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MAX5876EGK+TD

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P19
General Description
The MAX5876 is an advanced 12-bit, 250Msps, dual
digital-to-analog converter (DAC). This DAC meets the
demanding performance requirements of signal synthesis
applications found in wireless base stations and other
communications applications. Operating from +3.3V and
+1.8V supplies, this dual DAC offers exceptional dynamic
performance such as 75dBc spurious-free dynamic range
(SFDR) at f
OUT
= 16MHz and supports update rates of
250Msps, with a power dissipation of only 287mW.
The MAX5876 utilizes a current-steering architecture
that supports a 2mA to 20mA full-scale output current
range, and allows a 0.1V
P-P
to 1V
P-P
differential output
voltage swing. The device features an integrated +1.2V
bandgap reference and control amplifier to ensure
high-accuracy and low-noise performance. A separate
reference input (REFIO) allows for the use of an exter-
nal reference source for optimum flexibility and
improved gain accuracy.
The clock inputs of the MAX5876 accept both LVDS
and LVPECL-compatible voltage levels. The device fea-
tures an interleaved data input that allows a single
LVDS bus to support both DACs. The MAX5876 is avail-
able in a 68-pin QFN package with an exposed pad
(EP) and is specified for the extended temperature
range (-40°C to +85°C).
Refer to the MAX5877 and MAX5878 data sheets for
pin-compatible 14-bit and 16-bit versions of the
MAX5876, respectively. Refer to the MAX5873 data
sheet for a CMOS-compatible version of the MAX5876.
Applications
Base Stations: Single-Carrier UMTS, CDMA, GSM
Communications: Fixed Broadband Wireless Access,
Point-to-Point Microwave
Direct Digital Synthesis (DDS)
Cable Modem Termination Systems (CMTS)
Automated Test Equipment (ATE)
Instrumentation
Features
♦ 250Msps Output Update Rate
♦ Noise Spectral Density = -154dBFS/Hz
at f
OUT
= 16MHz
♦ Excellent SFDR and IMD Performance
SFDR = 75dBc at f
OUT
= 16MHz (to Nyquist)
SFDR = 71dBc at f
OUT
= 80MHz (to Nyquist)
IMD = -87dBc at f
OUT
= 10MHz
IMD = -73dBc at f
OUT
= 80MHz
♦ ACLR = 75dB at f
OUT
= 61MHz
♦ 2mA to 20mA Full-Scale Output Current
♦ LVDS-Compatible Digital and Clock Inputs
♦ On-Chip +1.20V Bandgap Reference
♦ Low 287mW Power Dissipation
♦ Compact 68-Pin QFN-EP Package (10mm x 10mm)
♦ Evaluation Kit Available (MAX5878EVKIT)
MAX5876
12-Bit, 250Msps, High-Dynamic-Performance,
Dual DAC with LVDS Inputs
________________________________________________________________ Maxim Integrated Products 1
5859606162 5455565763
38
39
40
41
42
43
44
45
46
47
DV
DD3.3
AV
DD1.8
B3N
QFN
TOP VIEW
B3P
DV
DD1.8
B4N
B4P
B5N
B5P
B6N
B6P
B7N
5253
B7P
B8N
DACREF
AV
DD3.3
GND
GND
AV
DD3.3
OUTQP
OUTQN
GND
GND
OUTIP
OUTIN
AV
DD3.3
GND
AV
DD3.3
B10P
B11N
B11P
SELIQN
SELIQP
XORP
XORN
PD
TORB
CLKP
35
36
37
CLKN
GND
AV
CLK
GND
N.C.
N.C.
N.C.
N.C.
REFIO
GND
AV
DD3.3
GND
GND
N.C.
N.C.
N.C.
N.C.
48 B10N
B0N
64
B2P
656667
B1N
B1P
B2N
68
B0P
2322212019 2726252418 2928 323130
GND
AV
DD1.8
3433
49
50
B9N
B9P
51 B8P
11
10
9
8
7
6
5
4
3
2
16
15
14
13
12
1
FSADJ 17
MAX5876
Pin Configuration
Ordering Information
19-3634; Rev 2; 3/07
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
*EP = Exposed pad.
+= Lead-free package. D = Dry pack.
EVALUATION KIT
AVAILABLE
PART
TEMP RANGE
PIN-
PACKAGE
PKG
CODE
MAX5876EGK-D
-40°C to +85°C 68 QFN-EP*
G6800-4
MAX5876EGK+D
-40°C to +85°C 68 QFN-EP*
G6800-4
Selector Guide
PART
RESOLUTION
(BITS)
UPDATE
RATE (Msps)
LOGIC
INPUTS
MAX5873 12 200 CMOS
MAX5874 14 200 CMOS
MAX5875 16 200 CMOS
MAX5876 12 250 LVDS
MAX5877 14 250 LVDS
MAX5878 16 250 LVDS
MAX5876
12-Bit, 250Msps, High-Dynamic-Performance,
Dual DAC with LVDS Inputs
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AV
DD1.8
, DV
DD1.8
to GND, DACREF...................-0.3V to +2.16V
AV
DD3.3
, DV
DD3.3
, AV
CLK
to GND, DACREF........-0.3V to +3.9V
REFIO, FSADJ to
GND, DACREF..................................-0.3V to (AV
DD3.3
+ 0.3V)
OUTIP, OUTIN, OUTQP,
OUTQN to GND, DACREF...................-1V to (AV
DD3.3
+ 0.3V)
CLKP, CLKN to GND, DACREF..............-0.3V to (AV
CLK
+ 0.3V)
B11P/B11N–B0P/B0N, XORN, XORP, SELIQN,
SELIQP to GND, DACREF ...................-0.3V to (DV
DD1.8
+ 0.3V)
TORB, PD to GND, DACREF ...............-0.3V to (DV
DD3.3
+ 0.3V)
Continuous Power Dissipation (T
A
= +70°C)
68-Pin QFN-EP
(derate 41.7mW/°C above +70°C) (Note 1)............3333.3mW
Thermal Resistance
θ
JA
(Note 1)...................................+24°C/W
Operating Temperature Range ......................... -40°C to +85°C
Junction Temperature .................................................... +150°C
Storage Temperature Range ........................... -60°C to +150°C
Lead Temperature (soldering, 10s) ............................... +300°C
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX
UNITS
STATIC PERFORMANCE
Resolution 12 Bits
Integral Nonlinearity INL Measured differentially
±0.2
LSB
Differential Nonlinearity DNL Measured differentially
±0.1
LSB
Offset Error OS
-0.025 ±0.001 +0.025
%FS
Offset-Drift Tempco
±10
ppm/°C
Full-Scale Gain Error GE
FS
External reference
-4.6 -0.6 +4.6
%FS
Internal reference
±100
Gain-Drift Tempco
External reference
±50
ppm/°C
Full-Scale Output Current
I
OUTFS
(Note 3) 2 20 mA
Output Compliance Single-ended
-0.5 +1.1
V
Output Resistance R
OUT
1MΩ
Output Capacitance C
OUT
5pF
DYNAMIC PERFORMANCE
Clock Frequency f
CLK
2
500
MHz
Output Update Rate f
DAC
f
DAC
= f
CLK
/ 2 1
250
Msps
f
DAC
= 150MHz f
OUT
= 16MHz, -12dBFS
-154
Noise Spectral Density
f
DAC
= 250MHz f
OUT
= 80MHz, -12dBFS
-153
dBFS/
Hz
ELECTRICAL CHARACTERISTICS
(AV
DD3.3
= DV
DD3.3
= AV
CLK
= +3.3V, AV
DD1.8
= DV
DD1.8
= +1.8V, GND = 0, f
CLK
= 2 x f
DAC
, external reference V
REFIO
= +1.25V, out-
put load 50Ω double-terminated, transformer-coupled output, I
OUTFS
= 20mA, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values
are at T
A
= +25°C.) (Note 2)
Note 1: Thermal resistance based on a multilayer board with 4 x 4 via array in exposed paddle area.
MAX5876
12-Bit, 250Msps, High-Dynamic-Performance,
Dual DAC with LVDS Inputs
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(AV
DD3.3
= DV
DD3.3
= AV
CLK
= +3.3V, AV
DD1.8
= DV
DD1.8
= +1.8V, GND = 0, f
CLK
= 2 x f
DAC
, external reference V
REFIO
= +1.25V, out-
put load 50Ω double-terminated, transformer-coupled output, I
OUTFS
= 20mA, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values
are at T
A
= +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX
UNITS
f
OUT
= 1MHz, 0dBFS 98
f
OUT
= 1MHz, -6dBFS 88
f
OUT
= 1MHz, -12dBFS 81
f
OUT
= 10MHz, -12dBFS 77
f
DAC
= 100MHz
f
OUT
= 30MHz, -12dBFS 77
f
OUT
= 10MHz, -12dBFS 75
f
OUT
= 16MHz, -12dBFS 66 75
f
OUT
= 50MHz, -12dBFS 73
f
DAC
= 200MHz
f
OUT
= 80MHz, -12dBFS 71
f
OUT
= 10MHz, -12dBFS 77
f
OUT
= 50MHz, -12dBFS 73
f
OUT
= 80MHz, -12dBFS 70
Spurious-Free Dynamic Range
to Nyquist
SFDR
f
DAC
= 250MHz
f
OUT
= 100MHz, -12dBFS
68
dBc
Spurious-Free Dynamic Range,
25MHz Bandwidth
SFDR f
DAC
= 150MHz f
OUT
= 16MHz, -12dBFS 80
dBc
f
DAC
= 100MHz
f
OUT1
= 9MHz, -7dBFS;
f
OUT2
= 10MHz, -7dBFS
-87
Two-Tone IMD
TTIMD
f
DAC
= 200MHz
f
OUT1
= 79MHz, -7dBFS;
f
OUT2
= 80MHz, -7dBFS
-73
dBc
Four-Tone IMD, 1MHz
FTIMD
f
DAC
= 150MHz f
OUT
= 16MHz, -12dBFS -91
dBc
Adjacent Channel Leakage Power
Ratio 3.84MHz Bandwidth,
W-CDMA Model
ACLR
f
DAC
=
184.32MHz
f
OUT
= 61.44MHz 75 dB
Output Bandwidth
BW
-1dB
(Note 4)
240
MHz
INTER-DAC CHARACTERISTICS
f
OUT
= DC - 80MHz
±0.2
Gain Matching
∆Gain
f
OUT
= DC
-0.25 +0.01 +0.25
dB
Gain-Matching Tempco
∆Gain/°C ±20
ppm/°C
Phase Matching
∆Phase
f
OUT
= 60MHz
±0.25
D egr ees
Phase-Matching Tempco
∆Phase/°C
f
OUT
= 60MHz
±0.002
D eg r ees/
°C
Channel-to-Channel Crosstalk f
DAC
= 200Msps, f
OUT
= 50MHz, 0dBFS 90 dB
REFERENCE
V
REFIO
1.14
1.2
1.26
V
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P19

MAX5876EGK+TD

Mfr. #:
Buy MAX5876EGK+TD
Manufacturer:
Maxim Integrated
Description:
Digital to Analog Converters - DAC 12-Bit 2Ch 250Msps DAC
Lifecycle:
New from this manufacturer.
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