16
IDT72V805/72V815/72V825/72V835/72V845
3.3 V CMOS DUAL SyncFIFO™ 256 x 18, 512 x 18, 1,024 x 18, 4,096 x 18
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
NOTES:
1. D = maximum FIFO Depth.
In IDT Standard Mode: D = 256 for the IDT72V805, 512 for the IDT72V815, 1,024 for the IDT72V825, 2,048 for the IDT72V835 and 4,096 for the IDT72V845. In FWFT Mode:
D = 257 for the IDT72V805, 513 for the IDT72V815, 1,025 for the IDT72V825, 2,049 for the IDT72V835 and 4,097 for the IDT72V845.
2. For IDT Standard Mode.
3. For FWFT Mode.
4. Select this mode by setting (FL, RXI, WXI) = (0,0,0), (0,0,1), (0,1,0), (1,0,0), (1,0,1) or (1,1,0) during Reset.
WCLK
t
ENS
t
ENH
WEN
HF
t
ENS
RCLK
REN
4295 drw 15
D/2 words in FIFO
(2)
,
[ + 1] words in FIFO
(3)
D-1
2
D/2 + 1 words in FIFO
(2)
,
[ + 2] words in FIFO
(3)
D-1
2
D/2 words in FIFO
(2)
,
[ + 1] words in FIFO
(3)
D-1
2
t
HF
t
HF
t
CLKL
t
CLKH
NOTES:
1. m = PAF offset.
2. D = maximum FIFO Depth.
In IDT Standard Mode: D = 256 for the IDT72V805, 512 for the IDT72V815, 1,024 for the IDT72V825, 2,048 for the IDT72V835 and 4,096 for the IDT72V845. In FWFT Mode:
D = 257 for the IDT72V805, 513 for the IDT72V815, 1,025 for the IDT72V825, 2,049 for the IDT72V835 and 4,097 for the IDT72V845.
3. PAF is asserted to LOW on WCLK transition and reset to HIGH on RCLK transition.
4. Select this mode by setting (FL, RXI, WXI) = (0,0,0), (0,0,1), (0,1,0), (0,1,1) or (1,1,1) during Reset.
WCLK
t
CLKH
t
CLKL
t
ENS
t
ENH
WEN
PAF
t
ENS
t
PAFA
D - (m + 1) words
in FIFO
RCLK
t
PAFA
REN
(1)
4295 drw 14
D - m words
in FIFO
D - (m + 1) words in FIFO
Figure 14. Asynchronous Programmable Almost-Full Flag Timing (IDT Standard and FWFT Modes)
Figure 15. Half-Full Flag Timing (IDT Standard and FWFT Modes)
IDT72V805/72V815/72V825/72V835/72V845
3.3 V CMOS DUAL SyncFIFO™ 256 x 18, 512 x 18, 1,024 x 18, 4,096 x 18
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
17
RXI
RCLK
t
t
XI
XIS
4295 drw 19
WXI
WCLK
t
XI
t
XIS
4295 drw 18
NOTE:
1. Read from Last Physical Location.
RCLK
REN
RXO
Note 1
4295 drw 17
t
XO
t
XO
t
CLKH
t
ENS
NOTE:
1. Write to Last Physical Location.
WCLK
WEN
WXO
Note 1
4295 drw 16
t
XO
t
CLKH
t
ENS
t
XO
Figure 17. Read Expansion Out Timing
Figure 16. Write Expansion Out Timing
Figure 18. Write Expansion In Timing
Figure 19. Read Expansion In Timing
18
IDT72V805/72V815/72V825/72V835/72V845
3.3 V CMOS DUAL SyncFIFO™ 256 x 18, 512 x 18, 1,024 x 18, 4,096 x 18
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
Figure 20. Write Timing with Synchronous Programmable Flags (FWFT Mode)
W1 W2 W4
W[n +2] W[D-m-1]
W[D-m-2]
W[D-1]
WD
W[n+3]
W[n+4]
W[D-m] W[D-m+1]
WCLK
WEN
D
0 - D17
RCLK
tDH
tDS
tENS
tSKEW1
REN
Q0 - Q17
PAF
HF
PAE
IR
tDS
tDS
tDS
tSKEW2
tA
tREF
OR
tPAES
tHF
tWFF
W[D-m+2]
W1
tENH
4295 drw 20
DATA IN OUTPUT REGISTER
(2)
W3
1
2
3
1
1
D-1
2
+1
][
W
D-1
+2
][
W
2
D-1
+3
][
W
2
tPAFS
NOTES:
1. t
SKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge for OR to go LOW after two RCLK cycles plus tREF. If the time between the rising edge of WLCK and the rising edge of RCLK is less than
t
SKEW1, then the OR deassertion may be delayed one extra RCLK cycle.
2. t
SKEW2 is the minimum time between a rising WCLK edge and a rising RCLK edge for PAE to go HIGH during the current clock cycle. If the time between the rising edge of WCLK and the rising edge of RCLK is less than
t
SKEW2, then the PAE deassertion may be delayed one extra RCLK cycle.
3. LD = HIGH, OE = LOW
4. n = PAE offset, m = PAF offset, D = maximum FIFO depth = 257 words for the IDT72V805, 513 words for the IDT72V815, 1,025 words for the IDT72V825, 2,049 words for the IDT72V835 and 4,097 words for the IDT72V845.
5. Select this mode by setting (FL, RXI, WXI) = (1,0,1) during Reset.

72V815L10PF

Mfr. #:
Manufacturer:
Description:
FIFO 3.3V 1KX18 SYNC FIFO
Lifecycle:
New from this manufacturer.
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