OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

X40020S14IZ-AT1

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24
22
FN8112.1
May 17, 2006
V
TRIP1
, V
TRIP2
Programming Specifications: V
CC
= 2.0-5.5V; Temperature = 25°C
Parameter Description Min. Max. Unit
t
VPS
WDO Program Voltage Setup time 10 µs
t
VPH
WDO Program Voltage Hold time 10 µs
t
TSU
V
TRIPX
Level Setup time 10 µs
t
THD
V
TRIPX
Level Hold (stable) time 10 µs
t
WC
V
TRIPX
Program Cycle 10 ms
t
VPO
Program Voltage Off time before next cycle 1 ms
V
P
Programming Voltage 15 18 V
V
TRAN1
V
TRIP1
Set Voltage Range 2.0 4.75 V
V
TRAN2
V
TRIP2
Set Voltage Range 0.9 3.5 V
V
tv
V
TRIPX
Set Voltage variation after programming (0-75°C). -25 +25 mV
t
VPS
WDO Program Voltage Setup time 10 µs
V
TRIPX
programming parameters are periodically sampled and are not 100% tested.
X40020, 40021
23
FN8112.1
May 17, 2006
X40020, 40021
Small Outline Package Family (SO)
GAUGE
PLANE
A2
A1
L
L1
DETAIL X
4° ±4°
SEATING
PLANE
e
H
b
C
0.010 BM CA
0.004 C
0.010 BM CA
B
D
(N/2)
1
E1
E
NN
(N/2)+1
A
PIN #1
I.D. MARK
h X 45°
A
SEE DETAIL “X”
c
0.010
MDP0027
SMALL OUTLINE PACKAGE FAMILY (SO)
SYMBOL SO-8 SO-14
SO16
(0.150”)
SO16 (0.300”)
(SOL-16)
SO20
(SOL-20)
SO24
(SOL-24)
SO28
(SOL-28) TOLERANCE NOTES
A 0.068 0.068 0.068 0.104 0.104 0.104 0.104 MAX -
A1 0.006 0.006 0.006 0.007 0.007 0.007 0.007 0.003 -
A2 0.057 0.057 0.057 0.092 0.092 0.092 0.092 0.002 -
b 0.017 0.017 0.017 0.017 0.017 0.017 0.017 0.003 -
c 0.009 0.009 0.009 0.011 0.011 0.011 0.011 0.001 -
D 0.193 0.341 0.390 0.406 0.504 0.606 0.704 0.004 1, 3
E 0.236 0.236 0.236 0.406 0.406 0.406 0.406 0.008 -
E1 0.154 0.154 0.154 0.295 0.295 0.295 0.295 0.004 2, 3
e 0.050 0.050 0.050 0.050 0.050 0.050 0.050 Basic -
L 0.025 0.025 0.025 0.030 0.030 0.030 0.030 0.009 -
L1 0.041 0.041 0.041 0.056 0.056 0.056 0.056 Basic -
h 0.013 0.013 0.013 0.020 0.020 0.020 0.020 Reference -
N 8 14 16 16 20 24 28 Reference -
Rev. L 2/01
NOTES:
1. Plastic or metal protrusions of 0.006” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994
24
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9001 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8112.1
May 17, 2006
X40020, 40021
Thin Shrink Small Outline Plastic Packages (TSSOP)
INDEX
AREA
E1
D
N
123
-B-
0.10(0.004) C AM BS
e
-A-
b
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
c
E
0.25(0.010) BM M
L
0.25
0.010
GAUGE
PLANE
A2
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AC, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
0.05(0.002)
M14.173
14 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.047 - 1.20 -
A1 0.002 0.006 0.05 0.15 -
A2 0.031 0.041 0.80 1.05 -
b 0.0075 0.0118 0.19 0.30 9
c 0.0035 0.0079 0.09 0.20 -
D 0.195 0.199 4.95 5.05 3
E1 0.169 0.177 4.30 4.50 4
e 0.026 BSC 0.65 BSC -
E 0.246 0.256 6.25 6.50 -
L 0.0177 0.0295 0.45 0.75 6
N14 147
0
o
8
o
0
o
8
o
-
Rev. 2 4/06
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24

X40020S14IZ-AT1

Mfr. #:
Buy X40020S14IZ-AT1
Manufacturer:
Renesas / Intersil
Description:
Supervisory Circuits DL VAGE CPU SUPS HI IND VTRIP1 4 6
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet