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AT25128N1-10SI-1.8

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P22
16
AT25128/256
0872O–SEEPR–03/05
8S1 – JEDEC SOIC
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
DRAWING NO.
R
REV.
Note:
10/7/03
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
8S1 B
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A1 0.10 – 0.25
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
A 1.35 – 1.75
B 0.31 – 0.51
C 0.17 – 0.25
D 4.80 – 5.00
E1 3.81 – 3.99
E 5.79 – 6.20
e 1.27 BSC
L 0.40 – 1.27
∅ 0° – 8°
∅
Top View
End View
Side View
e
B
D
A
A1
N
E
1
C
E1
L
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8S2 – EIAJ SOIC
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8S2, 8-lead, 0.209" Body, Plastic Small
Outline Package (EIAJ)
10/7/03
8S2
C
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information.
2. Mismatch of the upper and lower dies and resin burrs are not included.
3. It is recommended that upper and lower cavities be equal. If they are different, the larger dimension shall be regarded.
4. Determines the true geometric position.
5. Values b and C apply to pb/Sn solder plated terminal. The standard thickness of the solder layer sha
ll be 0.010 +0.010/−0.005 mm.
A 1.70 2.16
A1 0.05 0.25
b 0.35 0.48 5
C 0.15 0.35 5
D 5.13 5.35
E1 5.18 5.40 2, 3
E 7.70 8.26
L 0.51 0.85
∅
0° 8°
e 1.27 BSC 4
End View
Side View
e
b
A
A1
D
E
N
1
C
E1
∅
L
Top View
18
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8CN3 – LAP
1150 E.Cheyenne Mtn Blvd.
Colorado Springs, CO 80906
TITLE
DRAWING NO.
R
REV.
8CN3, 8-lead, (6 x 5 x 1.04 mm Body), Lead Pitch 1.27 mm,
Leadless Array Package (LAP)
B
8CN3
11/8/04
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A 0.94 1.04 1.14
A1 0.30 0.34 0.38
b 0.36 0.41 0.46 Note 1
D 5.89 5.99 6.09
E 4.83 4.93 5.03
e 1.27 BSC
e1 0.56 REF
L 0.62 0.67 0.72 Note 1
L1 0.92 0.97 1.02 Note 1
Note: 1. Metal Pad Dimensions.
2. All exposed metal area shall have the following finished platings.
Ni: 0.0005 to 0.015 mm
Au: 0.0005 to 0.001 mm
Pin1 Corner
Marked Pin1 Indentifier
0.10 mm
TYP
4
3
2
1
5
6
7
8
Top View
L
b
e
L1
e1
Side View
A1
A
Bottom View
E
D
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AT25128N1-10SI-1.8

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Description:
IC EEPROM 128K SPI 16SOIC
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