17
AT91R40807
1345DS–ATARM–02/02
Soldering Profile Table 8 gives the recommended soldering profile from J-STD-20.
Small packages may be subject to higher temperatures if they are reflowed in boards
with larger components. In this case, small packages may have to withstand tempera-
turesofupto235°C, not 220°C (IR reflow).
Recommended package reflow conditions depend on package thickness and volume.
See Table 9.
When certain small thin packages are used on boards without larger packages, these
small packages may be classified at 220°C instead of 235°C.
Notes: 1. The packages are qualified by Atmel by using IR reflow conditions, not convection or
VPR.
2. By default, the package level 1 is qualified at 220°C (unless 235°C is stipulated).
3. The body temperature is the most important parameter but other profile parameters
such as total exposure time to hot temperature or heating rate may also influence
component reliability.
A maximum of three reflow passes is allowed per component.
Table 8. Soldering Profile
Convection or
IR/Convection VPR
Average Ramp-up Rate (183°C to Peak) 3°C/sec. max. 10° C/sec.
Preheat Temperature 125°C±25°C 120 sec. max
Temperature Maintained Above 183°C 60sec.to150sec.
Time within 5°C of Actual Peak
Temperature
10 sec. to 20 sec. 60 sec.
Peak Temperature Range 220 +5/-0°Cor
235 +5/-0°C
215 to 219°Cor
235 +5/-0°C
Ramp-down Rate 6°C/sec. 10°C/sec.
Time 25°C to Peak Temperature 6 min. max
Table 9. Recommended Package Reflow Conditions
(1, 2, 3)
Parameter Temperature
Convection 235 +5/-0°C
VPR 235 +5/-0°C
IR/Convection 235 +5/-0°C
