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BGU7258X

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21
NXP Semiconductors
BGU7258
5 GHz ISM SiGe:C low-noise amplifier MMIC with bypass
BGU7258 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product data sheet Rev. 3 — 29 August 2018
16 / 21
12 Package outline
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT1189-1 - - -
- - -
- - -
sot1189-1_po
10-10-11
18-08-14
Unit
(1)
mm
max
nom
min
0.50
0.48
0.46
0.05
0.00
0.30
0.25
0.20
1.7
1.6
1.5
1.3
1.2
1.1
1.7
1.6
1.5
0.5 1
0.35
0.30
0.25
0.05
A
Dimensions
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
HXSON6: plastic, thermal enhanced extremely thin small outline package; no leads;
6 terminals; body 1.6 x 1.6 x 0.5 mm
SOT1189-1
A
1
A
3
0.127
b D D
h
E E
h
0.6
0.5
0.4
e e
1
k
0.2
L v
0.1
w
0.05
y
0.05
y
1
0 1 2 mm
scale
D
E
B A
terminal 1
index area
X
detail X
A
A
1
A
3
C
y
C
y
1
D
h
E
h
k
L
b
e
1
e
AC Bv
Cw
terminal 1
index area
46
31
Figure 35. Package outline SOT1189-1 (HXSON6)
NXP Semiconductors
BGU7258
5 GHz ISM SiGe:C low-noise amplifier MMIC with bypass
BGU7258 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product data sheet Rev. 3 — 29 August 2018
17 / 21
13 Soldering
SOT1189-1Footprint information for reflow soldering of HXSON6 package
sot1189-1_fr
Issue date
0.2
0.20.4
1.0
1.3
0.25 0.50
1.33
1.4
1.85
0.2
0.2 0.6 0.8 1.85
0.350.4
1.051.852.1
14-08-22
14-09-01
occupied area
solder paste
solder resist
solder lands
Dimensions in mm
Figure 36. Reflow soldering footprint
NXP Semiconductors
BGU7258
5 GHz ISM SiGe:C low-noise amplifier MMIC with bypass
BGU7258 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product data sheet Rev. 3 — 29 August 2018
18 / 21
14 Abbreviations
Table 11. Abbreviations
Acronym Description
CW continuous wave
ESD electrostatic discharge
EVM error vector magnitude
HBM human body model
IEEE institute of electrical and electronics engineers
ISM industrial scientific medical
LTE long-term evolution
LTE-U long-term evolution unlicensed
MMIC monolithic microwave-integrated circuit
MSL moisture sensitivity level
RHF RoHS halogen free
QFN quad-flat no-leads
SiGe:C silicon germanium carbon
SMA sub miniature-version A
WLAN wireless local area network
15 Revision history
Table 12. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BGU7258 v.3 20180829 Product data sheet - BGU7258 v.2
Modifications: Package outline changed
BGU7258 v.2 20141030 Product data sheet - BGU7258 v.1
Modifications: • The status of this document has been changed to Product data sheet.
BGU7258 v.1 20141023 Preliminary data sheet - -
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21

BGU7258X

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Manufacturer:
NXP Semiconductors
Description:
RF Amplifier 5 GHz ISM SiGe:C low noise amp
Lifecycle:
New from this manufacturer.
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