26 Rev. 1.3
Si8660/61/62/63
5. Ordering Guide
Revision B devices are recommended for all new designs.
Table 13. Ordering Guide for Valid OPNs
1
Ordering Part
Number (OPN)
Number of
Inputs
VDD1 Side
Number of
Inputs
VDD2 Side
Max Data
Rate
(Mbps)
Default
Output
State
Isolation
rating
(kV)
Temp (°C) Package
Revision B Devices
2,3
Si8660BA-B-IS1 6 0 150 Low 1.0 –40 to 125 °C NB SOIC-16
Si8660BC-B-IS1 6 0 150 Low 3.75 –40 to 125 °C NB SOIC-16
Si8660EC-B-IS1 6 0 150 High 3.75 –40 to 125 °C NB SOIC-16
Si8660BD-B-IS 6 0 150 Low 5.0 –40 to 125 °C WB SOIC-16
Si8660ED-B-IS 6 0 150 High 5.0 –40 to 125 °C WB SOIC-16
Si8661BC-B-IS1 5 1 150 Low 3.75 –40 to 125 °C NB SOIC-16
Si8661EC-B-IS1 5 1 150 High 3.75 –40 to 125 °C NB SOIC-16
Si8661BD-B-IS 5 1 150 Low 5.0 –40 to 125 °C WB SOIC-16
Si8661ED-B-IS 5 1 150 High 5.0 –40 to 125 °C WB SOIC-16
Si8662BC-B-IS1 4 2 150 Low 3.75 –40 to 125 °C NB SOIC-16
Si8662EC-B-IS1 4 2 150 High 3.75 –40 to 125 °C NB SOIC-16
Si8662BD-B-IS 4 2 150 Low 5.0 –40 to 125 °C WB SOIC-16
Si8662ED-B-IS 4 2 150 High 5.0 –40 to 125 °C WB SOIC-16
Si8663BC-B-IS1 3 3 150 Low 3.75 –40 to 125 °C NB SOIC-16
Si8663EC-B-IS1 3 3 150 High 3.75 –40 to 125 °C NB SOIC-16
Si8663BD-B-IS 3 3 150 Low 5.0 –40 to 125 °C WB SOIC-16
Si8663ED-B-IS 3 3 150 High 5.0 –40 to 125 °C WB SOIC-16
Notes:
1. All packages are RoHS-compliant with peak reflow temperatures of 260 °C according to the JEDEC industry standard
classifications and peak solder temperatures.
Moisture sensitivity level is MSL3 for wide-body SOIC-16 packages.
Moisture sensitivity level is MSL2A for narrow-body SOIC-16 packages.
2. Revision A devices are supported for existing designs, but Revision B is recommended for all new designs.
3. All devices >1 kV
RMS
are AEC-Q100 qualified.