Data Sheet ADCMP604/ADCMP605
Rev. C | Page 7 of 14
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
ADCMP604
TOP VIEW
(Not to Scale)
Q
1
Q
6
EE
2
V
CCI
/V
CCO
5
V
P
3
V
N
4
05916-002
Figure 3. ADCMP604 Pin Configuration
Table 5. ADCMP604 Pin Function Descriptions (6-Lead SC70)
Pin No. Mnemonic Description
1 Q
Noninverting Output. Q is at logic high if the analog voltage at the noninverting input, V
P
, is greater than the
analog voltage at the inverting input, V
N
.
2 V
EE
Negative Supply Voltage.
3 V
P
Noninverting Analog Input.
4 V
N
Inverting Analog Input.
5 V
CCI
/V
CCO
Input Section Supply/Output Section Supply. V
CCI
and V
CCO
are shared pin.
6
Q
Inverting Output. Q is at logic low if the analog voltage at the noninverting input, V
P
, is greater than the analog
voltage at the inverting input, V
N
.
05916-003
NOTES
1. EXPOSED PAD. IF CONNECTED, THE
EPAD MUST BE CONNECTED TO V
EE
.
9
8
7
1
2
3
V
EE
LE/HYS
S
DN
V
CCO
V
CCI
V
EE
4
V
P
5
V
EE
6
V
N
12
Q
11
V
EE
10
Q
ADCMP605
TOP VIEW
(Not to Scale)
Figure 4. ADCMP605 Pin Configuration
Table 6. ADCMP605 Pin Function Descriptions (12-Lead LFCSP_WQ)
Pin No. Mnemonic Description
1 V
CCO
Output Section Supply.
2 V
CCI
Input Section Supply.
3, 5, 9, 11 V
EE
Negative Supply Voltages.
4 V
P
Noninverting Analog Input.
6 V
N
Inverting Analog Input.
7 S
DN
Shutdown. Drive this pin low to shut down the device.
8 LE/HYS Latch/Hysteresis Control. Bias with resistor or current for hysteresis; drive low to latch.
10
Q
Inverting Output. Q is at Logic low if the analog voltage at the noninverting input, V
P
, is greater than the
analog voltage at the inverting input, V
N
, if the comparator is in compare mode.
12 Q
Noninverting Output. Q is at Logic high if the analog voltage at the noninverting input, V
P
, is greater
than the analog voltage at the inverting input, V
N
, if the comparator is in compare mode.
Heat Sink Paddle V
EE
The metallic back surface of the package is electrically connected to V
EE
. It can be left floating because
Pin 3, Pin 5, Pin 9, and Pin 11 provide adequate electrical connection. It can also be soldered to the
application board if improved thermal and/or mechanical stability is desired.
EPAD Exposed Pad. If connected, the EPAD must be connected to V
EE
.
