MAX5924/MAX5925/MAX5926
1V to 13.2V, n-Channel Hot-Swap Controllers
Require No Sense Resistor
16 ______________________________________________________________________________________
To determine the proper circuit-breaker resistor value
use the following equation, which refers to Figure 12:
where I
TRIPSLOW
is the desired slow-comparator trip
current.
The fast-comparator trip current is determined by the
selected R
CB
value and cannot be adjusted indepen-
dently. The fast-comparator trip current is given by:
SC_DET must be connected to OUT through the select-
ed R
SC
when not using R
SENSE
.
R
SENSE
Mode
When operating with R
SENSE
, calculate the circuit-
breaker threshold using the worst possible operating
conditions, and add a 20% overcurrent margin to the
maximum circuit current. For example, with a maximum
expected current of 2A, using a 20% margin, the cur-
rent for calculation is (2A) x (1.2) = 2.4A. The resulting
minimum circuit-breaker threshold is then a product of
this current and R
SENSE
= 0.06, or (0.06) x (2.4A) =
0.144V. Using this method to choose a false circuit-
breaker threshold allows the circuit to operate under
worst-case conditions without causing a circuit-breaker
fault, but the circuit-breaker function will still detect a
short-circuit or a gross overcurrent condition.
To determine the proper circuit-breaker resistor value,
use the following equation, which refers to Figure 13:
where, I
TRIPSLOW
is the desired slow-comparator trip
current.
The fast-comparator trip current is determined by the
selected R
CB
value and cannot be adjusted indepen-
dently. The fast-comparator trip current is given by:
SC_DET should be connected to V
CC
when using
R
SENSE
.
I
IxR R V
R
TRIPFAST
CB
CBF
CB
CB OS
SENSE
=
+
()
±
,
R
IxRV
I
CB
TRIPSLOW SENSE
CB
OS
CB
=
()
+
,
I
IxR R V
R
TRIPFAST
CB
CBF
CB
CB OS
DS ON
T
=
+
()
±
,
()
()
R
IxR V
I
CB
TRIPSLOW DS ON
T
CB OS
CB
=
()
+
()
()
,
TC
SELECT
I
CB
MAX5925
MAX5926
SENSE
GATE
V
S
R
CB
I
LOAD
R
CBF
R
SENSE
V
OUT
OUT
CB
SLOW
COMPARATOR
V
CB,TH
V
CB,OS
FAST
COMPARATOR
V
CBF,TH
V
CB,OS
Figure 13. Circuit Breaker Using R
SENSE
TC
SELECT
SLOW
COMPARATOR
V
CB,TH
I
CB
MAX5925
MAX5926
CB
SENSE
GATE
V
S
R
CB
I
LOAD
R
CBF
R
DS(ON)
V
CB,OS
V
OUT
OUT
FAST
COMPARATOR
V
CBF,TH
V
CB,OS
Figure 12. Circuit Breaker Using R
DS(ON)
MAX5924/MAX5925/MAX5926
1V to 13.2V, n-Channel Hot-Swap Controllers
Require No Sense Resistor
______________________________________________________________________________________ 17
Circuit-Breaker Temperature Coefficient
In applications where the external MOSFET’s on-resis-
tance is used as a sense resistor to determine overcur-
rent conditions, a 3300ppm/°C temperature coefficient
is desirable to compensate for the R
DS(ON)
tempera-
ture coefficient. Use the MAX5926’s TC input to select
the circuit-breaker programming current’s temperature
coefficient, TC
ICB
(see Table 2). The MAX5924 temper-
ature coefficient is preset to 0ppm/°C, and the
MAX5925’s is preset to 3300ppm/°C.
Setting TC
ICB
to 3300ppm/°C allows the circuit-breaker
threshold to track and compensate for the increase in the
MOSFET’s R
DS(ON)
with increasing temperature. Most
MOSFETs have a temperature coefficient within a
3000ppm/°C to 7000ppm/°C range. Refer to the MOSFET
data sheet for a device-specific temperature coefficent.
R
DS(ON)
and I
CB
are temperature dependent, and can
therefore be expressed as functions of temperature. At
a given temperature, the MAX5925/MAX5926 indicate
an overcurrent condition when:
I
TRIPSLOW
x R
DS(ON)
(T) I
CB
(T) x R
CB
+ |V
CB,
OS
|
where V
CB,OS
is the worst-case offset voltage. Figure 14
graphically portrays operating conditions for a MOSFET
with a 4500ppm/°C temperature coefficient.
Applications Information
Component Selection
n-Channel MOSFET
Most circuit component values may be calculated with
the aid of the MAX5924–MAX5926. The "Design calcula-
tor for choosing component values" software can be
downloaded from the MAX5924–MAX5926 Quickview on
the Maxim website.
Select the external n-channel MOSFET according to the
application’s current and voltage level. Table 3 lists some
recommended components. Choose the MOSFET’s
on-resistance, R
DS(ON)
, low enough to have a minimum
voltage drop at full load to limit the MOSFET power dis-
sipation. High R
DS(ON)
can cause undesired power
loss and output ripple if the board has pulsing loads or
triggers an external undervoltage reset monitor at full
load. Determine the device power-rating requirement to
accommodate a short circuit on the board at startup
with the device configured in autoretry mode
.
Using the MAX5924/MAX5925/MAX5926 in latched mode
allows the consideration of MOSFETs with higher R
DS(ON)
and lower power ratings. A MOSFET can typically with-
stand single-shot pulses with higher dissipation than the
specified package rating. Low MOSFET gate capaci-
tance is not necessary since the inrush current limiting is
achieved by limiting the gate dv/dt. Table 4 lists some
recommended manufacturers and components.
Be sure to select a MOSFET with an appropriate gate
drive (see the
Typical Operating Characteristics
).
Typically, for V
CC
less than 3V, select a 2.5V V
GS
MOSFET.
Table 2. Programming the Temperature
Coefficient (MAX5926)
TC TC
ICB
(ppm/°C)
High 0
Low 3300
Table 3. Suggested External MOSFETs
APPLICATION
CURRENT (A)
PART DESCRIPTION
1
International Rectifier
IRF7401
SO-8
2 Siliconix Si4378DY SO-8
5 Siliconix SUD40N02-06 DPAK
10 Siliconix SUB85N02-03 D2PAK
TEMPERATURE (°C)
V
CB
AND V
SENSE
(mV)
85603510-15
25
30
35
40
45
50
20
-40 110
V
S
= V
CC
= 13.2V, R
CB
= 672Ω, I
TRIPSLOW
= 5A,
R
DS(ON)
(25) = 6.5m
CIRCUIT-BREAKER TRIP REGION
(V
SENSE
V
CB
)
V
CB
= I
CB
(T) x R
CB
+ V
CB,OS
(3300ppm/°C)
V
SENSE
= R
DS(ON)
(T) x I
LOAD(MAX)
(4500ppm/°C)
Figure 14. Circuit-Breaker Trip Point and Current-Sense
Voltage vs. Temperature
MAX5924/MAX5925/MAX5926
1V to 13.2V, n-Channel Hot-Swap Controllers
Require No Sense Resistor
18 ______________________________________________________________________________________
Optional Sense Resistor
Select the sense resistor in conjunction with R
CB
to set
the slow and fast circuit-breaker thresholds (see the
Selecting a Circuit-Breaker Threshold
section). The
sense-resistor power dissipation depends on the device
configuration. If latched mode is selected, P
RSENSE
=
(I
OVERLOAD
)
2
x R
SENSE
; if autoretry is selected, then
P
RSENSE
= (I
OVERLOAD
)
2
x R
SENSE
x (t
ON
/t
RETRY
).
Choose a sense-resistor power rating of twice the
P
RSENSE
for long-term reliable operation. In addition,
ensure that the sense resistor has an adequate I
2
T rating
to survive instantaneous short-circuit conditions.
No-Load Operation
The internal circuitry is capable of sourcing a current at
the OUT terminal of up to 120µA from a voltage V
IN
+
V
GS
. If there is no load on the circuit, the output capacitor
will charge to a voltage above V
IN
until the external MOS-
FET’s body diode conducts to clamp the capacitor volt-
age at VIN plus the body-diode V
F
. When testing or
operating with no load, it is therefore recommended that
the output capacitor be paralleled with a resistor of value:
R = V
X
/ 120µA
where V
X
is the maximum acceptable output voltage
prior to hot-swap completion.
Design Procedure
Given:
V
CC
= V
S
= 5V
C
L
= 150µF
Full-Load Current = 5A
No R
SENSE
I
INRUSH
= 500mA
Procedures:
1) Calculate the required slew rate and corresponding
C
SLEW
:
2) Select a MOSFET and determine the worst-case
power dissipation.
3) Minimize power dissipation at full load current and
at high temperature by selecting a MOSFET with an
appropriate R
DS(ON)
. Assume a 20°C temperature
difference between the MAX5924/MAX5925/
MAX5926 and the MOSFET.
For example, at room temperature the IRF7822’s
R
DS(ON)
= 6.5m. The temperature coefficient for
this device is 4000ppm/°C. The maximum R
DS(ON)
for the MOSFET at T
J(MOSFET)
= +105°C is:
The power dissipation in the MOSFET at full load is:
4) Select R
CB
.
Since the MOSFET’s temperature coefficient is
4000ppm/°C, which is greater than TC
ICB
(3300ppm/°C), calculate the circuit-breaker thresh-
old at high temperature so the circuit breaker is
guaranteed not to trip at lower temperature during
normal operation (Figure 15).
I
TRIPSLOW
= I
FULL LOAD
+ 20% = 5A + 20% = 6A
R
DS(ON)105
= 8.58m (max), from step 2
I
CB85
= 58µA x (1 + (3300ppm/°C x (85 - 25)°C)
= 69.5µA (min)
R
CB
= ((6A x 8.58m) + 4.7mV)/69.5µA = 808
R
IxR V
I
CB
TRIPSLOW
DS ON CB OS
CB
=
()
+
() ,105
85
PIR A m mW
D
== × =
22
5 8 58 215() .
RmCC
ppm
C
m
DS ON()
. ( )
.
105
6 5 1 105 25 4000
858
+°°×
°
=Ω
C
SR
F
SLEW
V
ms
=
×
=
×
=
−−
330 10 330 10
33
01
99
.
. µ
SR
I
C
V
ms
INRUSH
L
=
×
=
1000
33
.
Table 4. Component Manufacturers
COMPONENT MANUFACTURER PHONE WEBSITE
Dale-Vishay 402-564-3131 www.vishay.com
Sense Resistors
IRC 828-264-8861 www.irctt.com
Fairchild 888-522-5372 www.fairchildsemi.com
MOSFETs
International Rectifier 310-233-3331 www.irf.com

MAX5924BEUB+

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller
Lifecycle:
New from this manufacturer.
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