LTC3765
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APPLICATIONS INFORMATION
When the NMOS is on, the magnetizing current and reflected
inductor current are both flowing through the NMOS. The
inductor current is generally much larger than the mag
-
netizing current, which makes the magnetizing current
difficult to measure directly. Therefore, when the NMOS
is on the LTC3765 internally replicates the magnetizing
current based on transformer core parameters, the voltage
on the I
SMAG
pin at the end of the previous reset cycle,
and the sensed input voltage on the RUN pin. The RUN
pin must be connected to a resistive divider from V
IN
to ground for proper operation of the Direct Flux Limit.
At the end of the reset cycle, the voltage on the I
SMAG
pin is sampled and held internally. This voltage is an ac-
curate measurement
of the magnetizing current. When
the NMOS turns on, an internal ramp proportional to the
RUN pin voltage divided by the R
CORE
resistor increases
the internal replicated magnetizing current. If this internal
voltage exceeds 1V (or V
CC
+ 1V for the alternative AG
configuration of Figure 7b), then the NMOS is turned off
to prevent core saturation.
When the NMOS is turned off due to a Direct Flux Limit, the
secondary-side switch node falls. The LTC3766 detects this
prematurely falling switch node and turns off the forward
gate to allow the transformer core to reset. This switch
node behavior is indistinguishable from a primary-side
shutdown; therefore, if the switch node falls prematurely
for 19 consecutive cycles, the LTC3766 concludes that a
primary-side shutdown has occurred and will fault.
Choose R
CORE
based on the RUN pin divider network and
the transformer core parameters:
R
CORE
=
R2
R1+ R2
B
MAX
A
C
N
P
0.030
2k
where R1 and R2 comprise the divider network on the
RUN pin, with R1 from V
IN
to the RUN pin and R2 from
the RUN pin to ground. B
MAX
is typically 2700 gauss for
a transformer designed to operate at 2000 gauss, A
C
is
the area of the core in cm
2
, and N
P
is the number of turns
on the primary winding of the transformer.
The internal approximation of the magnetizing current is
linear, which is accurate if the transformer flux density is
kept sufficiently far from saturation. As the flux density
approaches saturation, the magnetizing inductance of
the transformer decreases and the magnetizing current
increases rapidly. Depending on the particular core proper
-
ties, it may be necessary to additionally decrease B
MAX
in
the equations above.
In a resonant reset application, the active clamp is re
-
placed by a single reset capacitor. In this configuration,
the transformer core is reset every cycle and is less likely
to saturate; however, the transformer can still saturate
during certain transient conditions. The Direct Flux Limit
can also be configured to prevent core saturation in this
application. Connect the R
MAG
sense resistor in series
with the ground side of the resonant reset capacitor and
use
the equation above for R
CORE
to prevent saturation
in a forward converter with resonant reset. The Direct
Flux Limit may be disabled by tying I
SMAG
to ground and
floating the R
CORE
pin; however, disabling the Direct Flux
Limit leaves the application circuit open to transformer
saturation and is not recommended.
Active Clamp Capacitor
The active clamp capacitor, C
CLAMP
, stores the average reset
voltage of the transformer over many cycles. The voltage on
the clamp capacitor is generated by the transformer core
reset current, and will intrinsically adjust to the optimal
reset voltage regardless of other parameters. The voltage
across the capacitor at full load is approximately given by:
V
CL
=
V
IN
2
V
IN
1.15 V
OUT
N
P
/N
S
( )
N
P
/N
S
is the main transformer turns ratio. The factor of
1.15 accounts for typical losses and delays. When PG
and AG are low, the bottom side of the clamp capacitor is
grounded, placing the reset voltage V
CL
on the SWP node
in Figure 1. When PG and AG are high, the topside of the
capacitor is grounded, and the voltage on the bottom side
of the capacitor isV
CL
. Therefore the voltage seen on the
LTC3765
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APPLICATIONS INFORMATION
capacitor is also the voltage seen at the drains of the PG
and AG MOSFETs.
As shown in Figure 8, the V
CL
voltage has a minimum when
the converter is operating at 50%. For a given range on
V
IN
, therefore, the maximum clamp voltage (V
CL(MAX)
) will
occur either at the minimum or maximum V
IN
, depending
on which input voltage causes the converter to operate
furthest from 50% duty cycle. The maximum V
CL
voltage
can be determined by substituting the maximum and
minimum values of V
IN
into this equation and selecting
the larger of the two. In order to leave room for overshoot,
choose a capacitor whose voltage rating is greater than
this maximum V
CL
voltage by 50% or more. Typically, a
good quality (X7R) ceramic capacitor is a good choice for
C
CLAMP
. Also, be sure to account for the voltage coefficient
of the capacitor. Many ceramic capacitors will lose as much
as 50% of their value at their rated voltage.
capacitor and the snubber components according to the
following equations, where f
SW
is the frequency set by
the LTC3766 FS pin:
C
CLAMP
=
1
2L
MAG
4
2 π f
SW
2
C
SN
= 6C
CLAMP
R
SN
=
1
1–
V
OUT
V
IN(MIN)
N
P
N
S
L
MAG
C
CLAMP
Be careful to account for the effect of voltage coefficient for
both C
SN
and C
CLAMP
to ensure that the above relationship
is maintained. In addition to dampening the resonance of
the active clamp, the RC snubber also minimizes the peak
voltage stress seen by the primary-side MOSFETs and
reduces the effect of this LC resonance on the closed-loop
transient response.
Setting the Gate Drive Delay
The active clamp gate driver (AG) and the primary switch
gate driver (PG) switchin-phase,” with a programmable
overlap time set by the DELAY pin. The PG falling to AG
falling delay (t
DAG
) is fixed at 180ns since the timing of
this edge has little impact on efficiency. The AG rising to
PG rising delay (t
DPG
) is critical for optimizing efficiency
and must be set in conjunction with the LTC3766 forward
gate and synchronous gate delays. Refer to the LTC3766
data sheet for the procedure to determine the optimal delay
times for a particular application. The primary gate delay
time is set by a resistor from the DELAY pin to ground,
according to the following equation:
R
DELAY
= t
DPG
45ns
( )
1k
9.5ns
In a system where the active clamp is not desired, for
example in a forward converter using resonant reset, this
delay can be set to a minimum by grounding the delay pin.
Figure 8. Active Clamp Capacitor Voltage vs Duty Cycle
DUTY CYCLE (%)
20
ACTIVE CLAMP VOLTAGE
NORMALIZED TO 50% DUTY CYCLE
1.3
1.4
1.5
1.2
1.1
40 60
30
50 70 80
1.0
0.9
1.6
3765 F08
In addition to voltage rating, another design constraint
on C
CLAMP
occurs because of the resonance between the
magnetizing inductance of the main transformer with the
clamp capacitor. The magnetizing inductance L
MAG
and
C
CLAMP
form a high-Q resonant system that results in a
sinusoidal ripple on the capacitor voltage. To avoid the
problems associated with this resonance, always use
an RC snubber in parallel with the clamp capacitor as
shown in Figures 7a and 7b. Choose values for the clamp
LTC3765
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APPLICATIONS INFORMATION
Maximum Duty Cycle
During the delay time between AG rising and PG rising,
power is not transferred from the input supply to the
output supply. In most forward converter systems, the
maximum on-time is artificially limited by the delay, which
then drives a trade-off between the optimal delay time
and the maximum achievable duty cycle. The LTC3765
and LTC3766 implement a unique system in which the
PG and FG rising delays are reduced as the demanded
duty cycle approaches maximum duty cycle. This allows
for greater input voltage range variation over traditional
forward converters.
Be cautious with component selection when designing
with high duty cycles. Recall that the voltage on the drain
of the primary switch is equal to V
IN
/(1-D), where D is the
duty cycle. This voltage increases dramatically as the duty
cycle approaches 100%. The LTC3766 limits the maximum
duty cycle to 79% in order to reset the transformer core
without excessive voltage stress on the primary switch.
Pulse Transformer
The pulse transformer that connects the LTC3766 PT
+
/
PT
outputs to the LTC3765 IN
+
/IN
inputs functions as the
communication link between the secondary-side controller
and the primary-side gate driver
, as shown in Figure 9.
Refer
to the LTC3766 data sheet to determine the turns
ratio and volt-second specifications for the pulse trans
-
former. Keep in mind that the amplitude of the signals on
the IN
+
and IN
pins should be in the range of 4V to 15V
to ensure proper operation.
Furthermore, an additional constraint on the IN
+
/IN
volt-
age is present when V
CC
bias is extracted from the signal.
The internal rectifier drops approximately 1V between the
IN
+
and IN
pins and V
CC
. Therefore, the signal on the IN
+
and IN
pins should be at least 9V to keep the V
CC
supply
above its falling UVLO threshold.
TheF and 0.1µF capacitors in series with the pulse
transformer of Figure 9 are for blocking and restoring the
DC level of the signal. These values are appropriate for
most LTC3765/LTC3766 applications.
Bypassing and Grounding
The LTC3765 requires proper bypassing on the V
CC
supply
due to its high speed switching (nanoseconds) and large
AC currents (Amperes). Careless component placement
and PCB trace routing may cause excessive ringing and
undershoot/overshoot.
To obtain the optimal performance from the LTC3765:
A. Use a
low inductance, low impedance ground plane
to reduce any ground drop and stray capacitance.
Remember that the LTC3765 switches greater than
2A peak currents and any significant ground drop will
degrade signal integrity.
B. Mount a bypass capacitor as close as possible between
the V
CC
pin and ground plane.
C. Plan the power/ground routing carefully. Know where
the large load switching current is coming from and
going to. Maintain separate ground return paths for
the signal pins and the output power stage.
D. Keep the copper traces between the driver output pins
and the load short and wide.
E. Solder the exposed pad on the back side of the LTC3765
package to the ground plane. The exposed pad is inter
-
nally electrically connected to the SGND pin; however,
rated thermal performance will only be achieved if the
exposed pad is soldered to a low impedance ground
plane.
0.1µF 1µF
N
3765
:N
3766
IN
+
IN
LTC3765
3765 F09
PT
+
PT
LTC3766
Figure 9. Pulse Transformer Connection

LTC3765IMSE#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Active Clamp For Cntr & Gate Drvr
Lifecycle:
New from this manufacturer.
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