13
LTC1419
1419fb
APPLICATIONS INFORMATION
WUU
U
applied to the –A
IN
input. For zero offset error, apply
152µV (i.e., – 0.5LSB) at +A
IN
and adjust the offset at the
–A
IN
input until the output code flickers between 0000
0000 0000 00 and 1111 1111 1111 11. For full-scale
adjustment, an input voltage of 2.499544V (FS/2 – 1.5LSBs)
is applied to +A
IN
and R2 is adjusted until
the output code flickers between 0111 1111 1111 10 and
0111 1111 1111 11.
BOARD LAYOUT AND GROUNDING
Wire wrap boards are not recommended for high resolu-
tion or high speed A/D converters. To obtain the best
performance from the LTC1419, a printed circuit board
with ground plane is required. Layout should ensure that
digital and analog signal lines are separated as much as
possible. Particular care should be taken not to run any
digital track alongside an analog signal track or under-
neath the ADC.The analog input should be screened by
AGND.
An analog ground plane separate from the logic system
ground should be established under and around the ADC.
Pin 5 (AGND), Pin 14 and Pin 19 (ADC’s DGND) and all
other analog grounds should be connected to this single
analog ground point. The REFCOMP bypass capacitor and
the DV
DD
bypass capacitor should also be connected to
this analog ground plane. No other digital grounds should
be connected to this analog ground plane. Low impedance
analog and digital power supply common returns are
essential to low noise operation of the ADC and the foil
width for these tracks should be as wide as possible. In
applications where the ADC data outputs and control
signals are connected to a continuously active micropro-
cessor bus, it is possible to get errors in the conversion
results. These errors are due to feedthrough from the
microprocessor to the successive approximation com-
parator. The problem can be eliminated by forcing the
microprocessor into a WAIT state during conversion or by
using three-state buffers to isolate the ADC data bus. The
traces connecting the pins and bypass capacitors must be
kept short and should be made as wide as possible.
The LTC1419 has differential inputs to minimize noise
coupling. Common mode noise on the +A
IN
and –A
IN
leads will be rejected by the input CMRR. The –A
IN
input
can be used as a ground sense for the +A
IN
input; the
LTC1419 will hold and convert the difference voltage
between +A
IN
and – A
IN
. The leads to + A
IN
(Pin 1) and – A
IN
(Pin 2) should be kept as short as possible. In applications
where this is not possible, the + A
IN
and – A
IN
traces should
be run side by side to equalize coupling.
SUPPLY BYPASSING
High quality, low series resistance ceramic, 10µF bypass
capacitors should be used at the V
DD
and REFCOMP pins
as shown in the Typical Application on the fist page of this
data sheet. Surface mount ceramic capacitors such as
Murata GRM235Y5V106Z016 provide excellent bypass-
ing in a small board space. Alternatively, 10µF tantalum
capacitors in parallel with 0.1µF ceramic capacitors can be
used. Bypass capacitors must be located as close to the
pins as possible. The traces connecting the pins and the
bypass capacitors must be kept short and should be made
as wide as possible.
Example Layout
Figures 13a, 13b, 13c and 13d show the schematic and
layout of a suggested evaluation board. The layout demon-
strates the proper use of decoupling capacitors and ground
plane with a 2-layer printed circuit board.
Figure 12. Power Supply Grounding Practice
1419 F12
+A
IN
AGNDREFCOMP V
SS
AV
DD
LTC1419
DIGITAL
SYSTEM
ANALOG
INPUT
CIRCUITRY
54
2
26 28
DV
DD
27
DGND
14
1
10µF
–A
IN
10µF
10µF
ANALOG GROUND PLANE
+
14
LTC1419
1419fb
APPLICATIONS INFORMATION
WUU
U
+
+V
IN
GND
A
+
A
AGND
DGND
V
CC
V
CC
V
CC
V
SS
JP4
V
LOGIC
R14
20
U4
LTC1419
B[00:13]
U5
74HC574
U6
74HC574
56
14
HC14
U7F
HC14
U7C
98
HC14
U7D
J6-13
J6-14
J6-11
J6-12
J6-9
J6-10
J6-7
J6-8
J6-5
J6-6
J6-3
J6-4
J6-1
J6-2
J6-15
J6-16
J6-17
J6-18
D13
D00
D01
D02
D03
D04
D05
D06
D07
D08
D09
D10
D11
D12
D13
D13
RDY
D00
D01
D02
D03
D04
D05
D06
D07
D08
D09
D10
D11
D12
D13
D13
RDY
DGND
DGND
LED
JP1
D00
D01
D02
D03
D04
D05
D06
D07
D08
D09
D10
D11
D12
D13
D00
D01
D02
D03
D04
D05
D06
D07
D08
D09
D10
D11
D12
D13
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D[00:13]
R0 1.2k
R1
R2
R3
R4
R5
R6
R8
R7
R9
R10
R11
R12
R13
HEADER
18-PIN
11 10
HC14
U7E
R21
1k
12
7
13
V
LOGIC
V
CC
GND
U7G
HC14
D0
D1
D2
D3
D4
D5
D6
D7
D0
D1
D2
D3
D4
D5
D6
D7
D12
D11
D10
D09
D08
D07
D06
D00
D01
D02
D03
D04
D05
D13
19
18
17
16
15
14
13
12
19
18
17
16
15
14
13
12
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
0E
0E
DATA READY
NOTES: UNLESS OTHERWISE SPECIFIED
1. ALL RESISTOR VALUES IN OHMS, 1/10W, 5%
2. ALL CAPACITOR VALUES IN µF, 25V, 20% AND IN pF, 50V, 10%
V
CC
V
SS
CLK
J7
V
IN
U2 LT1121-5
D15
SS12
R17
10k
R18
10k
R19
51
R16
51
R15
51
R20
1M
U7A
V
LOGIC
JP5C
JP5B
JP5A
CS
RD
SHDN
U7B
HC14 HC14
C6
1000pF
C11
1000pF
C7
1000pF
C8
1µF
16V
C13
10µF
16V
C9
10µF
16V
C15
0.1µF
C16
15pF
C5
10µF
16V
C2
22µF
10V
C10
10µF
10V
C1
22µF
10V
C12
0.1µF
C14
0.1µF
GND TABGND
1
24
3
C4
0.1µF
C3
0.1µF
U3
LT1363
V–
V+
2
3
1
23
4
6
7
8
1
4
J3
7V TO
15V
J4
JP2
J5
JP3
V
OUT
V
OUT
J2
1
2
3
4
25
24
23
22
21
28
27
26
5
14
6
7
8
9
10
11
12
13
15
16
17
18
19
20
B13
B12
B11
B10
B09
B08
B07
B06
B05
B04
B03
B02
B01
B00
B00
B01
B02
B03
B04
B05
B13
B12
B11
B10
B09
B08
B07
B06
1
11
2
3
4
5
6
7
8
9
1
11
2
3
4
5
6
7
8
9
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
+A
IN
–A
IN
V
REF
REFCOMP
BUSY
CS
CONVST
RD
SHDN
AV
DD
DV
DD
V
SS
AGND
DGND
+
+
V
SS
J1
–7V TO
–15V
D14
SS12
–V
IN
IN OUT
21
5
GND
U1
79L05
+
DC124 SCHEM
Figure 13a. Suggested Evaluation Circuit Schematic
15
LTC1419
1419fb
APPLICATIONS INFORMATION
WUU
U
Figure 13b. Suggested Evaluation Circuit Board—Component Side Silkscreen
Figure 13c. Suggested Evaluation Circuit Board—Component Side Layout

LTC1419IG#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 800ksps 14-Bit Parallel ADC
Lifecycle:
New from this manufacturer.
Delivery:
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