1. General description
The TDA8034HN is a cost-effective analog interface for asynchronous and synchronous
smart cards operating at 5 V, 3 V or 1.8 V. Using few external components, the
TDA8034HN provides all supply, protection and control functions between a smart card
and the microcontroller.
2. Features and benefits
Integrated circuit smart card interface in an HVQFN24 package
5V, 3V or 1.8V smart card supply
Very low power consumption in Deep Shutdown mode
Three protected half-duplex bidirectional buffered I/O lines (C4, C7 and C8)
V
CC
regulation:
5V, 3V or 1.8V 5 % using two low ESR multilayer ceramic capacitors: one of
220 nF and one of 470 nF
current spikes of 40 nA/s (V
CC
= 5 V and 3 V) or 15 nA/s (V
CC
=1.8 V) up to
20 MHz, with controlled rise and fall times and filtered overload detection of
approximately 120 mA
Thermal and short-circuit protection for all card contacts
Automatic activation and deactivation sequences triggered by a short-circuit, card
take-off, overheating, falling V
DD
, V
DD(INTF)
or V
DDP
Enhanced card-side ElectroStatic Discharge (ESD) protection of > 8 kV
External clock input up to 26 MHz connected to pin XTAL1
Card clock generation up to 20 MHz using pins CLKDIV1 and CLKDIV2 with
synchronous frequency changes of f
xtal
,
1
2
f
xtal,
1
4
f
xtal
or
1
8
f
xtal
Non-inverted control of pin RST using pin RSTIN
Compatible with ISO 7816, NDS and EMVCo4.3
1
payment systems
Supply supervisor for killing spikes during power on and off:
using a fixed threshold
using an external resistor bridge with threshold adjustment
Built-in debouncing on card presence contacts (typically 8 ms)
Multiplexed status signal using pin OFFN
TDA8034HN
Low power smart card interface
Rev. 3.4 — 29 June 2016 Product data sheet
1. For C2 version
TDA8034HN All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 3.4 — 29 June 2016 2 of 32
NXP Semiconductors
TDA8034HN
Low power smart card interface
3. Applications
Pay TV
Electronic payment
Identification
Bank card readers
4. Quick reference data
Table 1. Quick reference data
V
DDP
=5V; V
DD
=3.3V; V
DD(INTF)
=3.3V; f
xtal
=10MHz; GND=0V; T
amb
= 25 °C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Supply
V
DDP
power supply voltage pin V
DDP
; regulator input
V
CC
= 5 V 4.85 5 5.5 V
V
CC
= 3 V and 1.8 V 3 3.3 5.5 V
V
DD
supply voltage pin V
DD
2.7 3.3 3.6 V
V
DD(INTF)
interface supply voltage pin V
DD(INTF)
1.6 3.3 V
DD
+0.3 V
I
DD
supply current shutdown mode - - 35 A
deep shutdown mode - - 12 A
active mode - - 2 mA
I
DDP
power supply current shutdown mode; f
xtal
stopped - - 5 A
active mode; f
CLK
=
1
2
f
xtal
;
no load
--1.5mA
I
DD(INTF)
interface supply current shutdown mode - - 6 A
active mode - - 2 mA
Card supply voltage: pin V
CC
[1]
V
CC
supply voltage active mode; I
CC
<65mA DC
5 V card 4.75 5.0 5.25 V
3 V card 2.85 3.05 3.15 V
1.8 V card 1.71 1.83 1.89 V
active mode; current pulses of
40 nA/s at I
CC
<200mA;
t < 400 ns
5 V card 4.65 5.0 5.25 V
3 V card 2.76 - 3.20 V
active mode; current pulses of
15 nA/s at I
CC
< 200 mA,
t < 400 ns; 1.8 V card
1.66 - 1.94 V
V
ripple(p-p)
peak-to-peak ripple voltage from 20 kHz to 200 MHz - - 350 mV
I
CC
supply current V
CC
=0V to 5V, 3V or 1.8V - - 65 mA
General
t
deact
deactivation time see Figure 8 on page 12 35 90 250 s
P
tot
total power dissipation T
amb
= 25 Cto+85C --0.25W
T
amb
ambient temperature 25 - +85 C
TDA8034HN All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 3.4 — 29 June 2016 3 of 32
NXP Semiconductors
TDA8034HN
Low power smart card interface
[1] To meet these specifications, V
CC
should be decoupled to pin GND using two ceramic multilayer capacitors of low ESR with values of
either 100 nF or one 220 nF and one 470 nF.
5. Ordering information
The TDA8034HN is available in 2 versions. Both have the same functionality. C2 version
is compliant with EMVCo 4.3
Table 2. Ordering information
Type number Package
Name Description Version
TDA8034HN/C1 HVQFN24 plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 4 0.85 mm
SOT616-1
TDA8034HN/C2 HVQFN24 plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 4 0.85 mm
SOT616-1

TDA8034HN/C2QL

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Interface - Specialized TDA8034HN/HVQFN24//C2/TRAY SINGLE NDP BAKEABLE
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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