AD7376
Rev. D | Page 7 of 20
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 5.
Parameter Rating
V
DD
to GND −0.3 V to +35 V
V
SS
to GND +0.3 V to −16.5 V
V
DD
to V
SS
−0.3 V to +35 V
V
A
, V
B
, V
W
to GND V
SS
to V
DD
Maximum Current
I
WB
, I
WA
Pulsed ±20 mA
WB
WB
V
DD
/V
SS
= 30 V/0 V)
1
I
WA
Continuous (R
WA
≤ 6 kΩ, B open,
V
DD
/V
SS
= 30 V/0 V)
1
±5 mA
Digital Input and Output Voltages to GND 0 V to V
DD
+ 0.3 V
Operating Temperature Range −40°C to +85°C
Maximum Junction Temperature (T
JMAX
2
Storage Temperature Range −65°C to +150°C
Reflow Soldering
Peak Temperature 260°C
Time at Peak Temperature 20 sec to 40 sec
Package Power Dissipation
JMAX
A
JA
Thermal Resistance θ
JA
16-Lead SOIC_W 120°C/W
14-Lead TSSOP 240°C/W
1
Maximum terminal current is bound by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
2
Package power dissipation = (T
JMAX
– T
A
)/θ
JA
.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
