REV. B
–4–
AD7858/AD7858L
Limit at T
MIN
, T
MAX
(A, B Versions)
Parameter 5 V 3 V Units Description
f
CLKIN
2
500 500 kHz min Master Clock Frequency
4 4 MHz max
1.8 1.8 MHz max L Version, 0°C to +70°C, B Grade Only
1 1 MHz max L Version, –40°C to +85°C
f
SCLK
4 4 MHz max
t
1
3
100 100 ns min CONVST Pulsewidth
t
2
50 90 ns max CONVST to BUSY Propagation Delay
t
CONVERT
4.6 4.6 µs max Conversion Time = 18 t
CLKIN
10 (18) 10 (18) µs max L Version 1.8 (1) MHz CLKIN. Conversion Time = 18 t
CLKIN
t
3
–0.4 t
SCLK
–0.4 t
SCLK
ns min SYNC to SCLK Setup Time (Noncontinuous SCLK Input)
⫿0.4 t
SCLK
⫿0.4 t
SCLK
ns min/max SYNC to SCLK Setup Time (Continuous SCLK Input)
t
4
4
50 90 ns max Delay from SYNC Until DOUT Three-State Disabled
t
5
4
50 90 ns max Delay from SYNC Until DIN Three-State Disabled
t
6
4
75 115 ns max Data Access Time After SCLK
t
7
40 60 ns min Data Setup Time Prior to SCLK
t
8
20 30 ns min Data Valid to SCLK Hold Time
t
9
0.4 t
SCLK
0.4 t
SCLK
ns min SCLK High Pulsewidth
t
10
0.4 t
SCLK
0.4 t
SCLK
ns min SCLK Low Pulsewidth
t
11
30 50 ns min SCLK to SYNC Hold Time (Noncontinuous SCLK)
30/0.4 t
SCLK
50/0.4 t
SCLK
ns min/max (Continuous SCLK)
t
12
5
50 50 ns max Delay from SYNC Until DOUT Three-State Enabled
t
13
90 130 ns max Delay from SCLK to DIN Being Configured as Output
t
14
6
50 90 ns max Delay from SCLK to DIN Being Configured as Input
t
15
2.5 t
CLKIN
2.5 t
CLKIN
ns max CAL to BUSY Delay
t
16
2.5 t
CLKIN
2.5 t
CLKIN
ns max CONVST to BUSY Delay in Calibration Sequence
t
CAL
7
31.25 31.25 ms typ Full Self-Calibration Time, Master Clock Dependent
(125013 t
CLKIN
)
t
CAL1
7
27.78 27.78 ms typ Internal DAC Plus System Full-Scale Calibration Time, Master
Clock Dependent (111114 t
CLKIN
)
t
CAL2
7
3.47 3.47 ms typ System Offset Calibration Time, Master Clock Dependent
(13899 t
CLKIN
)
NOTES
1
Sample tested at +25°C to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of V
DD
) and timed from a voltage level of 1.6 V.
See Table XI and timing diagrams for different interface modes and Calibration.
2
Mark/Space ratio for the master clock input is 40/60 to 60/40.
3
The CONVST pulsewidth will apply here only for normal operation. When the part is in power-down mode, a different CONVST pulsewidth will apply
(see Power-Down section).
4
Measured with the load circuit of Figure 1 and defined as the time required for the output to cross 0.8 V or 2.4 V.
5
t
12
is derived form the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 1. The measured number is then extrapolated
back to remove the effects of charging or discharging the 100 pF capacitor. This means that the time, t
12
, quoted in the timing characteristics is the true bus
relinquish time of the part and is independent of the bus loading.
6
t
14
is derived form the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 1. The measured number is then
extrapolated back to remove the effects of charging or discharging the 100 pF capacitor. This means that the time quoted in the Timing Characteristics is the
true delay of the part in turning off the output drivers and configuring the DIN line as an input. Once this time has elapsed the user can drive the DIN line
knowing that a bus conflict will not occur.
7
The typical time specified for the calibration times is for a master clock of 4 MHz. For the L version the calibration times will be longer than those quoted here due to
the 1.8/1 MHz master clock.
Specifications subject to change without notice.
TIMING SPECIFICATIONS
1
(AV
DD
= DV
DD
= +3.0 V to +5.5 V; f
CLKIN
= 4 MHz for AD7858 and 1.8/1 MHz for AD7858L;
T
A
= T
MIN
to T
MAX
, unless otherwise noted)
AD7858/AD7858L
REV. B
–5–
TYPICAL TIMING DIAGRAMS
Figures 2 and 3 show typical read and write timing diagrams for
serial Interface Mode 2. The reading and writing occurs after
conversion in Figure 2, and during conversion in Figure 3. To
attain the maximum sample rate of 100 kHz (AD7858L) or
200 kHz (AD7858), reading and writing must be performed
during conversion as in Figure 3. At least 400 ns acquisition
time must be allowed (the time from the falling edge of BUSY
to the next rising edge of CONVST) before the next conversion
begins to ensure that the part is settled to the 12-bit level. If the
user does not want to provide the CONVST signal, the conver-
sion can be initiated in software by writing to the control register.
1.6mA
200A
I
OL
I
OH
TO
OUTPUT
PIN
C
L
100pF
+2.1V
Figure 1. Load Circuit for Digital Output Timing
Specifications
t
CONVERT
= 4.6s MAX, 10s MAX FOR L VERSION
t
1
= 100ns MIN, t
4
= 50/90ns MAX 5V/3V, t
7
= 40/60ns MIN 5V/3V
t
1
t
CONVERT
t
3
t
4
t
6
t
2
t
6
t
9
t
10
t
11
t
12
t
7
t
8
THREE-STATE
15616
DB15 DB11 DB0
DB15 DB11 DB0
CONVST (I/P)
BUSY (O/P)
SYNC (I/P)
SCLK (I/P)
DOUT (O/P)
DIN (I/P)
THREE-
STATE
Figure 2. AD7858/AD7858L Timing Diagram for Interface Mode 2 (Reading/Writing After Conversion)
t
CONVERT
= 4.6s MAX, 10s MAX FOR L VERSION
t
1
= 100ns MIN, t
4
= 50/90ns MAX 5V/3V, t
7
= 40/60ns MIN 5V/3V
t
1
t
CONVERT
t
3
t
4
t
6
t
2
t
6
t
9
t
10
t
11
t
12
t
7
t
8
THREE-STATE
15616
DB15 DB11 DB0
DB15 DB11 DB0
CONVST (I/P)
BUSY (O/P)
SYNC (I/P)
SCLK (I/P)
DOUT (O/P)
DIN (I/P)
THREE-
STATE
Figure 3. AD7858/AD7858L Timing Diagram for Interface Mode 2 (Reading/Writing During Conversion)
REV. B
–6–
AD7858/AD7858L
ORDERING GUIDE
Linearity Power
Error Dissipation Package
Model (LSB)
1
(mW) Options
2
AD7858AN ± 1 20 N-24
AD7858BN ±1/2 20 N-24
AD7858LAN
3
±1 6.85 N-24
AD7858LBN
3
±1 6.85 N-24
AD7858AR ±1 20 R-24
AD7858BR ±1/2 20 R-24
AD7858LAR
3
±1 6.85 R-24
AD7858LBR
3
±1 6.85 R-24
AD7858LARS
3
±1 6.85 RS-24
EVAL-AD7858CB
4
EVAL-CONTROL BOARD
5
NOTES
1
Linearity error here refers to integral linearity error.
2
N = Plastic DIP; R = SOIC; RS = SSOP.
3
L signifies the low-power version.
4
This can be used as a stand-alone evaluation board or in conjunction with the EVAL-
CONTROL BOARD for evaluation/demonstration purposes.
5
This board is a complete unit allowing a PC to control and communicate with all
Analog Devices evaluation boards ending in the CB designators.
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= +25°C unless otherwise noted)
AV
DD
to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DV
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AV
DD
to DV
DD
. . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
Analog Input Voltage to AGND . . . . –0.3 V to AV
DD
+ 0.3 V
Digital Input Voltage to DGND . . . . –0.3 V to DV
DD
+ 0.3 V
Digital Output Voltage to DGND . . . –0.3 V to DV
DD
+ 0.3 V
REF
IN
/REF
OUT
to AGND . . . . . . . . . –0.3 V to AV
DD
+ 0.3 V
Input Current to Any Pin Except Supplies
2
. . . . . . . ±10 mA
Operating Temperature Range
Commercial (A, B Versions) . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105°C/W
θ
JC
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 34.7°C/W
Lead Temperature, (Soldering, 10 sec) . . . . . . . . . . +260°C
SOIC, SSOP Package, Power Dissipation . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . 75°C/W (SOIC) 115°C/W (SSOP)
θ
JC
Thermal Impedance . . . . 25°C/W (SOIC) 35°C/W (SSOP)
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Transient currents of up to 100 mA will not cause SCR latch-up.
PIN CONFIGURATIONS
DIP, SOIC, AND SSOP
13
16
15
14
24
23
22
21
20
19
18
17
TOP VIEW
(Not to Scale)
12
11
10
9
8
1
2
3
4
7
6
5
AD7858/
AD7858L
CONVST
DIN
CLKIN
SCLK
SYNC
BUSY
SLEEP
REF
IN
/REF
OUT
DV
DD
DGND
DOUT
AV
DD
AGND
C
REF1
C
REF2
AIN1
AIN2 AIN7
AIN8
CAL
AIN3
AIN4
AIN6
AIN5
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD7858/AD7858L features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE

AD7858ARZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 3-5V SGL Supply 200kSPS 8-Ch 12-Bit
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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