LTC2604/LTC2614/LTC2624
10
2604fd
TIMING DIAGRAM
outputs from the DAC during this time. The LTC2604/
LTC2614/LTC2624 contain circuitry to reduce the power-
on glitch; furthermore, the glitch amplitude can be made
arbitrarily small by reducing the ramp rate of the power
supply. For example, if the power supply is ramped to 5V
in 1ms, the analog outputs rise less than 10mV above
ground (typ) during power-on. See Power-On Reset Glitch
in the Typical Performance Characteristics section.
Power-On Reset
The LTC2604/LTC2614/LTC2624 clear the outputs to
zero scale when power is fi rst applied, making system
initialization consistent and repeatable. The LTC2604-1/
LTC2614-1/LTC2624-1 set the voltage outputs to midscale
when power is fi rst applied.
For some applications, downstream circuits are active
during DAC power-up, and may be sensitive to nonzero
SDI
SDO
C
S/LD
SCK
2604 F01
t
2
t
8
t
10
t
5
t
7
t
6
t
1
t
3
t
4
123
23 24
OPERATION
Figure 1
2
15
1
GND
REF LO
REF A
V
OUTA
V
OUTB
REF B
CS/LD
SCK
V
CC
REF D
V
OUT D
V
OUT C
REF C
SDO
SDI
2604 BD
16
3
4
14
DAC A
DAC D
5
7
6
8
10
12
9
13
DAC B
DAC C
DECODE
CONTROL
LOGIC
32-BIT SHIFT REGISTER
CLR
11
INPUT
REGISTER
DAC
REGISTER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
DAC
REGISTER
DAC
REGISTER
DAC
REGISTER
BLOCK DIAGRAM
LTC2604/LTC2614/LTC2624
11
2604fd
OPERATION
C3
COMMAND ADDRESS DATA (12 BITS + 4 DON’T-CARE BITS)
C2
C1
C0
A3
A2
A1
A0
D11 D10 D9 D8
D7
D6
D5 D4 D3 D2 D1
D0 X XXX
2604 TBL03
MSB
LSB
C3
COMMAND ADDRESS DATA (14 BITS + 2 DON’T-CARE BITS)
C2
C1
C0
A3
A2
A1
A0
D13
D12
D11 D10 D9 D8
D7
D6
D5 D4 D3 D2 D1
D0 X X
2604 TBL02
MSB
LSB
C3
COMMAND ADDRESS DATA (16 BITS)
C2
C1
C0
A3
A2
A1
A0
D13D14D15
D12
D11 D10 D9 D8
D7
D6
D5 D4 D3 D2 D1
D0
2604 TBL01
MSB
LSB
INPUT WORD (LTC2604)
INPUT WORD (LTC2614)
INPUT WORD (LTC2624)
Power Supply Sequencing
The voltage at REF (Pins 3, 6, 12 and 15) should be kept
within the range –0.3V ≤ REF x ≤ V
CC
+ 0.3V (see Abso-
lute Maximum Ratings). Particular care should be taken
to observe these limits during power supply turn-on and
turn-off sequences, when the voltage at V
CC
(Pin 16) is
in transition.
Transfer Function
The digital-to-analog transfer function is
V
OUT(IDEAL)
=
k
2
N
[REF x REF LO]+REFLO
where k is the decimal equivalent of the binary DAC input
code, N is the resolution and REF x is the voltage at REF
A, REF B, REF C and REF D (Pins 3, 6, 12 and 15).
Serial Interface
The CS/LD input is level triggered. When this input is taken
low, it acts as a chip-select signal, powering-on the SDI
and SCK buffers and enabling the input shift register. Data
(SDI input) is transferred at the next 24 rising SCK edges.
The 4-bit command, C3-C0, is loaded fi rst; then the 4-bit
DAC address, A3-A0; and fi nally the 16-bit data word. The
data word comprises the 16-, 14- or 12-bit input code,
ordered MSB-to-LSB, followed by 0, 2 or 4 don’t-care bits
(LTC2604, LTC2614 and LTC2624 respectively). Data can
only be transferred to the device when the CS/LD signal
is low. The rising edge of CS/LD ends the data transfer
and causes the device to carry out the action specifi ed in
the 24-bit input word. The complete sequence is shown
in Figure 2a.
The command (C3-C0) and address (A3-A0) assignments
are shown in Table 1. The fi rst four commands in the table
consist of write and update operations. A write operation
loads a 16-bit data word from the 32-bit shift register
into the input register of the selected DAC, n. An update
Table 1.
COMMAND*
C3 C2 C1 C0
0 0 0 0 Write to Input Register n
0 0 0 1 Update (Power Up) DAC Register n
0 0 1 0 Write to Input Register n, Update (Power Up) All n
0 0 1 1 Write to and Update (Power Up) n
0 1 0 0 Power Down n
1 1 1 1 No Operation
ADDRESS (n)*
A3 A2 A1 A0
0 0 0 0 DAC A
0 0 0 1 DAC B
0 0 1 0 DAC C
0 0 1 1 DAC D
1 1 1 1 All DACs
*Command and address codes not shown are reserved and should not
be used.
LTC2604/LTC2614/LTC2624
12
2604fd
OPERATION
operation copies the data word from the input register to
the DAC register. Once copied into the DAC register, the
data word becomes the active 16-, 14- or 12-bit input
code, and is converted to an analog voltage at the DAC
output. The update operation also powers up the selected
DAC if it had been in power-down mode. The data path
and registers are shown in the block diagram.
While the minimum input word is 24 bits, it may optionally
be extended to 32 bits. To use the 32-bit word width, 8
don’t-care bits are transferred to the device fi rst, followed
by the 24-bit word as just described. Figure 2b shows the
32-bit sequence. The 32-bit word is required for daisy-
chain operation, and is also available to accommodate
microprocessors which have a minimum word width of
16 bits (2 bytes).
Daisy-Chain Operation
The serial output of the shift register appears at the SDO
pin. Data transferred to the device from the SDI input is
delayed 32 SCK rising edges before being output at the
next SCK falling edge.
The SDO output can be used to facilitate control of multiple
serial devices from a single 3-wire serial port (i.e., SCK,
SDI and CS/LD). Such a “daisy-chain” series is confi gured
by connecting SDO of each upstream device to SDI of the
next device in the chain. The shift registers of the devices
are thus connected in series, effectively forming a single
input shift register which extends through the entire
chain. Because of this, the devices can be addressed and
controlled individually by simply concatenating their input
words; the fi rst instruction addresses the last device in
the chain and so forth. The SCK and CS/LD signals are
common to all devices in the series.
In use, CS/LD is fi rst taken low. Then the concatenated
input data is transferred to the chain, using SDI of the
rst device as the data input. When the data transfer is
complete, CS/LD is taken high, completing the instruction
sequence for all devices simultaneously. A single device
can be controlled by using the no-operation command
(1111) for the other devices in the chain.
Power-Down Mode
For power-constrained applications, power-down mode can
be used to reduce the supply current whenever less than
four outputs are needed. When in power-down, the buffer
amplifi ers, bias circuits and reference inputs are disabled,
and draw essentially zero current. The DAC outputs are
put into a high-impedance state, and the output pins are
passively pulled to ground through individual 90k resis-
tors. Input- and DAC-register contents are not disturbed
during power-down.
Any channel or combination of channels can be put into
power-down mode by using command 0100
b
in combi-
nation with the appropriate DAC address, (n). The 16-bit
data word is ignored. The supply current is reduced by
approximately 1/4 for each DAC powered down. The ef-
fective resistance at REF x (pins 3, 6, 12 and 15) are at
high-impedance input (typically > 1GΩ) when the cor-
responding DACs are powered down.
Normal operation can be resumed by executing any com-
mand which includes a DAC update, as shown in Table 1.
The selected DAC is powered up as its voltage output is
updated. When a DAC which is in a powered-down state
is powered up and updated, normal settling is delayed. If
less than four DACs are in a powered-down state prior to
the update command, the power-up delay time is 5μs. If on
the other hand, all four DACs are powered down, then the
main bias generation circuit block has been automatically
shut down in addition to the individual DAC amplifi ers and
reference inputs. In this case, the power up delay time is
12μs (for V
CC
= 5V) or 30μs (for V
CC
= 3V).
Voltage Outputs
Each of the four rail-to-rail amplifi ers contained in these
parts has guaranteed load regulation when sourcing or
sinking up to 15mA at 5V (7.5mA at 3V).
Load regulation is a measure of the amplifi ers ability to
maintain the rated voltage accuracy over a wide range of
load conditions. The measured change in output voltage
per milliampere of forced load current change is expressed
in LSB/mA.

LTC2604IGN#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Digital to Analog Converters - DAC 4x 16-B R2R DACs in 16-Lead SSOP
Lifecycle:
New from this manufacturer.
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