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0334G–FLASH–2/05
AT29LV040A
26. Ordering Information
26.1 Standard Package
t
ACC
(ns)
I
CC
(mA)
Ordering Code Package Operation RangeActive Standby
150
15 0.04
AT29LV040A-15JC
AT29LV040A-15TC
32J
32T
Commercial
(0° to 70°C)
15 0.05
AT29LV040A-15JI
AT29LV040A-15TI
32J
32T
Industrial
(-40° to 85°C)
200
15 0.04
AT29LV040A-20JC
AT29LV040A-20TC
32J
32T
Commercial
(0° to 70°C)
15 0.05
AT29LV040A-20JI
AT29LV040A-20TI
32J
32T
Industrial
(-40° to 85°C)
250
15 0.04
AT29LV040A-25JC
AT29LV040A-25TC
32J
32T
Commercial
(0° to 70°C)
15 0.05
AT29LV040A-25JI
AT29LV040A-25TI
32J
32T
Industrial
(-40° to 85°C)
Note:
Not recommended for New Designs.
26.2 Green Package Option (Pb/Halide-free)
t
ACC
(ns)
I
CC
(mA)
Ordering Code Package Operation RangeActive Standby
150 15 0.05
AT29LV040A-15JU
AT29LV040A-15TU
32J
32T
Industrial
(-40° to 85°C)
Package Type
32J 32-lead, Plastic J-leaded Chip Carrier (PLCC)
32T 32-lead, Thin Small Outline Package (TSOP)
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0334G–FLASH–2/05
AT29LV040A
27. Packaging Information
27.1 32J – PLCC
DRAWING NO.
REV.
2325 Orchard Parkway
San Jose, CA 95131
R
TITLE
32J, 32-lead, Plastic J-leaded Chip Carrier (PLCC)
B
32J
10/04/01
1.14(0.045) X 45˚
PIN NO. 1
IDENTIFIER
1.14(0.045) X 45˚
0.51(0.020)MAX
0.318(0.0125)
0.191(0.0075)
A2
45˚ MAX (3X)
A
A1
B1
E2
B
e
E1 E
D1
D
D2
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This package conforms to JEDEC reference MS-016, Variation AE.
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.102 mm) maximum.
A 3.175 3.556
A1 1.524 2.413
A2 0.381
D 12.319 12.573
D1 11.354 11.506 Note 2
D2 9.906 10.922
E 14.859 15.113
E1 13.894 14.046 Note 2
E2 12.471 13.487
B 0.660 0.813
B1 0.330 0.533
e 1.270 TYP
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0334G–FLASH–2/05
AT29LV040A
27.2 32T – TSOP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
32T, 32-lead (8 x 20 mm Package) Plastic Thin Small Outline
Package, Type I (TSOP)
B
32T
10/18/01
PIN 1
D1
D
Pin 1 Identifier
b
e
E
A
A1
A2
0º ~ 8º
c
L
GAGE PLANE
SEATING PLANE
L1
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This package conforms to JEDEC reference MO-142, Variation BD.
2. Dimensions D1 and E do not include mold protrusion. Allowable
protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side.
3. Lead coplanarity is 0.10 mm maximum.
A 1.20
A1 0.05 0.15
A2 0.95 1.00 1.05
D 19.80 20.00 20.20
D1 18.30 18.40 18.50 Note 2
E 7.90 8.00 8.10 Note 2
L 0.50 0.60 0.70
L1 0.25 BASIC
b 0.17 0.22 0.27
c 0.10 0.21
e 0.50 BASIC

AT29LV040A-15TC

Mfr. #:
Manufacturer:
Microchip Technology / Atmel
Description:
NOR Flash 4M (512kx8)
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union