BelaSigna 300
www.onsemi.com
27
PACKAGE DIMENSIONS
WLCSP35, 3.63x2.68
CASE 567AG
ISSUE B
SEATING
PLANE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
2X
DIM
A
MIN MAX
0.84
MILLIMETERS
A1
D 3.63 BSC
E
b 0.24 0.29
eD 0.25 BSC
1.00
D
E
A
B
PIN A1
REFERENCE
eD
A0.05 BC
0.03
C
0.05 C
35X
b
456
C
B
A
0.10 C
A
A1
A2
C
0.17 0.23
2.68 BSC
eE 0.433 BSC
0.25
35X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.250
0.10 C
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 3
eE
A2 0.72 REF
RECOMMENDED
A1
PACKAGE
OUTLINE
123789
PITCH
C 0.125 BSC
E
D
1011121314
C
0.433
PITCH
0.125
B300/D
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