Freescale Semiconductor, Inc.
Datasheet Addendum
© 2015 Freescale Semiconductor, Inc. All rights reserved.
This addendum identifies changes to Rev. 1.3 of the MC13201 datasheet. The changes described in this
addendum have not been implemented in the specified pages.
1 Case outline drawing change for new QFN-32 package
migration
The case outline was changed because of migration from gold wire to copper wire for QFN-32 packages.
The case outline details in Section 9 Packaging Information, should be replaced with package document
#98ASA00473D case outline details.
To view the new case outline details, go to freescale.com and perform a keyword search for the drawing’s
document number.
NOTE
For more information about QFN package use, see EB806 Electrical
Connection Recommendations for Exposed Pad on QFN and DFN
Packages.
Location: Section 9, Page 27
If you want the drawing for this package Then use this document number
QFN-32 98ASA00473D
Document Number: MC13201AD
Rev. 0, 04/2015
Addendum to Rev. 1.3 of the MC13201
Datasheet
