TDA8034T_TDA8034AT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 3.1 — 13 December 2012 14 of 30
NXP Semiconductors
TDA8034T; TDA8034AT
Smart card interface
If pin CMDVCCN is HIGH for more than 30 ms (card inactive), and if the card needs to be
activated at 3 V, the sequence shown in Figure 12
applies: pin CMDVCCN must be set
LOW for t1 (200 s < t1 < 700 s), and then HIGH for t2 (200 s < t2 < 15 ms) before
going LOW.
9. Limiting values
Remark: All card contacts are protected against any short-circuit to any other card
contact. Stress beyond the levels indicated in Table 5
can cause permanent damage to
the device. This is a short-term stress rating only and under no circumstances implies
functional operation under long-term stress conditions.
10. Thermal characteristics
Fig 12. Card activation, V
CC
= 3 V, t0 > 15 ms
001aal000
CMDVCCN
3 V or 5 V 3 V
t0
V
CC
t1 t2
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DDP
power supply voltage pin V
DDP
0.3 +6 V
V
DD
supply voltage pin V
DD
0.3 +4.6 V
V
DD(INTF)
interface supply voltage pin V
DD(INTF)
0.3 +4.6 V
V
I
input voltage pins CMDVCCN, CLKDIV1, RSTIN, OFFN,
XTAL1, XTAL2, I/OUC
0.3 +4.6 V
card contact pins PRESN, I/O, RST and
CLK
0.3 +6 V
T
stg
storage temperature 55 +150 C
P
tot
total power dissipation T
amb
= 25 C to +85 C - 0.25 W
T
j
junction temperature - +125 C
T
amb
ambient temperature 25 +85 C
V
ESD
electrostatic discharge voltage Human Body Model (HBM) on card pins I/O,
RST, V
CC
, CLK, PRESN; within typical
application
6+6kV
Human Body Model (HBM); all other pins 2+2kV
Machine Model (MM); all pins 200 +200 V
Field Charged Device Model (FCDM);
all pins
500 +500 V
Table 6. Thermal characteristics
Symbol Package name Parameter Conditions Typ Unit
R
th(j-a)
SO16 thermal resistance from junction to ambient in free air 94 K/W
