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AT25128N1-10SI-1.8

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P22
13
AT25128/256
0872O–SEEPR–03/05
Notes: 1. This device is not recommended for new designs. Please refer to AT25128A.
2. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC Characteristics
tables.
AT25128
(1)
Ordering Information
Ordering Code
(2)
Package Operation Range
AT25128-10PI-2.7
AT25128N-10SI-2.7
AT25128W-10SI-2.7
AT25128N1-10SI-2.7
AT25128T1-10TI-2.7
8P3
8S1
8S2
16S1
14A2
Industrial Temperature
(–40°C to 85°C)
AT25128-10PI-1.8
AT25128N-10SI-1.8
AT25128W-10SI-1.8
AT25128N1-10SI-1.8
AT25128T1-10TI-1.8
8P3
8S1
8S2
16S1
14A2
Industrial Temperature
(–40°C to 85°C)
AT25128N-10SJ-2.7
AT25128N-10SJ-1.8
8S1
8S1
Lead-Free/Industrial Temperature
(–40°C to 85°C)
AT25128N-10SE-2.7 8S1
High Grade/Extended Temperature
(–40°C to 125°C)
Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8S2 8-lead, 0.200" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
16S1 16-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
14A2 14-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
Options
–
2.7 Low-voltage (2.7V to 5.5V)
–1.8 Low-voltage (1.8V to 5.5V)
14
AT25128/256
0872O–SEEPR–03/05
Notes: 1. This device is not recommended for new designs. Please refer to AT25256A.
2. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC Characteristics
tables.
AT25256
(1)
Ordering Information
Ordering Code
(2)
Package Operation Range
AT25256-10PI-2.7
AT25256W-10SI-2.7
AT25256-10CI-2.7
AT25256T2-10TI-2.7
8P3
8S2
8CN3
20A2
Industrial Temperature
(–40°C to 85°C)
AT25256-10PI-1.8
AT25256W-10SI-1.8
AT25256-10CI-1.8
AT25256T2-10TI-1.8
8P3
8S2
8CN3
20A2
Industrial Temperature
(–40°C to 85°C)
AT25256W-10SJ-2.7
AT25256W-10SJ-1.8
8S2
8S2
Lead-Free/Industrial Temperature
(–40°C to 85°C)
AT25256W-10SE-2.7 8S2
High Grade/Extended Temperature
(–40°C to 125°C)
Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)
8S2 8-lead, 0.200" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8CN3 8-lead, 0.230" Wide, Leadless Array Package (LAP)
20A2 20-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
Options
–
2.7 Low-voltage (2.7V to 5.5V)
–1.8 Low-voltage (1.8V to 5.5V)
15
AT25128/256
0872O–SEEPR–03/05
Packaging Information
8P3 – PDIP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
01/09/02
8P3
B
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicu
lar to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL
MIN
NOM
MAX
NOTE
D
D1
E
E1
e
L
b2
b
A2 A
1
N
eA
c
b3
4 PLCS
A
–
–
0.210 2
A2 0.115 0.130 0.195
b 0.014 0.018 0.022 5
b2 0.045 0.060 0.070 6
b3 0.030 0.039 0.045 6
c 0.008 0.010 0.014
D 0.355 0.365 0.400 3
D1 0.005
–
–
3
E 0.300 0.310 0.325 4
E1 0.240 0.250 0.280 3
e 0.100 BSC
eA 0.300 BSC 4
L 0.115 0.130 0.150 2
Top View
Side View
End View
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P22

AT25128N1-10SI-1.8

Mfr. #:
Buy AT25128N1-10SI-1.8
Manufacturer:
Description:
IC EEPROM 128K SPI 16SOIC
Lifecycle:
New from this manufacturer.
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