Philips Semiconductors Product specification
SC26C92
Dual universal asynchronous receiver/transmitter (DUART)
2000 Jan 31
4
BLOCK DIAGRAM
8
D0–D7
RDN
WRN
CEN
A0–A3
RESET
INTRN
X1/CLK
X2
4
BUS BUFFER
OPERATION CONTROL
ADDRESS
DECODE
R/W CONTROL
INTERRUPT CONTROL
IMR
ISR
TIMING
BAUD RATE
GENERATOR
CLOCK
SELECTORS
COUNTER/
TIMER
XTAL OSC
CSRA
CSRB
ACR
CTPL
CHANNEL A
8 BYTE TRANSMIT
FIFO
TRANSMIT
SHIFT REGISTER
8 BYTE RECEIVE
FIFO
MRA0, 1, 2
CRA
SRA
INPUT PORT
CHANGE OF
STATE
DETECTORS (4)
OUTPUT PORT
FUNCTION
SELECT LOGIC
OPCR
TxDA
RxDA
IP0-IP6
OP0-OP7
V
CC
V
SS
CONTROL
TIMING
INTERNAL DATABUS
CHANNEL B
(AS ABOVE)
IPCR
ACR
OPR
CTPL
U
RxDB
TxDB
8
7
WATCH DOG TIMER
RECEIVE SHIFT
REGISTER
SD00153
Figure 2. Block Diagram
Philips Semiconductors Product specification
SC26C92
Dual universal asynchronous receiver/transmitter (DUART)
2000 Jan 31
5
PIN DESCRIPTION
SYMBOL
PKG
PIN
NAME AND FUNCTION
SYMBOL
40,44
TYPE
NAME
AND
FUNCTION
D0-D7 X I/O Data Bus: Bidirectional 3-State data bus used to transfer commands, data and status between the DUART
and the CPU. D0 is the least significant bit.
CEN X I Chip Enable: Active-Low input signal. When Low, data transfers between the CPU and the DUART are
enabled on D0-D7 as controlled by the WRN, RDN and A0-A3 inputs. When High, places the D0-D7 lines
in the 3-State condition.
WRN X I Write Strobe: When Low and CEN is also Low, the contents of the data bus is loaded into the addressed
register. The transfer occurs on the rising edge of the signal.
RDN X I Read Strobe: When Low and CEN is also Low, causes the contents of the addressed register to be
presented on the data bus. The read cycle begins on the falling edge of RDN.
A0-A3 X I Address Inputs: Select the DUART internal registers and ports for read/write operations.
RESET X I Reset: A High level clears internal registers (SRA, SRB, IMR, ISR, OPR, OPCR), puts OP0-OP7 in the
High state, stops the counter/timer, and puts Channels A and B in the inactive state, with the TxDA and
TxDB outputs in the mark (High) state. Sets MR pointer to MR1 and resets MR0.
INTRN X O Interrupt Request: Active-Low, open-drain, output which signals the CPU that one or more of the eight
maskable interrupting conditions are true. Requires a pullup resistor.
X1/CLK X I Crystal 1: Crystal connection or an external clock input. A crystal of a clock the appropriate frequency
(nominally 3.6864 MHz) must be supplied at all times. For crystal connections see Figure 7, Clock Timing.
X2 X I Crystal 2: Crystal connection. See Figure 7. If a crystal is not used this pin must be left open or not driving
more than one TTL equivalent load.
RxDA X I Channel A Receiver Serial Data Input: The least significant bit is received first. “Mark” is High, “space” is Low.
RxDB X I Channel B Receiver Serial Data Input: The least significant bit is received first. “Mark” is High, “space” is Low.
TxDA X O Channel A Transmitter Serial Data Output: The least significant bit is transmitted first. This output is held
in the “mark” condition when the transmitter is disabled, idle or when operating in local loopback mode.
“Mark” is High, “space” is Low.
TxDB X O Channel B Transmitter Serial Data Output: The least significant bit is transmitted first. This output is
held in the ‘mark’ condition when the transmitter is disabled, idle, or when operating in local loopback mode.
‘Mark’ is High, ‘space’ is Low.
OP0 X O Output 0: General purpose output or Channel A request to send (RTSAN, active-Low). Can be
deactivated automatically on receive or transmit.
OP1 X O Output 1: General purpose output or Channel B request to send (RTSBN, active-Low). Can be
deactivated automatically on receive or transmit.
OP2 X O Output 2: General purpose output, or Channel A transmitter 1X or 16X clock output, or Channel A receiver
1X clock output.
OP3 X O Output 3: General purpose output or open-drain, active-Low counter/timer output or Channel B transmitter
1X clock output, or Channel B receiver 1X clock output.
OP4 X O Output 4: General purpose output or Channel A open-drain, active-Low, RxA interrupt ISR[1] output.
OP5 X O Output 5: General purpose output or Channel B open-drain, active-Low, RxB interrupt ISR[5] output.
OP6 X O Output 6: General purpose output or Channel A open-drain, active-Low, TxA interrupt ISR[0] output.
OP7 X O Output 7: General purpose output, or Channel B open-drain, active-Low, TxB interrupt ISR[4] output.
IP0 X I Input 0: General purpose input or Channel A clear to send active-Low input (CTSAN). Pin has an internal
V
CC
pull-up device supplying 1 to 4 mA of current.
IP1 X I Input 1: General purpose input or Channel B clear to send active-Low input (CTSBN). Pin has an internal
V
CC
pull-up device supplying 1 to 4 mA of current.
IP2 X I Input 2: General purpose input or counter/timer external clock input. Pin has an internal V
CC
pull-up device
supplying 1 to 4 mA of current.
IP3 X I Input 3: General purpose input or Channel A transmitter external clock input (TxCA). When the external
clock is used by the transmitter, the transmitted data is clocked on the falling edge of the clock. Pin has an
internal V
CC
pull-up device supplying 1 to 4 mA of current.
IP4 X I Input 4: General purpose input or Channel A receiver external clock input (RxCA). When the external
clock is used by the receiver, the received data is sampled on the rising edge of the clock. Pin has an
internal V
CC
pull-up device supplying 1 to 4 mA of current.
IP5 X I Input 5: General purpose input or Channel B transmitter external clock input (TxCB). When the external
clock is used by the transmitter, the transmitted data is clocked on the falling edge of the clock. Pin has an
internal V
CC
pull-up device supplying 1 to 4 mA of current.
IP6 X I Input 6: General purpose input or Channel B receiver external clock input (RxCB). When the external
clock is used by the receiver, the received data is sampled on the rising edge of the clock. Pin has an
internal V
CC
pull-up device supplying 1 to 4 mA of current.
V
CC
X I Power Supply: +5V supply input.
GND X I Ground
Philips Semiconductors Product specification
SC26C92
Dual universal asynchronous receiver/transmitter (DUART)
2000 Jan 31
6
ABSOLUTE MAXIMUM RATINGS
1
SYMBOL
PARAMETER RATING UNIT
T
A
Operating ambient temperature range
2
Note 4 °C
T
STG
Storage temperature range -65 to +150 °C
V
CC
Voltage from V
CC
to GND
3
-0.5 to +7.0 V
V
S
Voltage from any pin to GND
3
-0.5 to V
CC
+0.5 V
P
D
Package power dissipation (DIP40) 2.8 W
P
D
Package power dissipation (PLCC44) 2.4 W
P
D
Package power dissipation (PQFP44) 1.78 W
Derating factor above 25_C (PDIP40)
22
mW/_C
Derating factor above 25_C (PLCC44)
19
mW/_C
Derating factor above 25_C (PQFP44)
14
mW/_C
NOTES:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other condition above those indicated in the operation section of this specification is not
implied.
2. For operating at elevated temperatures, the device must be derated based on +150°C maximum junction temperature.
3. This product includes circuitry specifically designed for the protection of its internal devices from damaging effects of excessive static
charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying any voltages larger than the rated maxima.
4. Parameters are valid over specified temperature range.
DC ELECTRICAL CHARACTERISTICS
1,
2
V
CC
= 5V ± 10%, T
A
= –40_C to 85_C, unless otherwise specified.
LIMITS
SYMBOL PARAMETER TEST CONDITIONS Min Typ Max UNIT
V
IL
Input low voltage 0.8 V
V
IH
Input high voltage (except X1/CLK) –40 to +85°C 2.5 V
V
IH
Input high voltage (X1/CLK) 0.8 V
CC
V
V
OL
V
OH
Output low voltage
Output high voltage (except OD outputs)
3
I
OL
= 2.4mA
I
OH
= -400µA
V
CC
-0.5
0.4 V
V
I
IX1PD
I
ILX1
I
IHX1
X1/CLK input current - power down
X1/CLK input low current - operating
X1/CLK input high current - operating
V
IN
= 0 to V
CC
V
IN
= 0
V
IN
= V
CC
-0.5
-130
+0.5
130
µA
µA
µA
I
I
Input leakage current:
All except input port pins
Input port pins
V
IN
= 0 to V
CC
V
IN
= 0 to V
CC
-0.5
-8
+0.5
+0.5
µA
µA
I
OZH
I
OZL
Output off current high, 3-State data bus
Output off current low, 3-State data bus
V
IN
= V
CC
V
IN
= 0V –0.5
0.5 µA
µA
I
ODL
I
ODH
Open-drain output low current in off-state
Open-drain output high current in off-state
V
IN
= 0
V
IN
= V
CC
–0.5
0.5
µA
µA
I
CC
Power supply current
4
Operating mode
Power down mode
5
CMOS input levels
CMOS input levels
5
2
10
15
mA
mA
NOTES:
1. Parameters are valid over specified temperature range.
2. Typical values are at +25°C, typical supply voltages, and typical processing parameters.
3. Test conditions for outputs: C
L
= 150pF, except interrupt outputs. Test conditions for interrupt outputs: C
L
= 50pF, R
L
= 2.7K to V
CC
.
4. All outputs are disconnected. Inputs are switching between CMOS levels of V
CC
-0.2V and V
SS
+ 0.2V.
5. See UART application note for power down currents of 5µA or less.

SC26C92C1A,512

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
UART Interface IC UART DUAL W/FIFO
Lifecycle:
New from this manufacturer.
Delivery:
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