DS3234
Extremely Accurate SPI Bus RTC with
Integrated Crystal and SRAM
____________________________________________________________________ 19
Data transfers can occur one byte at a time or in multi-
ple-byte burst mode. After CS is driven low, an address
is written to the DS3234. After the address, one or more
data bytes can be written or read. For a single-byte
transfer, one byte is read or written and then CS is dri-
ven high. For a multiple-byte transfer, however, multiple
bytes can be read or written after the address has been
written (Figure 5). Each read or write cycle causes the
RTC register address to automatically increment, which
continues until the device is disabled. The address
wraps to 00h after incrementing to 13h (during a read)
and wraps to 80h after incrementing to 93h (during a
write). An updated copy of the time is loaded into the
user buffers upon the falling edge of CS and each time
the address pointer increments from 13h to 00h.
Because the internal and user copies of the time are
only synchronized on these two events, an alarm condi-
tion can occur internally and activate the INT/SQW pin
independently of the user data.
If the SRAM is accessed by reading (address 19h) or
writing (address 99h) the SRAM data register, the con-
tents of the SRAM address register are automatically
incremented after the first access, and all data cycles
will use the SRAM data register.
Handling, PC Board Layout,
and Assembly
The DS3234 package contains a quartz tuning-fork
crystal. Pick-and-place equipment can be used, but
precautions should be taken to ensure that excessive
shock and vibration are avoided. Exposure to reflow is
limited to 2 times maximum. Ultrasonic cleaning should
be avoided to prevent damage to the crystal.
Avoid running signal traces under the package, unless
a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connect-
ed to ground.
CS
SCLK
DIN
DOUT
HIGH IMPEDANCE
ADDRESS
BYTE
ADDRESS
BYTE
DATA BYTE 0 DATA BYTE 1
DIN
DATA BYTE N
DATA
BYTE 0
DATA
BYTE 1
DATA
BYTE N
WRITE
READ
Figure 5. SPI Multiple-Byte Burst Transfer
DS3234
Extremely Accurate SPI Bus RTC with
Integrated Crystal and SRAM
20 ____________________________________________________________________
Chip Information
SUBSTRATE CONNECTED TO GROUND
PROCESS: CMOS
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages
. Note that a “+”, “#”, or “-” in
the package code indicates RoHS status only. Package draw-
ings may show a different suffix character, but the drawing per-
tains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
20 SO W20#H2
21-0042 90-0108
DS3234
Extremely Accurate SPI Bus RTC with
Integrated Crystal and SRAM
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________
21
© 2010 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.
is a registered trademark of Maxim Integrated Products, Inc.
Revision History
REVISION
NUMBER
REVISION
DATE
DESCRIPTION
PAGES
CHANGED
0 2/06 Initial release
Clarified the behavior of t
REC
on initial power-up in the RST description of the Pin
Description
8
1 7/07
Corrected the POR for the BB32kHz bit from 0 to 1 15
Updated the Typical Operating Circuit 1
Removed the V
PU
parameter from the Recommended DC Operating Conditions
table and added verbiage about the pullup to the Pin Description table for
INT/SQW
2, 8
In the Electrical Characteristics table, added CRATE1 = CRATE0 = 0 to the I
BATT
parameter and changed the symbols for Timekeeping Battery Current,
Temperature Conversion Current, and Data-Retention Current from I
BAT
, I
TC
, and
I
BATTC
to I
BATT
, I
BATTC
, and I
BATTDR
, respectively
3
In the AC Electrical Characteristics, changed the t
CWH
specification from 400ns
(max) to 400ns (min)
4
Added the Delta Time and Frequency vs. Temperature graph in the Typical
Operating Characteristics section
7
Updated the Block Diagram 9
Added the V
BAT
Operation section, improved some sections of text for the
Pushbutton Reset Function, Aging Offset Register (10h/90h), and Temperature
Registers (11h–12h) sections
10, 16
2 10/08
Corrected the description of when the countdown chain is reset in the Clock and
Calendar section
11
3 7/10
In the Absolute Maximum Ratings section, added the theta-JA and theta-JC
thermal resistances and Note 1, and changed the soldering temperature to
+260°C; changed the 10-hour bit to 20-hour bit in the Clock and Calendar section
and Table 1; updated the BBSQW bit description in the Control Register
(0Eh/8Eh) section; added the land pattern no. to the Package Information table
2–5, 8, 11, 12,
14, 20

DS3234S#

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Real Time Clock Integrated RTC/TCXO/Crystal
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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