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SC16C850IBS,128

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48P49-P51P52-P54P55-P55
SC16C850 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 2 — 11 November 2010 46 of 55
NXP Semiconductors
SC16C850
2.5 to 3.3 V UART with 128-byte FIFOs and IrDA encoder/decoder
Fig 21. Infrared transmit timing
Fig 22. Infrared receive timing
01010011 10
UART frame
TX data
1
/
2
bit time
002aaa21
2
data bitsstart stop
bit
time
IrDA TX data
3
/
16
bit time
01010011 10
UART frame
RX data
IrDA RX data
bit
time
002aaa21
3
start data bits stop
0 to 1 16× clock delay
SC16C850 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 2 — 11 November 2010 47 of 55
NXP Semiconductors
SC16C850
2.5 to 3.3 V UART with 128-byte FIFOs and IrDA encoder/decoder
11. Package outline
Fig 23. Package outline SOT617-1 (HVQFN32)
0.51
A
1
E
h
b
UNIT
ye
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
5.1
4.9
D
h
3.25
2.95
y
1
5.1
4.9
3.25
2.95
e
1
3.5
e
2
3.5
0.30
0.18
0.05
0.00
0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT617-1 MO-220- - - - - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT617
-1
H
VQFN32: plastic thermal enhanced very thin quad flat package; no leads;
3
2 terminals; body 5 x 5 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
916
32
25
24
17
8
1
X
D
E
C
B
A
e
2
terminal 1
index area
terminal 1
index area
01-08-08
02-10-18
1/2 e
1/2 e
AC
C
B
v
M
w
M
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)
SC16C850 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 2 — 11 November 2010 48 of 55
NXP Semiconductors
SC16C850
2.5 to 3.3 V UART with 128-byte FIFOs and IrDA encoder/decoder
Fig 24. Package outline SOT912-1 (TFBGA36)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT912-1
SOT912-
1
05-08-09
05-09-01
UNIT
A
max
mm 1.15
0.25
0.15
0.90
0.75
0.35
0.25
3.6
3.4
3.6
3.4
A
1
DIMENSIONS (mm are the original dimensions)
T
FBGA36: plastic thin fine-pitch ball grid array package; 36 balls; body 3.5 x 3.5 x 0.8 mm
0 2.5 5 mm
scale
A
2
b D E e
2
2.5
e
0.5
e
1
2.5
y
1
0.1
v
0.15
w
0.05
y
0.08
- - - - - -- - -
b
e
2
e
1
e
e
1/2 e
1/2 e
AC
B
v
M
Cw
M
ball A1
index area
A
B
C
D
E
F
246135
ball A1
index area
B A
E
D
C
y
C
y
1
X
detail X
A
1
A
2
A
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48P49-P51P52-P54P55-P55

SC16C850IBS,128

Mfr. #:
Buy SC16C850IBS,128
Manufacturer:
NXP Semiconductors
Description:
IC UART SGL W/FIFO 32HVQFN
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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