NOIL1SM0300A
www.onsemi.com
8
Operation and Signaling
Power Supplies
Every module on chip such as column amplifiers, output
stages, digital modules, and drivers has its own power
supply and ground. Off chip the grounds can be combined,
but not all power supplies may be combined. This results in
several different power supplies, but this is required to
reduce electrical cross-talk and to improve shielding,
dynamic range, and output swing.
On chip, the ground lines of every module are kept
separate to improve shielding and electrical cross-talk
between them.
An overview of the supplies is given in Table 7 and
Table 8. Table 8 summarizes the supplies realted to the pixel
array signals, where Table 7 summarizes the supplies related
with all other modules.
Table 7. FRAME RATE PARAMETERS
Name DC Current Peak Current Typ Max Description
V
DDA
15.7 mA 50 mA 2.5 V 5% Power supply analog readout module
V
DDD
6.7 mA 50 mA 2.5 V 2.5 V Power supply digital modules
V
ADC
32.7 mA 100 mA 2.5 V 5% Power supply of ADC circuitry
V
DDO
3.5 mA 100 mA 2.5 V 5% Power supply output drivers
Table 8. OVERVIEW OF THE POWER SUPPLIES RELATED TO PIXEL SIGNALS
Name DC Current Peak Current Min Typ Max Description
V
PIX
3 mA 100 mA 2.5 V Power supply pixel array
V
RES
1 mA
10 mA 3.0 V 3.3 V 3.5 V Power supply reset drivers
V
RES_DS
1 mA
10 mA 2.8 V Power supply reset dual slope drivers
V
RES_TS
1 mA
10 mA 2.0 V Power supply reset triple slope drivers
V
MEM_H
1 mA 1 mA
3.0 V 3.3 V 3.5 V Power supply for memory element in pixel
GND
DRIVERS
0 V Ground of the pixel array drivers
The maximum currents mentioned in Table 7 and Table 8
are peak currents. All power supplies should be able to
deliver these currents except for Vmem_l, which must be
able to sink this current.
Note that no power supply filtering on chip is
implemented and that noise on these power supplies can
contribute immediately to the noise on the signal. The
voltage supplies V
PIX,
V
DDA
and V
ADC
are especially
important to be noise free.