TDA8034HN All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 3.4 — 29 June 2016 14 of 32
NXP Semiconductors
TDA8034HN
Low power smart card interface
9. Limiting values
Remark: All card contacts are protected against any short-circuit to any other card
contact. Stress beyond the levels indicated in Table 5
can cause permanent damage to
the device. This is a short-term stress rating only and under no circumstances implies
functional operation under long-term stress conditions.
[1] The PRESN pin supports ESD HBM discharge up to 7kV
(1) Deactivation caused by card withdrawal.
(2) Deactivation caused by short-circuit.
Fig 10. Operation of debounce feature with pins OFFN, CMDVCCN, PRESN and V
CC
001aal411
PRESN
OFFN
t
deb
t
deb
CMDVCCN
V
CC
(1) (2)
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DDP
power supply voltage pin V
DDP
0.3 +6 V
V
DD
supply voltage pin V
DD
0.3 +4.6 V
V
DD(INTF)
interface supply voltage pin V
DD(INTF)
0.3 +4.6 V
V
I
input voltage pins CMDVCCN, CLKDIV1, CLKDIV2,
VCC_SEL1, VCC_SEL2, RSTIN, OFFN,
PORADJ, XTAL1, XTAL2, I/OUC, AUX1UC,
AUX1UC
0.3 +4.6 V
card contact pins PRESN, I/O, RST, AUX1,
AUX2 and CLK
0.3 +6 V
T
stg
storage temperature 55 +150 C
P
tot
total power dissipation T
amb
= 25 C to +85 C - 0.25 W
T
j
junction temperature - +125 C
T
amb
ambient temperature 25 +85 C
V
ESD
electrostatic discharge voltage Human Body Model (HBM) on card pins I/O,
RST, V
CC
, AUX1, AUX2, CLK; within typical
application
8+8kV
Human Body Model (HBM); all other pins
(1)
2+2kV
Machine Model (MM); all pins 200 +200 V
Field Charged Device Model (FCDM); all
pins
500 +500 V
