SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.4 — 17 March 2014
178844 34 of 37
NXP Semiconductors
SL3S1203_1213
UCODE G2iL and G2iL+
18. Legal information
18.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms
, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.4 — 17 March 2014
178844 35 of 37
NXP Semiconductors
SL3S1203_1213
UCODE G2iL and G2iL+
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
UCODE — is a trademark of NXP Semiconductors N.V.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.4 — 17 March 2014
178844 36 of 37
NXP Semiconductors
SL3S1203_1213
UCODE G2iL and G2iL+
20. Tables
Table 1. Ordering information. . . . . . . . . . . . . . . . . . . . . .3
Table 2. Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .3
Table 3. Pin description bare die . . . . . . . . . . . . . . . . . . .5
Table 4. Pin description SOT886 . . . . . . . . . . . . . . . . . . .5
Table 5. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Table 6. Overview of G2iL and G2iL+ features . . . . . . . .9
Table 7. G2iL memory sections . . . . . . . . . . . . . . . . . . .10
Table 8. G2iL, G2iL+ overall memory map. . . . . . . . . . .11
Table 9. ChangeConfig custom command . . . . . . . . . . .16
Table 10. ChangeConfig custom command reply. . . . . . .16
Table 11. ChangeConfig command-response table . . . . .16
Table 12. Address 200h to 207h . . . . . . . . . . . . . . . . . . .18
Table 13. Address 208h to 20Fh . . . . . . . . . . . . . . . . . . .18
Table 14. ReadProtect command. . . . . . . . . . . . . . . . . . .19
Table 15. G2iL reply to a successful ReadProtect
procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Table 16. ReadProtect command-response table . . . . . .19
Table 17. Reset ReadProtect command . . . . . . . . . . . . .20
Table 18. G2iL reply to a successful Reset
ReadProtect command. . . . . . . . . . . . . . . . . . .20
Table 19. Reset ReadProtect command-response
table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 20. ChangeEAS command . . . . . . . . . . . . . . . . . . 22
Table 21. G2iL reply to a successful ChangeEAS
command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 22. ChangeEAS command-response table . . . . . . 22
Table 23. EAS_Alarm command . . . . . . . . . . . . . . . . . . . 23
Table 24. G2iL reply to a successful EAS_Alarm c
ommand. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 25. EAS_Alarm command-response table . . . . . . 23
Table 26. Limiting values
[1][2]
. . . . . . . . . . . . . . . . . . . . . . 24
Table 27. G2iL, G2iL+ RF interface characteristics
(RFN, RFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 28. VDD pin characteristics . . . . . . . . . . . . . . . . . . 26
Table 29. G2iL, G2iL+ VDD and OUT
pin characteristics . . . . . . . . . . . . . . . . . . . . . . 26
Table 30. G2iL, G2iL+ memory characteristics . . . . . . . . 27
Table 31. G2iL RF interface characteristics
(RFN, RFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 32. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 33. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 32
21. Figures
Fig 1. Block diagram of G2iL IC . . . . . . . . . . . . . . . . . . .4
Fig 2. Pinning bare die. . . . . . . . . . . . . . . . . . . . . . . . . . .5
Fig 3. Pin configuration for SOT886 . . . . . . . . . . . . . . . .5
Fig 4. G2iL wafer layout. . . . . . . . . . . . . . . . . . . . . . . . . .6
Fig 5. G2iL TID memory structure . . . . . . . . . . . . . . . . .12
Fig 6. Schematic of connecting VDD and OUT pad
with a predetermined breaking point to turn a
standard RFID label into a wireless safety seal. .14
Fig 7. Schematic of external power supply . . . . . . . . . .16
Fig 8. Package outline SOT886. . . . . . . . . . . . . . . . . . .28

SL3S1203FTB0,115

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
RFID Transponders UCODE G2IL AND G2IL
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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