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SI8660BA-A-IS1
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
P28-P30
P31-P33
P34-P36
28
Rev. 1.3
Si8660/61/62/63
6. Package Outline: 16-Pin Wide Body SOIC
Figure 16 illustrates the p
ackage
details for the Si866x Digit
al Isolator
. T
a
ble 14 lists the values for the dimensions
shown in the illustration.
Figure 16. 16-Pin Wide
Body SOIC
T
able 14. Package Diagram Dimensions
Symbol
Millimeters
Min
Max
A
—
2.65
A1
0.1
0.3
D
10.3 BSC
E
10.3 BSC
E1
7.5 BSC
b
0.31
0.51
c
0.20
0.33
e
1.27 BSC
h
0.25
0.75
L
0.4
1.27
0°
7°
Rev. 1.3
29
Si8660/61/62/63
7. Land Pattern: 16-Pin Wide-Body SOIC
Figure
17 illustrates
the reco
mmended land pattern det
ails
for the Si866x in a 16-p
in wide-body SOIC. T
able
15
lists the values for the dimens
ions shown in the illustration.
Figure 17. 16-Pi
n SOIC Land Pattern
T
able 15. 16-Pin W
ide Body SOIC Land Pattern Dimensions
Dimension
Feature
(mm)
C1
Pad Column S
p
acing
9.40
E
Pad Row Pitch
1.27
X1
Pad Wi
dth
0.60
Y1
Pad Length
1.90
Notes:
1.
This Land Pattern Design is based o
n IPC-7351 pattern SOIC127P1032X265-16AN
for Density Level B (Median Land Pro
trusion).
2.
Al
l feature sizes shown are at Maximum Material Condition (MMC) and a card
fabrication tolerance of 0.05 mm is assumed.
30
Rev. 1.3
Si8660/61/62/63
8. Package Outline: 16
-Pin Narrow Body SOIC
Figure
18 illus
trates the package details for the Si866x in
a 16-pin narrow-body SOIC (SO-16). T
able
16 lists the
values for the di
mensions shown in the illustration.
Figure 18. 16-pin Small Outline Integrated Circu
it (SOIC) Package
T
able 16. Package Di
agram Dimensions
Dimension
Min
Max
A
—
1.75
A1
0.10
0.25
A2
1.25
—
b
0.31
0.51
c
0.17
0.25
D
9.90 BSC
E
6.00 BSC
E1
3.90 BSC
e
1.27 BSC
L
0.40
1.27
L2
0.25 BSC
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
P28-P30
P31-P33
P34-P36
SI8660BA-A-IS1
Mfr. #:
Buy SI8660BA-A-IS1
Manufacturer:
Silicon Labs
Description:
Digital Isolators 6 Ch 1 kV Isolator 150M 6/0 NB
Lifecycle:
New from this manufacturer.
Delivery:
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