SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.4 — 17 March 2014
178844 31 of 37
NXP Semiconductors
SL3S1203_1213
UCODE G2iL and G2iL+
[19] U.S. Code of Federal Regulations (CFR), Title 47, Chapter I, Part 15:
Radio-frequency devices, U.S. Federal Communications Commission.
[20] Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**
4
[21] Application note - FAQ UCODE G2i, BU-ID document number: AN10940
[22] Application note - UCODE G2iM+ demo board documentation, BU-ID document
number: AN11237
4. ** ... document version number
SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.4 — 17 March 2014
178844 32 of 37
NXP Semiconductors
SL3S1203_1213
UCODE G2iL and G2iL+
17. Revision history
Table 33. Revision history
Document ID Release date Data sheet status Change notice Supersedes
SL3S1203_1213 v.4.4 20140317 Product data sheet - SL3S1203_1213 v.4.3
Modifications:
Table 8 “G2iL, G2iL+ overall memory map: Table notes updated
Figure 5 “G2iL TID memory structure: TIDs updated
SL3S1203_1213 v.4.3 20131127 Product data sheet - SL3S1203_1213 v.4.2
Modifications:
Figure 5 “G2iL TID memory structure: updated
SL3S1203_1213 v.4.2 20130701 Product data sheet - SL3S1203_1213 v.4.1
Modifications:
Update of delivery form
Update RF field detection
SL3S1203_1213 v.4.1 20120917 Product data sheet - SL3S1203_1213 v.4.0
Modifications:
Update of delivery form
SL3S1203_1213 v.4.0 20120227 Product data sheet - SL3S1203_1213 v.3.9
Modifications:
Figure 4 “G2iL wafer layout”: Figure notes (1) and (2) updated
SL3S1203_1213 v.3.9 20120130 Product data sheet - SL3S1203_1213 v.3.8
Modifications:
Table 6 “Specifications”: “Passivation on front” updated
Section 15.2.1 “General assembly recommendations”: updated
SL3S1203_1213 v.3.8 20120111 Product data sheet - SL3S1203_1213 v.3.7
Modifications:
Section 8.1 “Wafer layout”: Figure notes (1) and (2) updated
SL3S1203_1213 v.3.7 20111124 Product data sheet - SL3S1203_1213 v.3.6
Modifications:
Table 11 “G2iL, G2iL+ overall memory map”: updated
Table 34 “G2iL, G2iL+ RF interface characteristics (RFN, RFP)”: updated
SL3S1203_1213 v.3.6 20110803 Product data sheet - SL3S1203_1213 v.3.5
Modifications:
Real Read Range Reduction feature added to G2iL
SL3S1203_1213 v.3.5 20110531 Product data sheet - SL3S1203_1213 v.3.4
Modifications:
Superfluous text removed from Table 6
SL3S1203_1213 v.3.4 20110511 Product data sheet - SL3S1203_1213 v.3.3
Modifications:
Security status changed into COMPANY PUBLIC
Delivery form of FCS2 strap added
Section 13 “Package information”, Section 15 “Handling information” and Section 16
“Packing information” added
SL3S1203_1213 v.3.3 20110131 Product data sheet - SL3S1203_1213 v.3.2
Modifications:
Section 4 “Ordering information”: new types SL3S1203FUD and SL3S1213FUD added
Section 9 “Mechanical specification”: updated according to the new types
Replaced wording of “ChangeStatus” with “ChangeConfig
SL3S1203_1213 v.3.2 20101109 Product data sheet - SL3S1203_1213 v.3.1
Modifications:
Version SOT886F1 added
Section 5 “Marking”, Section 13 “Package outline” and Section 14 “Packing information”
added
SL3S1203_1213 v.3.1 20100922 Product data sheet - SL3S1203_1213 v.3.0
Modifications:
General Modifications
SL3S1203_1213 v.3.0 20100621 Product data sheet - 178810
SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.4 — 17 March 2014
178844 33 of 37
NXP Semiconductors
SL3S1203_1213
UCODE G2iL and G2iL+
Modifications: General update
178810 20100304 Objective data sheet - -
Table 33. Revision history
…continued
Document ID Release date Data sheet status Change notice Supersedes

SL3S1203FTB0,115

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
RFID Transponders UCODE G2IL AND G2IL
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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