MC13201 Technical Data, Rev. 1.3,
Freescale Semiconductor 19
Since the MC13201 contains an on-chip reference frequency trim capability, it is possible to trim out
virtually all of the initial tolerance factors and put the frequency within 0.12 ppm on a board-by-board
basis. Individual trimming of each board in a production environment allows use of the lowest cost crystal,
but requires that each board go through a trimming procedure. This step can be avoided by
using/specifying a crystal with a tighter stability tolerance, but the crystal will be slightly higher in cost.
A tolerance analysis budget may be created using all the previously stated factors. It is an engineering
judgment whether the worst case tolerance will assume that all factors will vary in the same direction or if
the various factors can be statistically rationalized using RSS (Root-Sum-Square) analysis. The aging
factor is usually specified in ppm/year and the product designer can determine how many years are to be
assumed for the product lifetime. Taking all of the factors into account, the product designer can determine
the needed specifications for the crystal and external load capacitors to meet the 802.15.4 Standard.
Figure 11. MC13201 Modem Crystal Circuit
8.2 Crystal Requirements
The suggested crystal specification for the MC13201 is shown in Table 10. A number of the stated
parameters are related to desired package, desired temperature range and use of crystal capacitive load
trimming. For more design details and suggested crystals, see application note AN3251, Reference
Oscillator Crystal Requirements for MC1319x, MC1320x, and MC1321x.
Table 9. MC13201 Crystal Specifications
1
1
User must be sure manufacturer specifications apply to the desired package.
Parameter Value Unit Condition
Frequency 16.000000 MHz
Frequency tolerance (cut tolerance)
2
2
A wider frequency tolerance may acceptable if application uses trimming at production final test.
± 10 ppm at 25 °C
Frequency stability (temperature drift)
3
± 15 ppm Over desired temperature range
Aging
4
± 2 ppm max
Equivalent series resistance
5
43 Ω max
Load capacitance
6
5 - 9 pF
Shunt capacitance <2 pF max
Mode of oscillation fundamental
Y1
16MHz
C10
6.8pF
C11
6.8pF
Y1 = Daishinku KDS - DSX321G ZD00882
XTAL 1
26
XTAL 2
27
U6
MC1320x
MC13201 Technical Data, Rev. 1.3,
20 Freescale Semiconductor
8.3 Low Power Considerations
Program and use the modem IO pins properly for low power operation
All unused modem GPIOx signals must be used one of 2 ways:
If the Off mode is to be used as a long term low power mode, unused GPIO should be tied
to ground. The default GPIO mode is an input and there will be no conflict.
If only Hibernate and/or Doze modes are used as long term low power modes, the GPIO
should programmed as outputs in the low state.
When modem GPIO are used as outputs:
Pullup resistors should be provided (can be provided by the MCU IO pin if tied to the MCU)
if the modem Off condition is to be used as a long term low power mode.
During Hibernate and/or Doze modes, the GPIO will retain its programmed output state.
If the modem GPIO is used as an input, the GPIO should be driven by its source during all low
power modes or a pullup resistor should be provided.
Digital outputs IRQ, MISO, and CLKO:
MISO - is always an output. During Hibernate, Doze, and active modes, the default
condition is for the MISO output to go to tristate when CE is de-asserted, and this can cause
a problem with the MCU because one of its inputs can float. Program Control_B Register
07, Bit 11, miso_hiz_en = 0 so that MISO is driven low when CE is de-asserted. As a result,
MISO will not float when Doze or Hibernate Mode is enabled.
–IRQ - is an open drain output (OD) and should always have a pullup resistor (typically
provided by the MCU IO). IRQ acts as the interrupt request output.
NOTE
It is good practice to have the IRQ interrupt input to the MCU disabled
during the hardware reset to the modem. After releasing the modem
hardware reset, the interrupt request input to the MCU can then be enabled
to await the IRQ
that signifies the modem is ready and in Idle mode; this can
prevent a possible extraneous false interrupt request.
CLKO - is always an output. During Hibernate CLKO retains its output state, but does not
toggle. During Doze, CLKO may toggle depending on whether it is being used.
If the MCU is also going to be used in low power modes, be sure that all unused IO are programmed
properly for low power operation (typically best case is as outputs in the low state). The MC13201
is commonly used with the Freescale MC9S08GT/GB 8-bit devices. For these MCUs:
Use only STOP2 and STOP3 modes (not STOP1) with these devices where the GPIO states are
retained. The MCU must retain control of the MC13201 IO during low power operation.
As stated above all unused GPIO should be programmed as outputs low for lowest power and
no floating inputs.
3
A wider frequency stability may be acceptable if application uses trimming at production final test.
4
A wider aging tolerance may be acceptable if application uses trimming at production final test.
5
Higher ESR may be acceptable with lower load capacitance.
6
Lower load capacitance can allow higher ESR and is better for low temperature operation in Doze mode.
MC13201 Technical Data, Rev. 1.3,
Freescale Semiconductor 21
MC9S08GT devices have IO signals that are not pinned-out on the package. These signals must
also be initialized (even though they cannot be used) to prevent floating inputs.
8.4 Transceiver RF Configurations and External Connections
The MC13201 radio has features that allow for a flexible as well as low cost RF interface:
Programmable output power — 0 dBm nominal output power, programmable from -27 dBm to +4
dBm typical
<-91 dBm (typical) receive sensitivity — At 1% PER, 20-byte packet (well above 802.15.4
Standard of -85 dBm)
Optional integrated transmit/receive (T/R) switch for low cost operation — With internal PAs and
LNA, the internal T/R switch allows a minimal part count radio interface using only a single balun
to interface to a single-ended antenna
Maximum flexibility — There are full differential RF I/O pins for use with the internal T/R switch.
Optionally, these pins become the RF_IN signals and a separate set of full differential PA outputs
are also provided. Separate inputs and outputs allow for a variety of RF configurations including
external LNA and PA for increased range
CT_Bias Output — The CT_Bias signal provides a switched bias reference for use with the internal
T/R switch, and alternatively can be programmed as an antenna switch signal for use with an
external antenna switch
Onboard trim capability for 16 MHz crystal reference oscillator — The 802.15.4 Standard puts a
+/- 40 ppm requirement on the carrier frequency. The onboard trim capability of the modem crystal
oscillator eliminates need for external variable capacitors and allows for automated production
frequency calibration. Also tighter tolerance can produce greater receive sensitivity
8.5 RF Interface Pins
Figure 12 shows the RF interface pins and the associated analog blocks. Notice that separate PA blocks are
associated with RFIN_x and PAO_x signal pairs. The RF interface allows both single port differential
operation and dual port differential operation.
Figure 12. RF Interface Pins
RX
SWITCH
PA1 ENABLE
CT_Bias CONTROL
PA1
PA2
FROM TX PSM
RX ENABLE
LNA
RX
SIGNAL
RFIN_P (PAO_P)
RFIN_M (PAO_M)
CT_Bias
PAO_P
PAO_M
2
1
3
5
6
PA2 ENABLE
CT_Bias Generator

MC13201FC

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
RF Transceiver TORO IC NON 802.15.4
Lifecycle:
New from this manufacturer.
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