Data Sheet ADF4113HV
Rev. B | Page 15 of 20
APPLICATIONS
ADF4113HV
2.7k
VCO
GND
18
100pF
100pF
18
18
RF
OUT
FREF
IN
51
100pF
100pF
RF
IN
A
RF
IN
B
R
SET
REF
IN
CP
CE
CLK
DATA
LE
SPI-COMPATIBLE SERIAL BUS
MUXOUT
LOCK
DETECT
INPUT OUTPUT
2
14
6
5
1
8
LOOP
FILTER
NOTES
1. POWER SUPPLY CONNECTIONS AND DECOUPLING
CAPACITORS ARE OMITTED FOR CLARITY.
AD5320
12-BIT
V-OUT DAC
06223-023
Figure 23. Driving the R
SET
Pin with a Digital-to-Analog Converter
USING A DIGITIAL-TO-ANALOG CONVERTER TO
DRIVE THE R
SET
PIN
A digital-to-analog converter (DAC) can be used to drive the
R
SET
pin of the ADF4113HV, thus increasing the level of control
over the charge pump current (I
CP
). This can be advantageous in
wideband applications where the sensitivity of the VCO varies
over the tuning range. To compensate for this, I
CP
can be varied
to maintain good phase margin and ensure loop stability. See
Figure 23 for this configuration.
INTERFACING
The ADF4113HV has a simple SPI®-compatible serial interface
for writing to the device. CLK, DATA, and LE control the data
transfer. When latch enable (LE) goes high, the 24 bits that have
been clocked into the input register on each rising edge of CLK
are transferred to the appropriate latch. See Figure 2 for the
timing diagram and Table 6 for the latch truth table.
The maximum allowable serial clock rate is 20 MHz. This
means that the maximum update rate possible for the device
is 833 kHz, or one update every 1.2 µs. This rate is more than
adequate for systems that have typical lock times in the
hundreds of microseconds.
ADuC812 Interface
Figure 24 shows the interface between the ADF4113HV and the
ADuC812 MicroConverter®. Because the ADuC812 is based on
an 8051 core, this interface can be used with any 8051-based
microcontroller. The MicroConverter is set up for SPI master
mode with CPHA = 0. To initiate the operation, the I/O port
driving LE is brought low. Each latch of the ADF4113HV needs
a 24-bit word. This is accomplished by writing three 8-bit bytes
from the MicroConverter to the device. When the third byte
has been written, the LE input should be brought high to
complete the transfer.
I/O port lines on the ADuC812 are also used to control power-
down (CE input), and to detect lock (MUXOUT configured as
lock detect and polled by the port input).
When the ADuC812 is operating in the SPI master mode, the
maximum SCLOCK rate of the ADuC812 is 4 MHz. This
means that the maximum rate at which the output frequency
can be changed is 166 kHz.
SCLOCK
MOSI
I/O PORTS
ADuC812
CLK
DATA
LE
CE
MUXOUT
(LOCK DETECT)
ADF4113HV
06223-024
Figure 24. ADuC812 to ADF4113HV Interface
ADF4113HV Data Sheet
Rev. B | Page 16 of 20
ADSP-21xx Interface
Figure 25 shows the interface between the ADF4113HV and the
ADSP-21xx digital signal processor. The ADF4113HV needs a
24-bit serial word for each latch write. The easiest way to
accomplish this using the ADSP-21xx family is to use the auto
buffered transmit mode of operation with alternate framing.
This provides a means for transmitting an entire block of serial
data before an interrupt is generated.
SCLK
DT
I/O FLAGS
ADSP-21xx
CLK
DATA
LE
CE
M
UX
O
UT
(LOCK DET
EC
T
)
ADF4113HV
TF
S
06223-025
Figure 25. ADSP-21xx to ADF4113HV Interface
Set up the word length for eight bits and use three memory
locations for each 24-bit word. To program each 24-bit latch,
store the three 8-bit bytes, enable the auto buffered mode, and
then write to the transmit register of the DSP. This last opera-
tion initiates the autobuffer transfer.
PCB DESIGN GUIDELINES FOR CHIP SCALE
PACKAGE
The lands on the chip scale package (CP-20-6) are rectangular.
The printed circuit board pad for these should be 0.1 mm
longer than the package land length, and 0.05 mm wider than
the package land width. The land should be centered on the pad
to ensure that the solder joint size is maximized.
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, provide
a clearance of at least 0.25 mm between the thermal pad and the
inner edges of the pad pattern. This ensures that shorting is
avoided.
Thermal vias can be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at a 1.2 mm
pitch grid. The via diameter should be between 0.3 mm and
0.33 mm, and the via barrel should be plated with 1 oz. copper
to plug the via.
The user should connect the printed circuit board thermal pad
to AGND.
Data Sheet ADF4113HV
Rev. B | Page 17 of 20
OUTLINE DIMENSIONS
0.50
BSC
0.65
0.60
0.55
0.30
0.25
0.18
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGD-1.
BOTTOM VIEWTOP VIEW
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.30
2.10 SQ
2.00
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
08-16-2010-B
Figure 26. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm x 4 mm Body, Very Very Thin Quad
(CP-20-6)
Dimensions shown in millimeters
16
9
81
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 27. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
2
ADF4113HVBRUZ −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4113HVBRUZ-RL −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4113HVBRUZ-RL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4113HVBCPZ −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADF4113HVBCPZ-RL −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADF4113HVBCPZ-RL7 −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
EV-ADF4113HVSD1Z Evaluation Board
1
Z = RoHS Compliant Part.
2
The CP-20-6 package was formerly the CP-20-1 package.

ADF4113HVBRUZ-RL7

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Phase Locked Loops - PLL High VTG Charge Pump
Lifecycle:
New from this manufacturer.
Delivery:
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