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SL3S1203FTB0,115

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P37
SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.4 — 17 March 2014
178844 4 of 37
NXP Semiconductors
SL3S1203_1213
UCODE G2iL and G2iL+
6. Block diagram
The SL3S12x3 IC consists of three major blocks:
- Analog Interface
- Digital Control
- EEPROM
The analog part provides stable supply voltage and demodulates data received from the
reader for being processed by the digital part. Further, the modulation transistor of the
analog part transmits data back to the reader.
The digital section includes the state machines, processes the protocol and handles
communication with the EEPROM, which contains the EPC and the user data.
Fig 1. Block diagram of G2iL IC
001aam226
MOD
DEMOD
VREG
VDD
VDD
data
in
data
out
R/W
ANALOG
RF INTERFACE
PAD
PAD
RECT
DIGITAL CONTROL
ANTENNA
ANTICOLLISION
READ/WRITE
CONTROL
ACCESS CONTROL
EEPROM INTERFACE
CONTROL
RF INTERFACE
CONTROL
I/O CONTROL
I/O
CONTROL
EEPROM
MEMORY
SEQUENCER
CHARGE PUMP
PAD
OUT
PAD
SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.4 — 17 March 2014
178844 5 of 37
NXP Semiconductors
SL3S1203_1213
UCODE G2iL and G2iL+
7. Pinning information
7.1 Pin description
Fig 2. Pinning bare die Fig 3. Pin configuration for SOT886
001aam529
VDD
OUT RFN
RFPNXP trademark
SL3S12x3FTB0
n.c.
001aan103
RFP
RFN
n.c.
VDD
OUT
Transparent top view
2
3
1
5
4
6
Table 3. Pin description bare die
Symbol Description
OUT output pin
RFN grounded antenna connector
VDD external supply
RFP ungrounded antenna connector
Table 4. Pin description SOT886
Pin Symbol Description
1 RFP ungrounded antenna connector
2 n.c. not connected
3 RFN grounded antenna connector
4 OUT output pin
5 n.c. not connected
6 VDD external supply
SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.4 — 17 March 2014
178844 6 of 37
NXP Semiconductors
SL3S1203_1213
UCODE G2iL and G2iL+
8. Wafer layout
8.1 Wafer layout
(1) Die to Die distance (metal sealring - metal sealring) 21,4 m, (X-scribe line width: 15 m)
(2) Die to Die distance (metal sealring - metal sealring) 21,4 m, (Y-scribe line width: 15 m)
(3) Chip step, x-length: 485 m
(4) Chip step, y-length: 435 m
(5) Bump to bump distance X (OUT - RFN): 383 m
(6) Bump to bump distance Y (RFN - RFP): 333 m
(7) Distance bump to metal sealring X: 40,3 m (outer edge - top metal)
(8) Distance bump to metal sealring Y: 40,3 m
Bump size X x Y: 60 m x 60 m
Remark: OUT and VDD are used with G2iL+ only
Fig 4. G2iL wafer layout
001aak871
not to scale!
(1)
(7)
(2)
(8)
(5)
(6)
(4)
(3)
Y
X
VDD
OUT RFN
RFP
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P37

SL3S1203FTB0,115

Mfr. #:
Buy SL3S1203FTB0,115
Manufacturer:
NXP Semiconductors
Description:
RFID Transponders UCODE G2IL AND G2IL
Lifecycle:
New from this manufacturer.
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