LTC2604/LTC2614/LTC2624
13
2604fd
OPERATION
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
C2 C1 C0 A3 A2 A1 A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0C3
CS/LD
SCK
SDI
COMMAND WORD ADDRESS WORD DATA WORD
24-BIT INPUT WORD
2604 F02a
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24 25 26 27 28 29 30 31 32
C2 C1 C0 A3 A2 A1 A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0C3XXXXXXXX
CS/LD
SCK
SDI
COMMAND WORD ADDRESS WORD DATA WORD
DON’T CARE
C2 C1 C0 A3 A2 A1 A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0C3XXXXXXXX
SDO
CURRENT
32-BIT
INPUT WORD
2604 F02b
PREVIOUS 32-BIT INPUT WORD
t
2
t
3
t
4
t
1
t
8
D15
17
SCK
SDI
SDO
PREVIOUS D14PREVIOUS D15
18
D14
Figure 2a. LTC2604 24-Bit Load Sequence (Minimum Input Word)
LTC2614 SDI Data Word: 14-Bit Input Code + 2 Don’t Care Bits
LTC2624 SDI Data Word: 12-Bit Input Code + 4 Don’t Care Bits
Figure 2b. LTC2604 32-Bit Load Sequence
LTC2614 SDI/SDO Data Word: 14-Bit Input Code + 2 Don’t Care Bits
LTC2624 SDI/SDO Data Word: 12-Bit Input Code + 4 Don’t Care Bits
LTC2604/LTC2614/LTC2624
14
2604fd
OPERATION
2600 F03
INPUT CODE
OUTPUT
VOLTAGE
NEGATIVE
OFFSET
0V
32,768
0
65,535
INPUT CODE
OUTPUT
VOLTAGE
V
REF
= V
CC
V
REF
= V
CC
INPUT CODE
OUTPUT
VOLTAGE
POSITIVE
FSE
Figure 3. Effects of Rail-to-Rail Operation On a DAC Transfer Curve. (a) Overall Transfer Function (b) Effect
of Negative Offset for Codes Near Zero Scale (c) Effect of Positive Full-Scale Error for Codes Near Full Scale
(b)
(a)
(c)
DC output impedance is equivalent to load regulation, and
may be derived from it by simply calculating a change in
units from LSB/mA to Ohms. The amplifi ers’ DC output
impedance is 0.025Ω when driving a load well away from
the rails.
When drawing a load current from either rail, the output
voltage headroom with respect to that rail is limited by
the 30Ω typical channel resistance of the output devices;
e.g., when sinking 1mA, the minimum output voltage =
30Ω • 1mA = 30mV. See the graph Headroom at Rails vs
Output Current in the Typical Performance Characteristics
section.
The amplifi ers are stable driving capacitive loads of up
to 1000pF.
Board Layout
The excellent load regulation and DC crosstalk performance
of these devices is achieved in part by keeping “signal”
and “power” grounds separate.
The PC board should have separate areas for the analog
and digital sections of the circuit. This keeps digital signals
away from sensitive analog signals and facilitates the use
of separate digital and analog ground planes which have
minimal capacitive and resistive interaction with each
other.
Digital and analog ground planes should be joined at only
one point, establishing a system star ground as close to
the device’s ground pin as possible. Ideally, the analog
ground plane should be located on the component side of
the board, and should be allowed to run under the part to
shield it from noise. Analog ground should be a continuous
and uninterrupted plane, except for necessary lead pads
and vias, with signal traces on another layer.
The GND pin functions as a return path for power sup-
ply currents in the device and should be connected to
analog ground. Resistance from the GND pin to system
star ground should be as low as possible. When a zero
scale DAC output voltage of zero is desired, the REFLO pin
(pin 2) should be connected to system star ground.
Rail-to-Rail Output Considerations
In any rail-to-rail voltage output device, the output is limited
to voltages within the supply range.
Since the analog outputs of the device cannot go below
ground, they may limit for the lowest codes as shown in
Figure 3b. Similarly, limiting can occur near full scale when
the REF pins are tied to V
CC
. If REF x = V
CC
and the DAC
full-scale error (FSE) is positive, the output for the highest
codes limits at V
CC
as shown in Figure 3c. No full-scale
limiting can occur if REF x is less than V
CC
– FSE.
Offset and linearity are defi ned and tested over the region
of the DAC transfer function where no output limiting
can occur.
LTC2604/LTC2614/LTC2624
15
2604fd
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
GN16 (SSOP) 0204
12
3
4
5
6
7
8
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
16
15
14
13
.189 – .196*
(4.801 – 4.978)
12 11 10
9
.016 – .050
(0.406 – 1.270)
.015 ± .004
(0.38 ± 0.10)
×
45
°
0
°
– 8
°
TYP
.007 – .0098
(0.178 – 0.249)
.0532 – .0688
(1.35 – 1.75)
.008 – .012
(0.203 – 0.305)
TYP
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
.009
(0.229)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 BSC.0165
±
.0015
.045
±
.005
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
PACKAGE DESCRIPTION
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)

LTC2604IGN#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Digital to Analog Converters - DAC 4x 16-B R2R DACs in 16-Lead SSOP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union