
WXIA Write Expansion I In the single device or width expansion configuration, WXI together with FL and RXI determine if the mode is
WXIB Input IDT Standard mode or FWFT mode, as well as whether the PAE/PAF flags are synchronous or asynchronous.
(See Table 1.) In the Daisy Chain Depth Expansion configuration, WXI is connected to WXO (Write Expansion
Out) of the previous device.
RXIA Read Expansion I In the single device or width expansion configuration,
RXI together with FL and WXI, determine if the mode is
RXIB Input IDT Standard mode or FWFT mode, as well as whether the PAE/PAF flags are synchronous or asynchronous.
(See Table 1.) In the Daisy Chain Depth Expansion configuration, RXI is connected to RXO (Read Expansion
Out) of the previous device.
FFA/IRA Full Flag/ O In the IDT Standard mode, the FF function is selected FF indicates whether or not the FIFO memory is full. In
FFB/IRB Input Ready the FWFT mode, the IR function is selected. IR indicates whether or not there is space available for writing to
the FIFO memory.
EFA/ORA Empty Flag/ O In the IDT Standard mode, the EF function is selected. EF indicates whether or not the FIFO memory is empty.
EFB/ORB Output Ready In FWFT mode, the OR function is selected. OR indicates whether or not there is valid data available at the
outputs.
PAEA Programmable O When PAE is LOW, the FIFO is almost-empty based on the offset programmed into the FIFO. The default
PAEB Almost-Empty flag offset at reset is 31 from empty for IDT72805LB, 63 from empty for IDT72815LB, and 127 from empty for
IDT72825LB/72845LB.
PAFA Programmable O When PAF is LOW, the FIFO is almost-full based on the offset programmed into the FIFO. The default offset
PAFB Almost-Full flag at reset is 31 from full for IDT72805LB, 63 from full for IDT72815LB, and 127 from full for IDT72825LB/72845LB.
WXOA/HFA Write Expansion O In the single device or width expansion configuration, the device is more than half full when HF is LOW. In the
WXOB/HFB Out/Half-Full Flag depth expansion configuration, a pulse is sent from WXO to WXI of the next device when the last location in
the FIFO is written.
RXOA Read Expansion O In the depth expansion configuration, a pulse is sent from RXO to RXI of the next device when the last location
RXOB Out in the FIFO is read.
QA
0–QA17 Data Outputs O Data outputs for an 18-bit bus.
QB0-QB17
VCC Power +5V power supply pins.
GND Ground Ground pins.
PIN DESCRIPTION
5
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72805LB/72815LB/72825LB/72845LB CMOS Dual SyncFIFO
TM
256 x 18, 512 x 18, 1,024 x 18, and 4,096 x 18
RECOMMENDED DC OPERATING
CONDITIONS
NOTE:
1. 1.5V undershoots are allowed for 10ns once per cycle.
Symbol Rating Commercial Unit
V
TERM Terminal Voltage –0.5 to +7.0 V
with respect to GND
T
STG Storage –55 to +125 °C
Temperature
I
OUT DC Output Current –50 to +50 mA
IDT72805LB
IDT72815LB
IDT72825LB
IDT72845LB
Com’l & Ind’l
(1)
tCLK = 10, 15, 25 ns
Symbol Parameter Min. Typ. Max. Unit
I
LI
(2)
Input Leakage Current (any input) 1 1 μA
I
LO
(3)
Output Leakage Current 10 10 μA
V
OH Output Logic “1” Voltage, IOH = –2 mA 2.4 V
V
OL Output Logic “0” Voltage, IOL = 8 mA 0.4 V
I
CC1
(4,5,6)
Active Power Supply Current 100 mA
I
CC2
(4,7)
Standby Current 10 mA
DC ELECTRICAL CHARACTERISTICS
(Commercial: VCC = 5V ± 10%, TA = 0°C to +70°C; Industrial: VCC = 5V ± 10%, TA = -40°C to +85°C)
NOTES:
1. Industrial Temperature Range Product for the 15ns speed grade is available as a standard device.
2. Measurements with 0.4 VIN VCC.
3. OE VIH, 0.4 VOUT VCC.
4. Tested with outputs open (IOUT = 0).
4. RCLK and WCLK toggle at 20 MHZ and data inputs switch at 10 MHz.
5. For the IDT72805LB/72815LB/72825LB the typical ICC1 = 2[1.81 + 1.12*fS + 0.02*CL*fS] (in mA);
for the IDT72845LB the typical ICC1 = 2[2.85 + 1.30*fS + 0.02*CL*fS] (in mA).
These equations are valid under the following conditions:
VCC = 5V, TA = 25°C, fS = WCLK frequency = RCLK frequency (in MHz, using TTL levels), data switching at fS/2, CL = capacitive load (in pF).
7. All Inputs = VCC - 0.2V or GND + 0.2V, except RCLK and WCLK, which toggle at 20 MHz.
ABSOLUTE MAXIMUM RATINGS
NOTE:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
Symbol Parameter Min. Typ. Max. Unit
V
CC Supply Voltage (Com’l/Ind’l) 4.5 5.0 5.5 V
GND Supply Voltage (Com’l/Ind’l) 0 0 0 V
V
IH Input High Voltage (Com’l/Ind’l) 2.0 ⎯⎯ V
V
IL
(1)
Input Low Voltage (Com’l/Ind’l) 0.8 V
T
A Operating Temperature 0 70 °C
Commercial
T
A Operating Temperature -40 85 °C
Industrial
Symbol Parameter
(1)
Conditions Max. Unit
CIN
(2)
Input VIN = 0V 10 pF
Capacitance
C
OUT
(1,2)
Output VOUT = 0V 10 pF
Capacitance
CAPACITANCE (TA = +25°C, f = 1.0MHz)
NOTES:
1. With output deselected, (OE VIH).
2. Characterized values, not currently tested.
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72805LB/72815LB/72825LB/72845LB CMOS Dual SyncFIFO
TM
256 x 18, 512 x 18, 1,024 x 18, and 4,096 x 18
6
AC ELECTRICAL CHARACTERISTICS
(Commercial: VCC = 5V ± 10%, TA = 0°C to +70°C; Industrial: VCC = 5V ± 10%, TA = -40°C + 85°C)
Input Pulse Levels GND to 3.0V
Input Rise/Fall Times 3ns
Input Timing Reference Levels 1.5V
Output Reference Levels 1.5V
Output Load See Figure 1
AC TEST CONDITIONS
Figure 1. Output Load
* Includes jig and scope capacitances.
Commercial Com’l & Ind’l
(1)
Commercial
IDT72805LB10 IDT72805LB15 IDT72805LB25
IDT72815LB10 IDT72815LB15 IDT72815LB25
IDT72825LB10 IDT72825LB15 IDT72825LB25
IDT72845LB10 IDT72845LB15 IDT72845LB25
Symbol Parameter Min. Max. Min. Max. Min. Max. Unit
fS Clock Cycle Frequency 100 66.7 40 MHz
tA Data Access Time 2 6.5 2 10 3 15 ns
tCLK Clock Cycle Time 10 15 25 ns
tCLKH Clock HIGH Time 4.5 6 10 ns
tCLKL Clock LOW Time 4.5 6 10 ns
tDS Data Setup Time 3 4 6 ns
tDH Data Hold Time 0 1 1 ns
tENS Enable Setup Time 3 4 6 ns
tENH Enable Hold Time 0 1 1 ns
tRS Reset Pulse Width
(2)
10 15 25 ns
tRSS Reset Setup Time 8 10 15 ns
tRSR Reset Recovery Time 8 10 15 ns
tRSF Reset to Flag and Output Time 15 15 25 ns
tOLZ Output Enable to Output in Low-Z
(3)
0—0—0 ns
tOE Output Enable to Output Valid 6 8 12 ns
tOHZ Output Enable to Output in High-Z
(3)
1618112ns
tWFF Write Clock to Full Flag 6.5 10 15 ns
tREF Read Clock to Empty Flag 6.5 10 15 ns
t
PAFA Clock to Asynchronous Programmable 17 20 35 ns
Almost-Full Flag
t
PAFS Write Clock to Synchronous 8 10 12 ns
Programmable Almost-Full Flag
t
PAEA Clock to Asynchronous Programmable 17 20 35 ns
Almost-Empty Flag
t
PAES Read Clock to Synchronous 8 10 12 ns
Programmable Almost-Empty Flag
tHF Clock to Half-Full flag 17 20 35 ns
tXO Clock to Expansion Out 6.5 10 15 ns
tXI Expansion In Pulse Width 3 6.5 10 ns
tXIS Expansion In Setup Time 3 5 10 ns
t
SKEW1 Skew time between Read Clock & 5 6 10 ns
Write Clock for FF/IR and EF/OR
t
SKEW2
(4)
Skew time between Read Clock & 12 15 17 ns
Write Clock for PAE and PAF
3139 drw 03
30pF*
1.1K
5V
D.U.T.
680Ω
NOTES:
1. Industrial Temperature Range Product for the 15ns speed grade is available as a standard device.
2. Pulse widths less than minimum values are not allowed.
3. Values guaranteed by design, not currently tested.
4. tSKEW2 applies to synchronous PAE and synchronous PAF only.

72805LB15PF

Mfr. #:
Manufacturer:
IDT
Description:
FIFO 256 X 18 SYNCHRONOUS FIFO
Lifecycle:
New from this manufacturer.
Delivery:
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