ADCLK944
Rev. 0 | Page 12 of 12
OUTLINE DIMENSIONS
3.10
3.00 SQ
2.90
0.30
0.25
0.18
1.60
1.50 SQ
1.40
111808-A
1
0.50
BSC
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
0.45
0.40
0.35
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.80
0.75
0.70
COMPLIANT
TO
JEDEC STANDARDS MO-220-WEED-6.
Figure 22. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
3 mm × 3 mm Body, Very Very Thin Quad
(CP-16-18)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding Code
ADCLK944BCPZ-R2 −40°C to +85°C 16-Lead LFCSP_WQ CP-16-18 Y2K
ADCLK944BCPZ-R7 −40°C to +85°C 16-Lead LFCSP_WQ CP-16-18 Y2K
ADCLK944BCPZ-WP −40°C to +85°C 16-Lead LFCSP_WQ CP-16-18 Y2K
ADCLK944/PCBZ Evaluation Board
1
Z = RoHS Compliant Part.
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registered trademarks are the property of their respective owners.
D08770-0-3/10(0)
