MC13201 Technical Data, Rev. 1.3,
16 Freescale Semiconductor
27 XTAL2 Input/Output Crystal Reference oscillator output
Note: Do not load this pin by using it
as a 16 MHz source. Measure
16 MHz output at Pin 15,
CLKO, programmed for 16
MHz. See the MC13201
Reference Manual for details.
Connect to 16 MHz crystal and load
capacitor.
28 VDDLO2 Power Input LO2 VDD supply. Connect to VDDA
externally.
29 VDDLO1 Power Input LO1 VDD supply. Connect to VDDA
externally.
30 VDDVCO Power Output VCO regulated supply bypass. Decouple to ground.
31 VBATT Power Input Analog voltage regulators Input.
Connect to Battery.
Decouple to ground.
32 VDDA Power Output Analog regulated supply Output.
Connect to directly VDDLO1 and
VDDLO2 externally and to PAO±
through a bias network.
Note: Do not use this pin to supply
circuitry external to the chip.
Decouple to ground.
EP Ground External paddle / flag ground. Connect to ground.
1
The transceiver GPIO pins default to inputs at reset. There are no programmable pullups on these pins. Unused GPIO pins
should be tied to ground if left as inputs, or if left unconnected, they should be programmed as outputs set to the low state.
2
During low power modes, input must remain driven by MCU.
3
By default MISO is tri-stated when CE is negated. For low power operation, miso_hiz_en (Bit 11, Register 07) should be set
to zero so that MISO is driven low when CE is negated.
Table 8. Pin Function Description (continued)
Pin # Pin Name Type Description Functionality
MC13201 Technical Data, Rev. 1.3,
Freescale Semiconductor 17
Figure 10. Pin Connections (Top View)
1
2
3
GPIO3
GPIO2
GPIO1
RST
RXTXEN
ATTN
CLKO
SPICLK
4
5
6
7
8
CT_Bias
RFIN_P
NC
PAO_P
PAO_M
SM
GPIO4
RFIN_M
VDDINT
GPIO5
VDDD
IRQ
CE
MISO
MOSI
GPIO6
12 13 14 15 1611109
24
23
22
21
20
19
18
17
VDDA
VBATT
VDDVCO
VDDLO1
VDDLO2
XTAL2
XTAL1
GPIO7
EP
29 28 27 26 25303132
MC13201
MC13201 Technical Data, Rev. 1.3,
18 Freescale Semiconductor
8 Crystal Oscillator Reference Frequency
This section provides application specific information regarding crystal oscillator reference design and
recommended crystal usage.
8.1 Crystal Oscillator Design Considerations
The 802.15.4 Standard requires that several frequency tolerances be kept within ± 40 ppm accuracy. This
means that a total offset up to 80 ppm between transmitter and receiver will still result in acceptable
performance. The MC13201 transceiver provides onboard crystal trim capacitors to assist in meeting this
performance.
The primary determining factor in meeting this specification is the tolerance of the crystal oscillator
reference frequency. A number of factors can contribute to this tolerance and a crystal specification will
quantify each of them:
1. The initial (or make) tolerance of the crystal resonant frequency itself.
2. The variation of the crystal resonant frequency with temperature.
3. The variation of the crystal resonant frequency with time, also commonly known as aging.
4. The variation of the crystal resonant frequency with load capacitance, also commonly known as
pulling. This is affected by:
a) The external load capacitor values - initial tolerance and variation with temperature.
b) The internal trim capacitor values - initial tolerance and variation with temperature.
c) Stray capacitance on the crystal pin nodes - including stray on-chip capacitance, stray package
capacitance and stray board capacitance; and its initial tolerance and variation with
temperature.
5. Whether or not a frequency trim step will be performed in production
Freescale requires the use of a 16 MHz crystal with a <9 pF load capacitance. The MC13201 does not
contain a reference divider, so 16 MHz is the only frequency that can be used. A crystal requiring higher
load capacitance is prohibited because a higher load on the amplifier circuit may compromise its
performance. The crystal manufacturer defines the load capacitance as that total external capacitance seen
across the two terminals of the crystal. The oscillator amplifier configuration used in the MC13201
requires two balanced load capacitors from each terminal of the crystal to ground. As such, the capacitors
are seen to be in series by the crystal, so each must be <18 pF for proper loading.
In the Figure 11 crystal reference schematic, the external load capacitors are shown as 6.8 pF each, used
in conjunction with a crystal that requires an 8 pF load capacitance. The default internal trim capacitor
value (2.4 pF) and stray capacitance total value (6.8 pF) sum up to 9.2 pF giving a total of 16 pF. The value
for the stray capacitance was determined empirically assuming the default internal trim capacitor value and
for a specific board layout. A different board layout may require a different external load capacitor value.
The on-chip trim capability may be used to determine the closest standard value by adjusting the trim value
via the SPI and observing the frequency at CLKO. Each internal trim load capacitor has a trim range of
approximately 5 pF in 20 fF steps.
Initial tolerance for the internal trim capacitance is approximately ±15%.

MC13201FC

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
RF Transceiver TORO IC NON 802.15.4
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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